• 제목/요약/키워드: surface pressure measurement

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자유곡면 연마를 위한 자동 연마 시스템 개발 (Development of Computer Control Polishing System for Free Form Surface)

  • 전문식;오창진;이응석;김옥현
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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    • pp.327-331
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    • 2001
  • In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

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역경계요소법에 근거한 근접 음향 홀로그래피에서 강체 산란체의 이용 (Use of Rigid Scattering Body in the use of NAH based on the inverse BEM)

  • 김성일;정지훈;이정권
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 춘계학술대회논문집
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    • pp.486-489
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    • 2004
  • The NAH based on the inverse BEM is used to reconstruct the source field, which is advantageous in dealing with the irregular source. In the implementation of this technique, a large number of pressure measurements is required because an over-determined pressure data set is required. These conditions accordingly cause the increase of measurement time and associated effort along with the error due to mal-positioning. The purpose of this study is to reduce such inconveniences: Instead of increasing the number of field pressure data, the number of transfer paths between the source and the receiver is increased by placing rigid scattering body in-between the source and receiver. For validating the usefulness and effectiveness of the method, the numerical analyses of interior problem are demonstrated. As a result, it is thought that the proposed method enables the measurement at smaller number of sensor positions and the monitoring of surface vibration with less experimental effects than before.

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CMP 공정에서 압력과 정반속도가 사파이어 웨이퍼 재료제거율에 미치는 영향 (The Effect of Pressure and Platen Speed on the Material Removal Rate of Sapphire Wafer in the CMP Process)

  • 박상현;안범상;이종찬
    • Tribology and Lubricants
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    • 제32권2호
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    • pp.67-71
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    • 2016
  • This study investigates the characteristics of the sapphire wafer chemical mechanical polishing (CMP) process. The material removal rate is one of the most important factors since it has a significant impact on the production efficiency of a sapphire wafer. Some of the factors affecting the material removal rate include the pressure, platen speed and slurry. Among the factors affecting the CMP process, we analyzed the trends in the material removal rate and surface roughness, which are mechanical factors corresponding to both the pressure and platen speed, were analyzed. We also analyzed the increase in the material removal rate, which is proportional to the pressure and platen speed, using the Preston equation. In the experiment, after polishing a 4-inch sapphire wafer with increasing pressure and platen speed, we confirmed the material removal rate via thickness measurements. Further, surface roughness measurements of the sapphire wafer were performed using atomic force microscopy (AFM) equipment. Using the measurement results, we analyzed the trends in the surface roughness with the increase in material removal rate. In addition, the experimental results, confirmed that the material removal rate increases in proportion to the pressure and platen speed. However, the results showed no association between the material removal rate and surface roughness. The surface roughness after the CMP process showed a largely consistent trend. This study demonstrates the possibility to improve the production efficiency of sapphire wafer while maintaining stable quality via mechanical factors associated with the CMP process.

발바닥의 피부 감각 변화가 보행 중에 족저압 분포에 미치는 영향 (The Effect of Changes in Foot Cutaneous Sensation on Plantar Pressure Distribution during Gait)

  • 성대영;김중휘;박지원
    • The Journal of Korean Physical Therapy
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    • 제24권5호
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    • pp.306-312
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    • 2012
  • Purpose: The purpose of this study was to examine the effect of changes in foot cutaneous sensation on plantar pressure distribution during gait. Methods: Sixteen healthy young subjects participated in this experiment. All subjects performed two trials of walking under three somatosensory conditions induced by a normal facilitatory insole that provides increased plantar sensory stimulation, and application of lidocaine cream to the plantar surface of the foot to reduce the sensitivity of the soles. Semmes-Weinstein monofilaments were used for evaluation of reduced plantar sensation. The Pedar system was used for measurement of pressure distribution at the plantar surface of the foot. Results: Pressure in the lateral midfoot area showed an increase with increasing and decreasing sensory inputs. When sensory input was increased, plantar pressure showed a decrease in the forefoot area. When sensory input was decreased, plantar pressure showed an increase in the lateral forefoot area and a decrease in the hallux area. Conclusion: By altering sensory feedback, plantar pressure distribution is changed during gait. Plantar cutaneous afferents play an important role in plantar distribution.

