• 한국안전학회지
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• 제11권1호
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• pp.67-74
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• 1996

In order to investigate the effect and reliability coming up to properties of the matter due to the change of solid structure in dielectrics, the effect of dielectric characteristics for thermal treated LDPE film was made researches. Specimens of LDPE with thickness 100 [$\mu\textrm{m}$] were investigated into the change of solid structure by ageing. Thermal treated specimen were made, that were after applying heat at 100 [$^{\circ}C$] for 1 [hour] \circled1 air-cooled specimen slowly, \circled2 water-cooled specimen under the ,com temperature, \circled3 liquid nitrogen gas-cooled specimen rapidly. With specimen of thermal treated three types turn out and original, it was for dielectric characteristics to be experimented in the temperature range of 20~120 [$^{\circ}C$], frequency range of 30~1.5${\times}10^5/$[Hz], appling voltage from 300 to 1500[㎷]. Consequently, the degree of crystallinity was changed with 49~57 [%] according to the thermal treatment. In case of frequency, 100 [Hz], on the thermal dependance in dielectric characteristics, tan decreases due to cooling method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집 디스플레이 광소자 분야
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• pp.177-180
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• 2005

We have investigated electro-optical characteristics in three kinds of TN cells on the polyimide surface. Transmittance of no thermal stressed TN cells were better than that of thermal stressed TN cells. Also. the threshold voltage and the response time of thermal stressed TN cells were same that of no thermal stressed TN cells. There were little change of value in these TN cells. On the other hand. transmittances of TN cells on the polyimide surface decreased by increasing thermal stress time. Moreover. the residual DC of the thermal stressed TN cells on the polyimide surface showed the characteristics of thermal stressed TN cells were weakened as increasing thermal stress temperature and time. Therefore. thermal stability of TN cells were decreased gradually by giving high thermal stress for a long time.

• 한국산학기술학회논문지
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• 제12권3호
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• pp.1039-1044
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• 2011

마그네트론은 마이크로파를 발진하기 위한 부품으로써 전자레인지 등에 사용되는 부품이다. 이러한 마그네트론은 열이 많이 발생하며, 따라서 열특성을 고려한 방열 설계가 반드시 수반되어야 한다. 본 연구에서는 마그네트론을 구성하는 부품에 대하여 열전달 해석을 수행하여 마그네트론의 열특성을 파악하였다. 이를 위하여 상용 소프트웨어인 ANSYS를 이용하여 전도 및 대류를 고려한 열전달 해석을 수행하였다. 마그네트론 부품을 하나씩 추가하면서 해석을 수행하였고 각각의 해석 결과를 실험 결과와 비교하였다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권2호
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• pp.76-82
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• 2005

In this paper, a method for analyzing the thermal recovery characteristics of the nozzle of gas circuit breaker was described. In order to obtain thermal recovery characteristics, the transient simulation of SF6 arc plasma within the nozzle was carried out. In particular, the nozzle ablation was taken into account by simultaneously solving the PTFE concentration equation with the governing equations such as continuity, momentum and energy equation. After that, post arc current calculation was performed with the rate of rise of recovery voltage changed. From the calculated post arc current, it was possible to suggest the thermal recovery characteristics of the nozzle of gas circuit breaker.

• 전기학회논문지
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• 제56권12호
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• pp.2202-2207
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• 2007

The present article investigates experimentally and theoretically thermal and optical characteristics of thin film structures through measurement of thermal conductivity of Pyrex 7740 and reflectance in silicon thin film. The $3{\omega}$ method is used to measure thermal conductivity of very thin film with high accuracy and the optical characteristics in thin films are studied to examine the influence of incidence angle of light on reflectance by using the CTM(Characteristics Transmission Method) and the 633 nm He-Ne laser reflectance measurement system. It is found that the estimated reflectance of silicon show good agreement with experimental data. In particular, the present study solves the EPRT(Equation of Phonon Radiative Transport) which is based on Boltzmann transport equation for predicting thermal conductivity of nanoscale film structures. From the results, the measured thermal conductivity is in good agreement with the previous published data. Moreover, thermal conductivities are estimated for different film thickness. It indicates that as film thickness decreases, thermal conductivity decreases substantially due to internal scattering.

