• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.56-64
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• 2002

Machine tools are engineered to give high dimensional accuracy in machining operation. However, errors due to thermal effects degrade dimensional accuracy of machine tools considerably, and many machine tools are equipped with thermal error compensation function. In general, thermal errors can be generated in the angular directions as well as linear directions. Among them, thermal errors in the angular directions contribute a large amount of error components in the presence of offset distance as in the case of Abbe error. Because most of thermal error compensation function is based on a good correlation between temperature change and thermal deformation, angular thermal deformation is often to be the most difficult hurdle for enhancing compensation accuracy. In this regard, this paper investigates the effect of thermal bending to total thermal error and gives how to deal with thermally induced bending effects in thermal error compensation.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.7
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• pp.1664-1673
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• 1994

As a fundamental study on effects of thermal-cycles on residual stress of ceramics/metal joints, residual stresses in $Si_3N_4$/SUS304 joint specimens were measured before and single thermal-cycle by X-ray diffraction method and finite element method(FEM). The residual stress was found to increase after single thermal-cycle, which was agreeable with the results of residual stress measurement by X-ray diffraction method and residual stress analysis by finite element method. After the residual stress measurement, 4-point bending tests were performed. The relationship between the bending strength, the thermal-cycle temperature and hold time was examined. The bending strength was found to decrease with the increase of residual stress in linear relation.

• Advances in aircraft and spacecraft science
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• v.9 no.3
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• pp.243-261
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• 2022

Broad writing on the examination of sandwich structures mirrors the significance of incorporating thermal loadings during their investigation stage. In the current work, an endeavor has been made to concentrate on sandwich FGM beams' bending behaving under thermal loadings utilizing shear deformation theory. Temperature-dependent material properties are used during the analysis. The formulation includes the transverse displacement field, which helps better predict the behavior of thick FGM beams. Three-different thermal profiles across the thickness of the beam are assumed during the analysis. The study has been carried out on both symmetric and unsymmetric sandwich FGM beams. It has been observed that the bending behavior of sandwich FGM beams is impacted by the temperature profile to which it is subjected. Power-law exponent and thickness of core also affect the behavior of the beam.

• Steel and Composite Structures
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• v.11 no.4
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• pp.341-358
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• 2011

This paper presents the effects of thermal environment and temperature-dependence of the material properties on axisymmetric bending of functionally graded (FG) circular and annular plates. The material properties are assumed to be temperature-dependent and graded in the thickness direction. In order to accurately evaluate the effect of thermal environment, the initial thermal stresses are obtained by solving the thermoelastic equilibrium equations. Governing equations and the related boundary conditions, which include the effects of initial thermal stresses, are derived using the virtual work principle based on the elasticity theory. The differential quadrature method (DQM) as an efficient and robust numerical tool is used to obtain the initial thermal stresses and response of the plate. Comparison studies with some available results for FG plates are performed. The influences of temperature rise, temperature-dependence of material properties, material graded index and different geometrical parameters are carried out.

• Journal of the Korean Wood Science and Technology
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• v.26 no.3
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• pp.9-15
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• 1998

The strength and stiffness of structures would be weakened by thermal degradation of wood members which are exposed to a variety of heat including a fire. For this reason, thermal degraded wood members can't pertinently support the load. However, it is easy to repair or rehabilitate wood structures. So, the degraded wood members which can't support the load can be replaced with new members. For the sake of this advantage, there is a need for nondestructive evaluation(NDE) technique, which is very effective to assess wood members in service. In this paper, it was considered whether the stress wave method is adequate to estimate static bending MOE of thermal degraded wood. As the result, the relationship between static bending MOE and MOEsw in elevated temperature was found out significant. Therefore, the application of stress wave method for estimating static bending MOE of thermal degraded zzwood would be possible. However, it is thought that further research for the effects of exposure temperature, time, and thermal degradation on the relationship between static bending MOEb and MOEsw would be needed.

• Journal of Applied Reliability
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• v.7 no.2
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• pp.45-55
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• 2007

In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.443-447
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• 2004

In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• Journal of the Korean Ceramic Society
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• v.37 no.3
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• pp.201-204
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• 2000

Thermal shock resistance of 80Al2O3-20Al composite and monolithic alumina ceramics was compared. Fracture strength was measured by using a 4-pont bending test after quenching. Thermal stresses of the ceramics and ceramic-metal composites were calculated using a finite element analysis. The bending strength of the Al2O3 ceramics decreased catastropically after quenching from 20$0^{\circ}C$ to $0^{\circ}C$. The bending strength of the composite also decreased after quenching from 200~2$25^{\circ}C$, but the strength reduction was much smaller than for Al2O3. The maximum thermal stress occured in the monolithic alumina ceramics when exposed to a temperature difference of 20$0^{\circ}C$ was 0.758 GPa. The same amount of stress occured in the Al2O3-Al composite when the temperature difference of 205$^{\circ}C$ used.

• Korean Journal of Metals and Materials
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• v.46 no.2
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• Advances in nano research
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• v.8 no.3
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• pp.203-214
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• 2020

This paper investigated bending of magneto-electro-elastic (MEE) nanobeams under hygro-thermal loading embedded in Winkler-Pasternak foundation based on nonlocal elasticity theory. The governing equations of nonlocal nanobeams in the framework parabolic third order beam theory are obtained using Hamilton's principle and solved implementing an analytical solution. A parametric study is presented to examine the effect of the nonlocal parameter, hygro-thermal-loadings, magneto-electro-mechanical loadings and aspect ratio on the deflection characteristics of nanobeams. It is found that boundary conditions, nonlocal parameter and beam geometrical parameters have significant effects on dimensionless deflection of nanoscale beams.