• Journal of Welding and Joining
• /
• v.16 no.2
• /
• pp.111-121
• /
• 1998

It is well recognized that a excessive temperature gradient from the junction of head to skirt in axial direction in a hot pressure vessel can cause unpredicted high thermal stress at the junction and/or in axial direction of a skirt. this thermal stress resulting from axial thermal gradient may be a major cause of unsoundness of structural integrity. In case of cyclic operation of hot pressure vessels, the thermal stress becomes one of the primary design consideration because of the possibility of fracture as a result of cyclic thermal fatigue and progressively incremental plastic deformation. To perform thermal stress analysis of the junction and cylindrical skirt of a vessel, or, at least, to inspect quantitatively the magnitude and effect of thermal stress, the temperature profile of the vessel and skirt must be known. This paper demonstrated the temperature distribution and thermal stress analysis for the junction of skirt to head using F.E. analysis. Effect of air pocket in crotch space was quantitatively investigated to minimize the temperature gradient causing the thermal stress in axial direction. Effect of the skirt height on thermal stresses was also studied. Analysis results were compared with theoretical formulas to verify th applicability to the strength calculation in design field.

• Journal of the Korean Society for Precision Engineering
• /
• v.30 no.7
• /
• pp.754-761
• /
• 2013

Thermal displacement is an important issue in machine tool systems. During the last several decades, thermal error compensation technology has significantly reduced thermal distortion error; this success has been attributed to the development of a precise, robust thermal error model. A major advantage of using the thermal error model is instant compensation for the control variables during the modeling process. However, successful application of thermal error modeling requires correct determination of the temperature sensor placement. In this paper, a procedure for predicting thermal-mode-based thermal error is introduced. Based on this thermal analysis, temperature sensors were positioned for multiple heat-source models. The performance of the sensors based on thermal-mode error analysis, was compared with conventional methods through simulation and experiments, for the case of a slide table in a transient state. Our results show that for predicting thermal error the proposed thermal model is more accurate than the conventional model.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2001.10a
• /
• pp.238-246
• /
• 2001

Residual stresses and thermal deformation of a structure due to welding are very imfortant factors for a weld design. It has been carried therretical analysis to invesitigate influence of heat flux to residual stresses and thermal deformation producted by curcumferential welding. Temperature,stresses and deformationn are obtain as a function of circumferentisl drgree and distance from welding center line. These result can applicate to predict and remove the deformation or residual stresses built up by welding.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.10a
• /
• pp.47-52
• /
• 2002

There are many factors in machine tool error. These are thermal deformation, geometric error, machine's part assembly error, error caused by tool bending. Among them thermal error is 70% of total error of machine tool . Prediction of thermal error is very difficult. because of nonlinear tendency of machine tool deformation. In this study, we tried thermal error prediction by using multi regression analysis.

• Progress in Superconductivity and Cryogenics
• /
• v.18 no.1
• /
• pp.59-63
• /
• 2016

The superconducting NMR magnets have used cryogen such as liquid helium for their cooling. The conduction cooling method using cryocoolers, however, makes the cryogenic cooling system for NMR magnets more compact and user-friendly than the cryogen cooling method. This paper describes the thermal and structural analysis of a cryogenic conduction cooling system for a 400 MHz HTS NMR magnet, focusing on the magnet assembly. The highly thermo-conductive cooling plates between HTS double pancake coils are used to transfer the heat generated in coils, namely Joule heating at lap splice joints, to thermal link blocks and finally the cryocooler. The conduction cooling structure of the HTS magnet assembly preliminarily designed is verified by thermal and structural analysis. The orthotropic thermal properties of the HTS coil, thermal contact resistance and radiation heat load are considered in the thermal analysis. The thermal analysis confirms the uniform temperature distribution for the present thermal design of the NMR magnet within 0.2 K. The mechanical stress and the displacement by the electromagnetic force and the thermal contraction are checked to verify structural stability. The structural analysis indicates that the mechanical stress on each component of the magnet is less than its material yield strength and the displacement is acceptable in comparison with the magnet dimension.

• Journal of Magnetics
• /
• v.15 no.3
• /
• pp.138-142
• /
• 2010

This paper reports the development of an analysis method in a synchronous reluctance motor (SynRM) using the finite element method (FEM) coupled with the electromagnetic field of the Preisach model, which represents an additional thermal source due to hysteresis loss and a thermal field. This study focused on thermal analysis relative to hysteresis and copper losses in a SynRM.

• Proceedings of the KIEE Conference
• /
• 2006.10a
• /
• pp.57-58
• /
• 2006

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, Ansys and thermal distributions form experiments.

• Fire Science and Engineering
• /
• v.16 no.3
• /
• pp.56-60
• /
• 2002

Recently, with the growth of software for electro-thermal analysis, it has been studied the precise analysis and investigation of cause for the electrical fire using computer simulation on the basis of theory for electro-thermal analysis. But it is very lacking for the precise analysis and investigation of cause for the electrical fire. In this paper, we have simulated the thermal analysis for electrical wire according to the value of current in a overload and a short with the electrical wire of the L's company product(600 V VVF) using the electro-thermal finite element method(Flux2D).

• 한국전산유체공학회:학술대회논문집
• /
• 2003.10a
• /
• pp.248-250
• /
• 2003

Thermal analysis is performed to protect the propulsion system of low-earth-orbit earth observation satellite from unwanted thermal disaster like propellant freezing. To implement thermal design adequately, heater powers for the propulsion system estimated through the thermal analysis are decided. Based on those values anticipated herein, the average power for propulsion system becomes 22.02 watts when the only one redundant catalyst bed heater is turned on. When for the preparation of thruster firing, 25.93 watts of the average power is required. All heaters selected for propulsion components operate to prevent propellant freezing meeting the thermal requirements for the propulsion system with the worst-case average voltage, i.e. 25 volts.

• 한국전산유체공학회:학술대회논문집
• /
• 2005.04a
• /
• pp.91-95
• /
• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.