• Korean Journal of Materials Research
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• v.13 no.7
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• pp.442-446
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• 2003

Tin dioxide ($SnO _2$) thin films were deposited at $375^{\circ}C$ on alumina substrate by metal-organic chemical vapor deposition. A few hillocks like a cauliflower were observed and the number of hillock on thin film surface increased with annealing temperature in air atmosphere. The oxygen content and the binding energy during air annealing at$ 500^{\circ}C$ came to close the stoichiometric $SnO_2$. The cauliflower hillocks seem to be the result of the continuous migration of the tiny grains to release the stress of an expanded grain. Sensitivity of CO gas depended on annealing temperature and increased with increasing annealing temperature.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.261-272
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• 2005

In evaluation of electronic reliability on the PCB(Printed Circuit Board), electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs In the environment of the high humidity and the high temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water droll acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity of electrochemical migration depended on the temperature of water and the electrolyte quantity which included in the various waters.

• Transactions of the Korean hydrogen and new energy society
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• v.24 no.4
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• pp.302-310
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• 2013

As an initial step to develop a liquid hydrogen pump of piston type operated under cryogenic and high pressure, leakage and piston head shape for the piston pump were discussed with temperature and pressure. As the results, the leakage depended on correlation among density, viscosity, clearance area by the low temperature. In order to reduce the leakage, it was found that the air-tightness can be improved by minimizing contact surface between piston and cylinder, and also increasing pressure in-cylinder can reduce piston clearance. Among the proposed piston shapes, D type piston shape had the most air-tightness. D type piston had smaller contact surface than other piston shape and easier expansion of cup shape by pressure. The leakage of D type piston shape was found about 7%, compared with A type piston shape. But it was required that analyze about vapor lock by friction and wear resistance.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.162-169
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• 2004

High temperature uniaxial compression tests in the alpha single phase region were carried out on the Ti -43mo1%Al intermetallic compound, in order to obtain oriented lamellar microstructure. The compression deformation temperatures and strain rates are from 1573k to 1623k and 1.0x10$^{-4}$ s to 5.0x10$^{-3}$ s, respectively. Fully lamellar microstructure was observed after the uniaxial compression deformation in a single phase region followed by cooling to room temperature. Lamellar colony diameter depended on strain rates and test temperatures. The diameter varied between 8601m and 300fm. Stress-strain curve showed a work softening and the size of lamellar colony diameter varied depending on peak stresses. This shows the occurrence of dynamic recrystallization. Texture measurements after the uniaxial compression deformation, showed the development of fiber during dynamic recrystallization. It is seen that the area for the maximum pole density existed in 35 degrees away from the compression plane. The texture sharpens with a decrease in strain rate

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.381.2-381.2
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• 2014

In this study the amorphous carbon films were deposited by PECVD at the substrate temperature range of 250 to $600^{\circ}C$, and the process conditions of higher and lower precursor flow rate, respectively. The temperature was a main parameter to control the density and mirco-structures of carbon films, and their's properties depended with the process temperatrue are changed by controlling precursor flow rate. The precursor feeding rate affect on the plasma ion density and a deposition reactivity. This change of film properties was obtained the instrinsic stress, FT-IR & Raman analysis, refractive index (RI) and ext. coef. (k) measured by ellipsometer. In the process conditions of lower and higher flow rate of precursor it had a different intrinsic stress as a function of the substrate temperature.

• Journal of the Korean Society of Combustion
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• v.15 no.2
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• pp.34-40
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• 2010

The effect of co-firing with pulverized coal and wood biomass on ignition and burn-out temperature was investigated at air and oxy-fuel conditions by thermo gravimetric analyzer(TGA). Three kinds of coal(shenhua, adaro, wira) were selected and mixing ratios of coal and wood biomass was set to 1, 0.5, and 0.8. The ignition temperature depended on the amount of volatile matter of blended fuel, while the burn-out temperature was dominated by the oxidant ingredients. The oxy-fuel condition with an oxygen ratio(Ofr,o) of 0.3 showed similar tendency with air condition in the heat flow measurement. Volatile matter reaction, however, became dominant when oxygen ratio exceeded 0.8 for co-firing combustion of wood biomass and pulverized coal.

• Journal of Power System Engineering
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• v.6 no.2
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• pp.18-23
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• 2002

Recently, as people pay attention to the environmental pollution, the emission of diesel engine has become a serious problem. Diesel Oxidation Catalysts(DOC) were experimentally investigated for the purification of pollutants exhaust emission from the diesel engine. In this study, the conversion efficiency of exhaust gas was investigated with various washcoat materials of the DOC. It was formed that CO conversion efficiency depended on temperature, but THC conversion was dominated by temperature and space velocity. Conversion efficiency of THC and CO increased with the addition of ZSM-5 in the washcoat, whereas these conversion efficiency decreased by adding Nd and Ba additives. $V_2O_5$ additive had the thermal stability for high temperature. Thermal durability of the catalyst was improved as increase of $V_2O_5$ additive.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 1998.11a
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• pp.131-133
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• 1998

Electron temperature, electron density and electron energy distribution function were measured in Radio-Frequency Inductively Coupled Plasma(RFICP) using a probe method. Measurements were conducted in argon discharge for pressure from 10 mTorr to 40 mTorr and input rF power from 100W to 600W and flow rate from 3 sccm to 12 sccm. Spatial distribution of electron temperature, electron density and electron energy distribution function were measured for discharge with same aspect ratio (R/L=2). Electron temperature was found to depend on pressure, but only weakly on power. Electron density and electron energy distribution function strongly depended on both pressure and power. Electron density and electron energy distribution function increased with increasing flow rate. Radial distribution of the electron density and electron energy distribution function were peaked in the plasma center. Normal distribution of the electron density, electron energy distribution function were peaked in the center between quartz plate and substrate. These results were compared to a simple model of ICP, finally, we found out the generation mechanism of Radio-Frequency Inductively Coupled Plasma.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.10
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• pp.820-825
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• 1998

We deposited stearic acid LB films by using Langmuir-Blodgett (LB)method and investigated anisotropy electrical conduction characteristics by I-V measurement for horizontal direction and vertical direction. Also, we measured gad response between deposited LB films and organic gas for various temperature(0~8$0^{\circ}C$) by 9MHz At-cut quartz crystal microbalance. The LB films have electrical conduction characteristics such as semiconducting and insulating properties. The is, the conductivity of LB films for the horizontal and vertical direction is about 10\ulcornerS/cm and 10\ulcorners/cm, respectively. the frequency shift of stearic acid LB films for the organic gases depended on the mass change by the surface adsorption and the inner penetration to the sensing films. The resonant frequency shift of the quartz crystal microbalance for temperature properties of LB films is thought to the effect of the rearrangement or the damage pf LB films above the melting point and the mobility increasement of the organic gas by the temperature rising.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.