• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.320-323
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• 2005

This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

• 오토저널
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• 제14권2호
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• pp.110-119
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• 1992

Crank pin temperatures were measured and analyzed to find out practical method which can predict the engine bearing reliability. The measuring points were determined to be near the MOFT region and far from that by theoretical calculation. The effect of engine running condition, oil temperature, the change of oil circuit into bearing and crankshaft endplay on crank pin temperature were experimentally tested. The result obtained was as following. The crank pin temperature was dependent on oil film thickness and directly influenced by the change of test condition. Also, the length of the crankshaft endplay was confirmed to be critical to connecting rod bearing failure. In conclusion, we found that the measurement method of crank pin temperature can be used for predicting the engine bearing reliability.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권1호
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• pp.11-18
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• 2013

For a reliability assessment of machinery parts, accurate performance test, environmental test, life test, etc. are required on the sample. In the performance test conditions of various machinery parts, some problems happen such as needs to rise temperature rapidly with large flow of oil having very low thermal conductivity and to measure very high torque or tiny torque, etc. This study brings out the method to apply heat to rise temperature for large flow of oil without chemical change in a performance test of oil cooler. To measure large scale of torque in a performance test of planetary gearbox of excavator, the method of torque measurement is proposed by replacing the large torque meter priced very expensive. To measure very small torque on lubricated friction, a methode of force balance type test mechanism is introduced for tests of piston assembly.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.69-73
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• 2005

The failure of geogrids used for soil reinforcement application can be defined as an excessive creep strain which causes the collapse of slopes and embankments. Accordingly, the lifetime is evaluated as a time to reach the excessive creep strain using two accelerated creep testing methods, time-temperature superposition(TTS) and stepped isothermal methods(SIM). TTS is a well-accepted acceleration method to evaluate creep behavior of polymeric materials, while SIM was developed in the last ten years mainly to shorten testing time and minimize the uncertainty associated with inherent variability of multi-specimen tests. The SIM test is usually performed using single rib of geogrids for temperature steps of $14^{\circ}C$ and a dwell time of 10,000 seconds. However, for multi-ribs of geogrids, the applicability of the SIM has not been well established. In this study, the creep behaviors are evaluated using multi-ribs of polyester geogrids using SIM and TTS creep procedures and the newly designed test equipment. Then the lifetime of geogrids are predicted by analyzing the failure times to reach the excessive creep strains through reliability analysis.

• 국제학술발표논문집
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• The 8th International Conference on Construction Engineering and Project Management
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• pp.257-264
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• 2020

Objective: To investigate test-retest reliability and responsiveness of Equivital Lifemonitor and photoplethysmography based wristwatch tools in assessing physiological parameters during a simulated fatigue task. Methods: Ten university students (Mean age, 30.6 ± 1.7 years) participated in this pilot study. Participants were asked to perform a 30-minute of a simulated fatigue task in an experimental setup in a lab. The physiological parameters (e.g., heart rate, heart rate variability, respiratory rate, electrodermal activity, and skin temperature) were measured at baseline and immediately after the fatigue task. An intraclass correlation coefficient (ICC2,1) was used to evaluate the test-retest reliability of each tool in assessing physiological measures. In addition, the responsiveness of each tool to measure changes from baseline to posttest was calculated using a standardized response mean. Results: The Equivital Lifemonitor has shown good to excellent test-retest reliability for the assessment of heart rate (ICC, 0.97), heart rate variability (ICC, 0.86), respiratory rate (ICC, 0.77), and local skin temperature (ICC, 0.76). However, photoplethysmography based wristwatch showed moderate to good test-retest reliability for the assessment of heart rate (ICC, 0.71), heart rate variability (ICC, 0.73), electrodermal activity (ICC, 0.80), and skin temperature (ICC, 0.72). A large standardized response mean (>0.8) indicates that both tools can capture the changes in heart rate, heart rate variability, respiratory rate, skin temperature, and electrodermal activity after a 30-minute of fatigue task. Conclusions: The Equivital Lifemonitor and photoplethysmography based wristwatch devices are reliable in measuring physiological parameters after the fatigue task. Additionally, both devices can capture the fatigue response after a simulated construction task. Future field studies with a larger sample should investigate the sensitivity and validity of these tools in measuring physiological parameters for fatigue assessment at construction sites.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.102-102
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• 2009

The piezoelectric transformer have attracted a lot of interest in recent years because of their potential applications in electronic devices. However, their reliability in practical applications has not been systematically studied. For many piezoelectric materials, the temperature reliability are among the biggest concerns. This paper presents an experimental study of the piezoelectric transformers with the focus on its reliability under varying temperature conditions.

• 전기전자학회논문지
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• 제22권1호
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• pp.193-196
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• 2018

In this study, we investigated the reliability of anisotropic conductive paste (ACP) and anisotropic conductive films (ACF), which are anisotropic conductive adhesives, applied to automotive touch panels. Adhesive material is also important as a key factor in assembling the touch panel. In order to measure the resistance change of the parts in two kinds of high temperature test, the reliability of the two types of anisotropic conductive adhesives was compared and evaluated through the results of the resistance change. For 615 hours of reliability testing, the anisotropic conductive film exhibited a higher stability in a high temperature environment than the anisotropic conductive paste.

• 한국전기전자재료학회논문지
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• 제22권8호
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• pp.625-631
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• 2009

In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.

• 한국컴퓨터정보학회논문지
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• 제23권11호
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• pp.67-74
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• 2018

The verification for the design limit margin of the power device for the information communication and surveillance systems using HALT(Highly Accelerated Life Test) reliability test is described. The HALT reliability test performs with a step stress method which change condition until the marginal step in a design and development phase. The HALT test methods are the low temperature(cold) step stress test, the high temperature(hot) step stress test, the thermal shock cyclic stess test, and the high temperature destruct limit(hot DL) step stress test. The power device is checked the operating performance during the test. In this paper, the HALT was performed to find out the design limit margin of the power device.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.1022-1025
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• 2002

This paper presents the reliability of planar InP/InGaAs avalanche photodiodes (APD's) with recess etching, which is very crucial for the commercial 10-Gb/s optical receiver application. A versatile design for the planar InP/InGaAs APD's and bias-temperature tests to evaluate long-term reliability at temperature from 200 to $250^{\circ}C$. The reliability is examined by accelerated life tests by monitoring dark current and breakdown voltage. The lifetime of the APD's is estimated by a degradation activation energy. Based on the test results, it is concluded that the planar InP/InGaAs APD's with recess etching shows the sufficient reliability for practical 10-Gb/s optical receivers.