Improving Sensitivity of SAW-based Pressure Sensor with Metal Ground Shielding over Cavity

  • Lee, Kee-Keun;Hwang, Jeang-Su;Wang, Wen;Kim, Geun-Young;Yang, Sang-Sik
    • 마이크로전자및패키징학회지
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    • 제12권3호
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    • pp.267-274
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    • 2005
  • This paper presents the fabrication of surface acoustic wave (SAW)-based pressure sensor for long-term stable mechanical compression force measurement. SAW pressure sensor has many attractive features for practical pressure measurement: no battery requirement, wireless pressure detection especially at hazardous environments, and easy other functionality integrations such as temperature, humidity, and RFID. A $41^{\circ}$ YX $LiNbO_3$ piezoelectric substrate was used because of its high SAW propagation velocity and large values of electromechanical coupling factors $K^2$. A silicon substrate with $\~200{\mu}m$ deep cavity was bonded to the diaphragm with epoxy, in which gold was covered all over the inner cavity in order to confine electromagnetic energy inside the sensor, and provide good isolation of the device from its environment. The reflection coefficient $S_{11}$ was measured using network analyzer. High S/N ratio, sharp reflected peaks, and clear separation between the peaks were observed. As a mechanical compression force was applied to the diaphragm from top with extremely sharp object, the diaphragm was bended, resulting in the phase shifts of the reflected peaks. The phase shifts were modulated depending on the amount of applied mechanical compression force. The measured $S_{11}$ results showed a good agreement with simulated results obtained from equivalent admittance circuit modeling.

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선체 변동 압력에 관한 실험과 이론의 비교 연구 (A Study of a Correlation between Experiments and Calculations of Pressure Fluctuation on Hull Surface)

  • 김문찬;김기섭;송인행
    • 대한조선학회논문집
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    • 제33권1호
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    • pp.19-26
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    • 1996
  • 프로펠러에 의한 선체변동압력을 추정하기 위해 3개의 선체에 7개의 프로펠러를 장착하여 실험과 계산치를 비교하였다. 변동압력의 계측은 KRISO의 공동터널에서 평판에 대하여 수행하였으며, 수치계산은 양력면 이론과 패널법을 사용한 수치프로그램(X-ForShip)을 사용하였다. 평판에 대한 실험값을 복잡한 선미형상에 적용하기 위하여 강체경계율(SBF)이 수정계수로 결정되었다. 실선 변동압력의 예측과 실험치의 수정을 위하여 복잡한 선미형상에서의 변동 압력을 계산하였다. 계산치와 수정된 실험치와의 좋은 일치를 보였으며, 수성계수로써 약 0.65-0.7의 값이 결정되었다.

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공기유동에 대한 고온상태의 비원형 도과내에서의 열전달 및 압력강하의 측정 (Measurement of Heat Transfer and Friction Coefficients for Flow of Air in Noncircular Ducts At High Surface Temperatures.)

  • 이동렬
    • Journal of Advanced Marine Engineering and Technology
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    • 제25권3호
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    • pp.552-562
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    • 2001
  • Measurement of average of heat transfer and friction coefficients were obtained with air flowing through electrically heated ducts having square, rectangular(aspect ration, 5), and triangular cross section for range of surface temperature from $540^{\circ}$to $1780^{\circ}$ R and Reynolds number from 1000 to 330,000. The results indicates that the effect of heat flux on correlations of the average heat transfer and friction coefficients is similar to that obtained for circular tubes in previous investigation and was nearly eliminated by evaluating the physical properties and density of the air a film temperature halfway between the average surface and fluid bulk temperatures, With the Nusselt and Reynolds numbers on the hydraulic diameter of the ducts, the data for the noncircular ducts could be represented by the same equations obtained in the previous investigation for circular tubes. Correlation of the average difference between the surface corner and midwall temperatures for the square duct was in agreement with predicted values from a previous analysis. However, for the rectangular and triangular ducts, the measured corner temperature was greater by approximately 20 and 35 percent, respectively, than the values predicted by analysis.

