• 제목/요약/키워드: thermal NO

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Microwave 조사에 의한 Salmonella enteritidis, Salmonella typhimurium 과 E. coli의 불활성에 관한 연구 (Thermal Inactivation of Salmonella enteritidis, Salmonella typhimurium and E. coli O111 in Liquid Cultures During Microwave Radiation)

  • 이조윤;이강욱;배형철;김종우
    • 한국축산식품학회지
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    • 제18권3호
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    • pp.269-275
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    • 1998
  • The purpose of this study was to determine the thermal inactivation of Salmonella enteritidis, Salmonella typhimurium and E. coli O111 in liquid cultures treated with microwave energy. Furthermore, this study was to introduce new methodologies for studying nonthermal microwave effects on microorganisms, using controlled microwave energy and specially designed apparatuses. For the automatic temperature control during microwave heating, the real time data acquisition and computation system is designed with BASIC routine. The automatic temperature control system used in the experiments perform relatively stable control at the experiment temperature of 45, 50, 55 60$^{\circ}C$ and 65$^{\circ}C$ for 30 minutes. The effects of microwave heating on liquid cultures was compared with that of conventional heating, still reduces effectively the number of pathogenic bacteria in liquid cultures. While no particular differences between microwave heating and conventional heating was observed in the activation of E. coli at 45$^{\circ}C$ test, the activation of Sal. enteritidis and Sal. typhimurium was slightly reduced during the microwave treatments.

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KS F 2278을 적용한 대면적 시료 열관류율 시험 실측에 관한 연구 (An Experimental Study on Thermal Resistance of Large-scale Specimen Using KS F 2278)

  • 문재식;이원균;김영봉;조병영;노상태
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2018년도 춘계 학술논문 발표대회
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    • pp.306-307
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    • 2018
  • In Korea, The thermal resistance test of window sets is performed according to KS F 2278 standard, and is performed only on a specimen size of 2000 × 2000 (mm). In this study, a standard panel measuring 4000 × 3000 (mm) size was used to measure the heat flux in each part of the specimen, and to calculate the resistance to heat transfer And to seize whether the KS F 2278 standard is applicable to large Specimen.

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Field Enhanced Rapid Thermal Process for Low Temperature Poly-Si TFTs Fabrications

  • Kim, Hyoung-June;Shin, Dong-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.665-667
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    • 2005
  • VIATRON TECHNOLOGIES has developed FE-RTP system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The system employs sequential heat treatment methods using temperature control and rapid thermal processor modules. The temperature control modules provide exceptionally uniform heating and cooling of the glass substrates to within ${\pm}2^a\;C$. The rapid thermal process that combines heating with field induction accelerates the treatment rates. The new FE-RTP system can process $730{\times}920mm$ glass substrates as thin as 0.4 mm. The uniform nature of poly-Si films produced by FE-RTP resulted in AMOLED panels with no laser-Muras. Furthermore, FE-RTP system also showed superior performances in other heat treatment processes involved in poly-Si TFT fabrications, such as dopant activation, gate oxide densification, hydrogenation, and pre-compaction.

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An Analytical Study on Indoor Thermal Comfort Performance According to the Automatic Control of Internal-External Blind

  • Lee, Do-Hyung;Kim, Tae-Woo;Yoon, Jong-Ho
    • KIEAE Journal
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    • 제14권3호
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    • pp.31-38
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    • 2014
  • The purpose of this study is to analyse PMV (Predicted Mean Vote) and PPD (Predicted Percentage of dissatisfied) by automatic control of slat-type vertical blind. EnergyPlus, a building energy analysis software has been used for this study. The energy model is calibrated in Energy Plus using measured zone temperature and glass surface temperature data for one day and thermal comfort performance inside the building analysis was carried out. The calibrated data has the MBE of 4% and Cv(RMSE) of 10%. The result was that, for better zone thermal comfort, installation of blind on the outside is more appropriate than inside or no blind case. Additionally, different glazing types were compared and it was found that Triple Low-e glass is the most favorable.

양방향 펄스 전원에 의한 배기가스의 제거 (The Removal of Flue Gas by Using Bidirectional Pulse Generator)

  • 전재룡;성기범;고광철;강형부
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 E
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    • pp.2224-2226
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    • 1999
  • Non-thermal plasma techniques is applied in many fields. Recently acid rain, global warming, ozone depletion, and smog are preeminent environmental problems. The cause for this environmental problems is the flue gas. Non-thermal plasma techniques has an attention for the solution of flue gas. Non-thermal plasma is used for the removal of flue gas composed of NOx, etc. This field has grown dramatically. This experiment is performed by using cylinder type reactor under the condition of room temperature and atmosphere pressure. NO gas is used instead of flue gas. Bidirectional pulse generator is used instead of the unidirectional pulse generator to increase the efficiency.