• 한국생산제조학회지
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• 제22권3호
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• pp.380-387
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• 2013

In this study, two finite element (FE) models were developed to evaluate the thermal characteristics of a feeding axis of a CNC lathe. One was used for analysis of heat transfer to identify the temperature distribution of the feeding axis and then, the other was used for analysis of thermal deformation to evaluate its structural behavior based on the temperature distribution. The FE models were based on the test standard for the axial thermal displacement. The feeding velocity was composed of three steps: the ascending, constant, and descending velocities. Therefore, the heat generation and convection coefficient were calculated for each velocity and applied to the thermal FE model. The convection coefficient for the ball screw rotation was based on an experimental equation. The result of the analytical thermal displacement was compared with that of the experimental displacement to verify the finite element models.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 춘계학술대회논문집
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• pp.790-793
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• 2005

Gap Sensor is widely used to measure vibration in power plant. In general the result of the vibration measurement may have special error due to two thermal characteristics of gap sensor such as sensitivity shift and zero shift. Thermal sensitivity is change of linearity and thermal zero shift is chang of offset. It is investigated two thermal characteristics for Rap son or in this paper.

• 한국전기전자재료학회논문지
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• 제14권3호
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• pp.228-233
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• 2001

This paper presents the optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro elelctro mechanical system) applications usign SOI (Si-on-insulator) and trench structures. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10㎛ thick Si membrane with oxide-filled trenches in the SOI membrane rim. The micro-heater was fabricated with Pt-RTD (resistance thermometer device) on the same substrate by suing MgO as medium layer. The thermal characteristics of the micro-heater wit the SOI membrane is 280$\^{C}$ at input power 0.9W; for the SOI membrane with 10 trenches, it is 580$\^{C}$ due to reduction of the external thermal loss. Therefore, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro-thermal sensors and actuators.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.969-974
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• 2002

Thermal characteristics according to the cooling methods are studied for the three type spindles with high frequency motor. For the analysis, three dimensional mode]s are built considering heat transfer characteristics such as natural and force convection coefficients. Unsteady-state temperature distributions and thermal deformations according to the cooling conditions are analyzed by using the finite element method.

• 전기학회논문지P
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• 제58권3호
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• pp.357-361
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• 2009

This study performed analysis on the thermal pattern and current characteristics of an LED ((Light Emitting Diode) street lamp. It did this using a TVS (Thermal Video System) to analyze the LED street lamp's thermal pattern, and measured its characteristics using an oscilloscope. The ambient temperature and humidity during the experiment were maintained at $24{\pm}2[^{\circ}C]$ and 50~60[%]. The capacity of the LED street lamp was 120[W] and nine sets of modules were arranged at uniform intervals. On one module, 24 LED lamps were arranged in a radial pattern. The analysis of the thermal diffusion pattern at the front of the LED lamp showed that the maximum surface temperature was approximately $34[^{\circ}C]$. In addition, there was almost no change in the temperature of the upper cover, and the temperature at the side showed a uniform thermal diffusion pattern. The surface temperature of the converter converting AC to DC increased to approximately $46[^{\circ}C]$. The analysis results of the thermal characteristics of one LED indicated uniform thermal characteristics for an initial eight minutes. However, the temperature at the center of the LED increased to approximately $82[^{\circ}C]$ after 12 minutes had elapsed. It can be seen from this that the temperature at the center of the LED was higher than the allowable temperature, $70[^{\circ}C]$ of the insulating material for general electrical devices. Therefore, it is necessary to design a lamp in such a way that the plastic insulating material does not come into contact with or get close to the LED lamp. The voltage of the LED lamp converted by the AC/DC converter was measured at DC 27[V] and the current was DC 13[A]. Consequently, it can be seen that in order to secure an adequate light source, it is important to supply a stable current that was greater than the current of other light sources. Therefore, appropriate radiation of heat is required to secure the stability and reliability of the system.