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차압식 벤튜리콘 유량계에 대한 유동해석 (Numerical analysis of the differential pressure venturi-cone flowmeter)

  • 윤준용;맹주성;이정원
    • 설비공학논문집
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    • 제10권6호
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    • pp.714-720
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    • 1998
  • The differential pressure venturi-cone flowmeter is an advanced flowmeter which has many advantages such as wide range of measurement, high accuracy, excellent flow turn-down ratio, low headless, short installation pipe length requirement, and etc. Like other differential pressure flowmeters, the venturi-cone flowmeter uses the law of energy conservation, but its shape and position make it perform better than others. The cone acts as its own flow conditioner and mixer, fully conditioning and mixing the flow prior to measurement. For the analysis, we used Reynolds-averaged Wavier-Stokes equations and k-$\omega$ turbulence model. The equations were fully transformed into the computational domain, the pressure-velocity coupling was made through SIMPLER algorithm, and the equations were discretized using finite analytic solutions of the liberalized equations(Finite Analytic Method). To control the separation phenomenon on the cone surface, we proposed a new shape of cone, and analyzed the flowfield in the new flowmeter system, and found the improvement on the performance of the new cone flowmeter.

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Chip-scale Temperature-compensated Superstructured Waveguide Bragg Grating Based Multiparametric Sensor

  • Vishwaraj, Naik Parrikar;Nataraj, Chandrika Thondagere;Jagannath, Ravi Prasad Kogravalli;Gurusiddappa, Prashanth;Talabattula, Srinivas
    • Current Optics and Photonics
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    • 제4권4호
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    • pp.293-301
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    • 2020
  • In this paper we propose and theoretically analyze a monolithic multiparametric sensor consisting of a superstructure of surface-relief waveguide Bragg gratings (WBGs), a micro-machined diaphragm, and a cantilever beam. Diaphragms of two different configurations, namely circular and square, are designed and analyzed separately for pressure measurement. The square diaphragm is then selected for further study, since it shows relatively higher sensitivity compared to the circular one, as it incurs more induced stress when any pressure is applied. The cantilever beam with a proof mass is designed to enhance the sensitivity for acceleration measurement. A unique mathematical method using coupled-mode theory and the transfer-matrix method is developed to design and analyze the shift in the Bragg wavelength of the superstructure configuration of the gratings, due to simultaneously applied pressure and acceleration. The effect of temperature on the wavelength shift is compensated by introducing another Bragg grating in the superstructure configuration. The measured sensitivities for pressure and acceleration are found to be 0.21 pm/Pa and 6.49 nm/g respectively.

사출금형 버 발생 방지를 위한 형합면압 측정에 관한 연구 (Study on the Pressure Measurement at Parting Surface to Prevent Flashing in Injection Molds)

  • 최재혁;최순호;태준성;박형필;이병옥
    • 소성∙가공
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    • 제20권1호
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    • pp.73-78
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    • 2011
  • The flashing reduces the part quality and the productivity of the molding process. We developed a contact pressure sensor to detect the flashing immediately. The performance of the sensor was analyzed in a simple 2D simulation. The sensor was applied to an automotive bumper mold with cavity pressure sensors. It showed sensitive output signal for the mold response by the cavity pressure change. It was confirmed that the flashing at the gate area occurred in the filling stage by the pressure increase due to growth of the melt flow length. The sensor output was correlated with the cavity pressure sensor output.