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Transient Characteristic of a Metal-Oxide Semiconductor Field Effect Transistor in an Automotive Regulator in High Temperature Surroundings

  • Kang, Chae-Dong;Shin, Kye-Soo
    • Transactions on Electrical and Electronic Materials
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    • 제11권4호
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    • pp.178-181
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    • 2010
  • An automotive IC voltage regulator which consists of one-chip based on a metal-oxide semiconductor field effect transistor (MOSFET) is investigated experimentally with three types of packaging. The closed type is filled with thermal silicone gel and covered with a plastic lid on the MOSFET. The half-closed type is covered with a plastic case but without thermal silicone gel on the MOSFET. Opened type is no lid without thermal silicone gel. In order to simulate the high temperature condition in engine bay, the operating circuit of the MOSFET is constructed and the surrounding temperature is maintained at $100^{\circ}C$. In the overshoot the maximum was mainly found at the half-closed packaging and the magnitude is dependent on the packaging type and the surrounding temperature. Also the impressed current decreased exponentially during the MOSFET operation.

Measurement of temperature profile using the infrared thermal camera in turbulent stratified liquid flow for estimation of condensation heat transfer coefficients

  • Choi, Sung-Won;No, Hee-Cheon
    • 한국원자력학회:학술대회논문집
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    • 한국원자력학회 1999년도 춘계학술발표회요약집
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    • pp.107-107
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    • 1999
  • Direct-contact condensation experiments of atmospheric steam and steam/air mixture on subcooled water flowing co-currently in a rectangular channel are carried out uszng an infrared thermal camera system to develop a temperature measurement method. The inframetrics Model 760 Infrared Thermal Imaging Radiometer is used for the measurement of the temperature field of the water film for various flow conditions. The local heat transfer coefficient is calculated using the bulk temperature gradient along the (low direction. It is also found that the temperature profiles can be used to understand the interfacial condensation heat transfer characteristics according to the flow conditions such as noncondensable gas effects, inclination effect, and flow rates.

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BGA 패키지에서의 다양한 언더필의 신뢰성 평가 (Reliability of Various Underfills on BGA package)

  • 노보인;정승부
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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    • pp.31-33
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    • 2005
  • In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.

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세균포자의 건열에 대한 열저항성 (THERMAL RESISTANCE OF BACTERIAL SPORES TO DRY HEAT)

  • 한봉호
    • 한국수산과학회지
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    • 제10권3호
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    • pp.145-149
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    • 1977
  • Thermal resistance of dried bacterial spores against dry heat was determined. Spare suspensions of Bacillus subtilis var. niger ATCC 9372, Bacillus stearothermophilus Oxoid Code BR 23 and Clostridium sporogenes ATCC 19404 were located on aluminium strips, dried in electric oven under vacuum at room temperature for 10 minutes. The aluminium strips were laid in the middle of gas flow (hot air and superheated steam) with the velocity of 6 m/sec and heated at $120^{\circ}C$ for 180 seconds. The calculated D-values showed that there were no remarkable differences in the heat resistance of bacterial spares between $R.H.\leqq0.012$ and R. H.=0.51. Furthermore the thermal resistance of B. subtilis spores to dry heat was greater than that of B. stearothermophilus.

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PCM의 잠열측정을 위한 T-history법에 대한 고찰 (Consideration on the T-history Method for Measuring Heat of Fusion of Phase Change Materials)

  • 박창현;최주환;홍희기
    • 설비공학논문집
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    • 제13권12호
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    • pp.1223-1229
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    • 2001
  • Though conventional calorimetry methods such as differential scanning calorimetry (DSC) and differential thermal analysis (DTA) are used generally in measuring heat of fusion, T-history method has the advantages of a simple experimental apparatus and no requirements of sampling process, which is particularly useful for measuring thermal properties of inhomogeneous phase change materials (PCMs) in sealed tubes. However, random criteria (a degree of supercooling) used in selecting the range of latent heat release and neglecting sensible heat during the phase change process can cause significant errors in determining the heat of fusion. In the present study, it was shown that a 40% discrepancy exists between the original T-history and the present methods when analyzing the same experimental data. As a result, a reasonable modification to the original T-history method is proposed.

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