• Korean Journal of Materials Research
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• v.7 no.3
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• pp.229-233
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• 1997

Estimation of thermal stability for diglycidy1 ether of bisphenol A(DGEMA)/4, 4'-methylene dianiline (MDA)/pheny1 glycidy1 ether(PGE)-acetamide(AcAm)/carboxy1-terminated acrylonitrile butadiene copolymer (CTBN) system was studied by thermogravimetry(TG) analysis. To get activation energy for thermal degradation, Freeman & Carroll, Kissinger, and Flynn & Wall expressions were used. The activation energy of Freeman & Wall expression was 112.9kj/mol, that of Kissinger expression was 151.5 kj/mol and that of Flynn & Wall was 168.3kj/mol.

• Journal of the Korean Wood Science and Technology
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• v.30 no.3
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• pp.34-41
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• 2002

This study investigated the thermogravimetric analysis of two types of cured tannin-based adhesives from wattle and pine, with three hardeners of paraformaldehyde, hexamethylenetetramine and TN (tris(hydroxyl)nitromethan), at a temperature of 170℃ and a heating rate of 5, 10, 20 and 40℃/min for 10 minutes. The 5 minutes cured wattle tannin-based adhesive with each hardener at 170℃ was also tested to compare the degree of curing. It was found that thermogravimetric analysis could be used to measure the degree of curing of a thermosetting adhesive. The TG-DTG curves of all the adhesive systems were similar and showed three steps in a similar way to a phenolic resin. This means that each adhesive system is well cross-linked. However, a high thermal decomposition rate was shown at 150 to 400℃ in the case of the pine tannin sample with TN (tris(hydroxyl)nitromethan). The Flynn & Wall expression was used to evaluate the activation energy for thermal decomposition. As the level of conversion (𝛼) increased, the activation energy of each system increased. The activation energy of the wattle tannin-based adhesive with paraformaldehyde was higher than the others.

• Journal of the Korean Wood Science and Technology
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• v.29 no.3
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• pp.59-67
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• 2001

Rice husk flours were analyzed by chemical composition and thermogravimetric methods in nitrogen atmosphere to discuss its feasibility as a raw material for manufacturing agricultural lignocellulosic fiber-thermoplastic polymer composite. It was revealed in the chemical composition analysis that rice husk flour was composed of moisture, 5.0%; lignin, 21.6%; holocellulose, 60.8%; ash, 12.6%. In the thermogravimetric analysis (TGA), thermal decomposition behavior of rice husk flour from room temperature to $350^{\circ}C$ was similar to that of wood flour, but rice husk flour was more thermally stable from 350 to $800^{\circ}C$ than wood flour because of higher silica content in the rice husk flour and smaller particle size of rice husk flour. The activation energy of thermal decomposition was evaluated using Flynn & Wall expression. As the thermal decomposition proceeded in rice husk flour, the activation energy of thermal decomposition appeared almost constant up to ${\alpha}=0.25$, but thereafter increased. Activation energy of thermal decomposition in wood flour, however, decreased steeply up to ${\alpha}=0.3$, but thereafter remained almost constant. From the results, rice husk flour was thought be a substitute for wood flour in manufacturing agricultural lignocellulosic fiber-thermoplastic polymer composite in the aspect of thermal decomposition.