• 한국전산유체공학회지
• /
• 제15권1호
• /
• pp.24-30
• /
• 2010

A preliminary thermal analysis is performed for the optical payload system of a geostationary satellite. The optical payload considered in this paper is GOCI(Geostationary Ocean Color Imager) of COMS of Korea. The radiative and conductive thermal models are employed in order to predict thermal responses of the GOCI on the geostationary orbit. The results of this analysis are as follows: 1) the GOCI instrument thermal control is satisfactory to provide the temperatures for the GOCI performances, 2) the thermal control is defined and interfaces are validated, and 3) the entrance baffle temperature and shutter wheel motor gradient are found slightly out their specification, therefore further detailed analyses should be continued on these elements.

• 한국정밀공학회지
• /
• 제15권9호
• /
• pp.50-55
• /
• 1998

A thermal printing head is used for heat transcription printing of facsimile or printer. The thermal printing head has multilayered thin films and heaters lined up. Thermal analysis of thermal printing head is important for a design of thermal printing head. Since the heating charateristics of thermal printing head is dependent on the thermal conductivities of multilayerd material, this study made numerical analysis for three dimensional transient heat conduction in mutilayered films by the finite difference method and investigated the effect of various thermal conductivities of thin films. The results of this study will be used to design thermal printing head and select the materials for thermal printing head.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1998년도 추계학술대회 논문집
• /
• pp.77-83
• /
• 1998

This study is object to thermal analysis of continuous casting mold. A two-dimensional transient finite element model was developed to compute the temperature distribution and stress behavior for continuous casting mold. For thermal analysis using analysis result from FEM code. In other to thermal analysis of continuous casting mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition re considered.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
• /
• pp.287-292
• /
• 1999

This study is object to thermal analysis of continuous casting nickel-coated mold. A two-dimensional transient finite element model was developed to compute the temperature distribution and stress behavior for continuous casting nickel-coated mold. For thermal analysis using analysis result from FEM code. In other to thermal analysis of continuous casting nickel-coated mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• 한국생산제조학회지
• /
• 제8권6호
• /
• pp.43-49
• /
• 1999

This study is object to thermal analysis of continuous casting mold. A two-dimensional transient finite element model was developed to compute the temperature distribution and stress behavior for continuous casting mold. For thermal analysis using analysis result from FEM code. In order to thermal analysis of continuous casting mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2000년도 추계학술대회논문집 - 한국공작기계학회
• /
• pp.200-205
• /
• 2000

This study is object to thermal analysis comparison of continuous casting mold. A two-dimensional transient finite element model was developed to compute the temperature distribution for continuous casting mold. For thermal analysis using analysis result from ANSYS. In other to thermal analysis of continuous casting mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• 한국기계가공학회지
• /
• 제8권4호
• /
• pp.34-40
• /
• 2009

The effect of frictional factors on thermal stress and deformation volume of motorcycle brake disk was studied by using a disk-on-pad type friction tester. It has an effect on the frictional factor such as applied load, sliding speed, sliding distance and number of ventilated disk hole. However, it is difficult to know the mutual relation of these factors. In this study, thermal stress and deformation volume by using design of experiment with 4 elements were investigated for thermal analysis with regression analysis. Thermal stress and thermal deformation are obtained by the application of temperature from mechanical test. From this study, the result showed that the motorcycle brake disk with ventilated hole 3 had the most excellent thermal stress and deformation volume. The regression equation had a trust rate of 95% for the prediction of thermal stress and deformation volume of motorcycle brake disk was composed.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.208-213
• /
• 2002

When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

• 세라미스트
• /
• 제22권4호
• /
• pp.393-401
• /
• 2019

Thermal analysis means the analysis of a change in a property of a sample, which is related to an imposed temperature alteration. Measurements are usually made with increasing temperature, but isothermal measurements or measurements made with decreasing temperatures are also possible. In fact, any measuring technique can be made into a thermal analysis technique by adding thermal control. Simultaneous use of multiple techniques increases the power of thermal analysis, and modern instrumentation has permitted extensive growth of application. The basic theories of thermal analysis are well developed and some of them are explained in this paper.

• 한국항공우주학회지
• /
• 제34권6호
• /
• pp.42-50
• /
• 2006

본 논문에서는 위성의 전장보드 열해석을 위한 최적의 열모델링 방법을 제안하였다. 플레이트 모델링 방법을 통한 보드 모델링에 고전력 소산 소자의 외부 및 내부 구조를 직접 모델링하는 방법을 새롭게 제안하였다. 이러한 모델링 방법을 다른 모델링과 비교 분석하여 효율성을 검토하였고 열진공 시험을 통해 검증하였다. 제시한 소자 모델링 방법으로 HAUSAT-2의 발열이 큰 통신보드의 열해석을 수행한 결과, 노드 네트워크 모델링 방법과 플레이트 모델링 방법의 단점을 모두 보완할 수 있었다. 또한, 소자 모델링 방법은 열적인 문제에 따른 소자 수준의 해결방안을 모색 후, 그에 따른 열해석을 수행하여 효과를 예측할 수 있으므로 열제어계 설계에도 효율적이다.