• Journal of Environmental Impact Assessment
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• v.18 no.4
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• pp.219-227
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• 2009

Because of urban development and changed land cover types, It is very important to acquire pixel unit of land surface temperature(LST) information when the heat island effect(HIE) of regional area are investigated. The brightness temperature observed by satellite is very useful for assessing the pixel unit of LST distributions for the analysis of thermal environment problems of urban areas. Also, satellite land cover data are very useful to our understanding of surface conditions of study areas. In this study, brightness temperature information of Landsat TM thermal channel was analyzed and compared with land cover information of Jeon-ju city. The atmospheric correction of TM thermal channel carried out to explain for compared LST long term monitoring errors. However, simple estimation and evaluation methods to find a physical relationship between LST from satellite images and in-situ data are compared with reference channel emissivity.

• Proceedings of the KSRS Conference
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• 2005.10a
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• pp.146-148
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• 2005

This study investigates to detect sea surface temperature (SST) and land cover change after tide embankment construction using Landsat Thematic Mapper (TM) thermal infrared (TIR) band data at Shihwa Lake and surrounding area. SST measurement is important for studies of both the structure of the ocean and as the thermal boundary between the ocean and the atmosphere. The TIR band of TM images can be used to detect SST change whose shoreline is complicated and narrow like the study site. The purpose of this study is to estimate SST and land cover change at Shihwa Lake and surrounding area.

• Proceedings of the KSR Conference
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• 2004.06a
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• pp.1102-1107
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• 2004

High-speed railway bridges subject to effect of statical loads by temperature change as well as dynamic loads by interaction between vehicle load which run specially fast and behavior of bridges, If suitable longitudinal expansion by temperature change of bridge does not happened, it can cause unhealthy condition for the parts of bridges as well as can generate addition stress to bridges, For these reason, Analysis and Estimation of data about behavior of bridges occupies important factor in that estimate the remaining life of bridges and select the maintenance, repair and retrofit. In this paper, Analysis for the long-term behavior of bridges using Longitudinal displacement and Temperature data that is actuality measured data to the bridges of Seoul-Busan high speed railroad test section has been made.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.15-20
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• 2006

The rapid thermal response (RTR) molding is a novel process developed to raise the temperature of mold surface rapidly to the polymer melt temperature prior to the injection stage and then cool rapidly to the ejection temperature. The resulting filling process is achieved inside a hot mold cavity by prohibiting formation of frozen layer so as to enable thin wall injection molding without filling difficulty. The present work covers flow simulation of thin wall injection molding using the RTR molding process. In order to take into account the effects of thermal boundary conditions of the RTR mold, coupled analysis with transient heat transfer simulation is suggested and compared with conventional isothermal analysis. The proposed coupled simulation approach based on solid elements provides reliable thin wall flow estimation for both the conventional molding and the RTR molding processes.

• Proceedings of the KIEE Conference
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• 2002.07a
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• pp.22-24
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• 2002

This paper introduces the real-time soil thermal property analyzer and temperature measuring system which is combined with radio telecommunication technique. To measure the thermal parameters in real-time, the radio telecommunication technique are used the personal communication service (PCS) which is in the world-wide serviced commercially firstly by CDMA. The thermal property analyzer has an ability of measuring thermal resistivity, thermal diffusivity and thermal stability. To estimate the soil thermal properties, the curve fitting algorithm by means of the least square method are used. TCP/IP protocol and MTM are used to install the real-time soil thermal property and temperature measurement system at multiple locations along routes of the underground power cables and to reduce the cost of telecommunication.

• Journal of Environmental Science International
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• v.5 no.6
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• pp.727-738
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• 1996

An one dimensional atmosphere-canopy-soil interaction model is developed to estimate of the heat budget parameter in the atmospheric boundary layer. The canopy model is composed of the three balance equations of energy, temperature, moisture at ground surface and canopy layer with three independent variables of Tf(foliage temperature), Tg(ground temperature), and qg(ground specific humidity). The model was verilied by comparative study with OSUID(Oregon State University One Dimensional Model) proved in HAPEX-MOBILHY experiment. Also we applied this model in two dimensional land-sea breeze circulation. According to the results of this study, surface characteristics considering canopy acted importantly upon the simulation of meso-scale circulation. The factors which used in the numerical experiment are as follows ; the change for a sort of soil(sand and peat), the change for shielding factor, and the change for a kind of vegetation.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1584-1589
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• 2003

This work applies the equilibrium molecular dynamics simulation method to study a Lennard-Jones liquid thin film suspended in the vapor and calculates diffusion coefficients by Green-Kubo equation derived from Einstein relationship. As a preliminary test, the diffusion coefficients of the pure argon fluid are calculated by equilibrium molecular dynamics simulation. It is found that the diffusion coefficients increase with decreasing the density and increasing the temperature. When both argon liquid and vapor phases are present, the effects of the system temperature on the diffusion coefficient are investigated. It can be seen that the diffusion coefficient significantly increases with the temperature of the system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.832-836
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• 1997

An experimental study on the grinding temperature, surface roughness and Acoustic Emission(AE) signal was conducted with different shapes of wheel. The grinding characteristics by slotted shapes of wheel changed by width and helical angle,were compared with those by general one. Lower grinding temperature was obtained for 30 .deg. helical angel with 10mm width and Root Mean Square(RMS) values of AE signals were lower for slotted shapes rather than general one. Surface roughness characteristic of slotted shapes found to be rough,but the value of roughness for 45 .deg. helical angel with 6mm width, represented to similar tendency general one.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.11
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• pp.1682-1688
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• 2012

This paper introduces a GP(Genetic Programming) based robust technique for temperature compensation in short-range prediction. Development of an efficient MOS(Model Output Statistics) is necessary to correct systematic errors of the model, because forecast models do not reliably determine weather conditions. Most of MOS use a linear regression to compensate a prediction model, therefore it is hard to manage an irregular nature of prediction. In order to solve the problem, a nonlinear and symbolic regression method using GP is suggested. The purpose of this study is to evaluate the accuracy of the estimation by a GP based nonlinear MOS for 3 days temperatures in Korean regions. This method is then compared to the UM model and has shown superior results. The training period of 2007-2009 summer is used, and the data of 2010 summer is adopted for verification.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1265-1270
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• 2008

Electromigration is a one of a critical failure mechanism in microelectronic devices. Minimizing the thin film interconnections in microelectronic devices make high current densities at electrrical line. Under high current densities, an electromigration becomes critical problems in a microelectronic device. This phenomena under DC conditions was investigated with high temperature. The current density of 1.5MA/cm2 was stressed in interconnections under DC condition, and temperature condition $150^{\circ}C,\;175^{\circ}C,\;200^{\circ}C$. By increasing of thin film interconections, microelectronic devices durability is decreased and it gets more restriction by temperature. Electromigration makes electronic open by void induced, and hillock induced makes electronic short state.