• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2002년도 춘계학술발표회 초록집
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• pp.31-31
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• 2002

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 추계학술발표회 초록집
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• pp.33-34
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• 1998

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.25-25
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• 2000

In this talk we discuss the dynamics of hydrogen on the Si(100)-2xl surface. At room temperature the sticking coefficient for molecular hydrogen on this surface is less than 10sup-12. However, hydrogen molecules desorbing from the surface do not have an excess of energy, suggesting at best a small barrier on the exit channel. These observations have led to speculation about the validity of detailed balance in this system. Here we show that this discrepancy can be explained by considering both the surface-molecule co-ordinate and that associated with the Si-Si dimer bond tiltangle. By preparing the surface dimers with a specific tiltangle we demonstrate that the barrier to adsorption is a function of this angle and that the sticking coefficient dramatically increase for certain angles. The adsorption-desopption dynamics can then be described in terms of a common potential energy hypersurface involving both of these co-ordinates. The implications of these observations are also discussed. The dynamics of adsorbed hydrogen atoms on the Si(100) surface is also described. Paired dangling bonds produced following recombinative hydrogen desorption are mobile at elevated temperatures. Pairs of dangling bonds are observed to dissociate, diffuse, and ultimately recombine. At sufficiently elevated temperatures dangling bond exchange reactions are observed. These data are analyzed in terms of an attractive zone and an effective binding interaction between dangling bonds. Insights that this provides into the nature of surface defects and the localized chemistry that occurs on this surface, are also discussed.

• 한국진공학회지
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• 제20권2호
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• pp.93-99
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• 2011

금속 전극 위에 유기물 채널을 증착하여 만드는 바닥 전극 구조의 유기물 박막 트랜지스터에서 전극 표면이 거친 정도에 따라 전하 주입이 어떻게 달라지는지 조사했다. 금 전극을 실리콘 기판에 증착하고, 가열하여 금 전극 표면을 거칠게 만들었다. 그리고 펜터신과 상부 전극으로 사용할 금 전극을 차례대로 증착하여 금 전극/펜터신/금 전극 구조를 만들었다. 펜터신 증착 초기에는 거친 금 전극 위에서 펜터신 증착핵이 더 많이 보였지만, 막이 두꺼워지면 가열되지 않은 전극과 가열로 거칠어진 전극에서 펜터신 표면 모양에 차이가 거의 없었다. 온도를 바꾸면서 측정한 전류-전압 곡선은 바닥 전극의 표면이 거칠수록 바닥계면의 전위장벽이 높음을 보여주었다. 이 현상은 금속 표면이 거칠수록 일함수가 낮아지며 펜터신과 거친 전극 표면의 경계에 전하 트랩이 더 많기 때문으로 생각된다.

• 한국세라믹학회지
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• 제54권5호
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• pp.443-447
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• 2017

The initial reaction of hexachlorodisilane ($Si_2Cl_6$, HCDS) on amorphous silica ($SiO_2$) surface for atomic layer deposition was investigated using density functional theory. Two representative reaction sites on the amorphous $SiO_2$ surface for HCDS reaction, a surface hydroxyl and a two-membered ring, were considered. The reaction energy barrier for HCDS on both sites was higher than its adsorption energy, indicating that it would desorb from the surface rather than react with the surface. At high temperature range, some HCDSs can have kinetic energy high enough to overcome the reaction energy barrier. The HCDS reaction on top of the reacted HCDS was investigated to confirm its self-limiting characteristics.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.41.2-41.2
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Metal Oxide Semiconductor) based electronic devices become much faster speed and smaller size than ever before. However, very narrow interconnect line width causes some drawbacks. For example, deposition of conformal and thin barrier is not easy moreover metallization process needs deposition of diffusion barrier and glue layer. Therefore, there is not enough space for copper filling process. In order to overcome these negative effects, simple process of copper metallization is required. In this research, Cu-V thin alloy film was formed by using RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane $SiO_2$/Si bi-layer substrate with smooth and uniform surface. Cu-V film thickness was about 50 nm. Cu-V layer was deposited at RT, 100, 150, 200, and $250^{\circ}C$. XRD, AFM, Hall measurement system, and XPS were used to analyze Cu-V thin film. For the barrier formation, Cu-V film was annealed at 200, 300, 400, 500, and $600^{\circ}C$ (1 hour). As a result, V-based thin interlayer between Cu-V film and $SiO_2$ dielectric layer was formed by itself with annealing. Thin interlayer was confirmed by TEM (Transmission Electron Microscope) analysis. Barrier thermal stability was tested with I-V (for measuring leakage current) and XRD analysis after 300, 400, 500, 600, and $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However V-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Thus, thermal stability of vanadium-based thin interlayer as diffusion barrier is good for copper interconnection.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권12호
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• pp.673-678
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• 2000

The dielectric barrier discharge(DBD) is a common method to create a nonthermal plasma in which electrical energy is used to create electrons with a high average kinetic energy. The unique aspect of dielectric barrier discharges is the large array of short lifetime(10ns) silent discharges created over the surface of the dielectric. A silent discharge is generated when the applied voltage exceeds the breakdown voltage of the carrier gas creating a conduction path between the applied electrode and grounded electrode. As charge accumulates on the dielectric, the electric field is reduced below the breakdown field of the carrier gas and the silent discharge self terminates preventing the DBD cell from producing a thermal arc. In fact, the most significant application of dielectric barrier discharges is to generate ozone for contaminated water treatment. Therefore, experiments were perfomed at 1∼2[bar] pressure using a coaxial geometry single dielectric barrier discharge for ozone concentrations and energy densities. The main result show that the concentration and efficiency of ozone are influenced by gas nature, gas quantity, gas pressure, supplied voltage and frequency.

• Asian Journal of Atmospheric Environment
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• 제9권1호
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• pp.22-30
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• 2015

This study evaluated road shape and roadside barrier impact on near-road air pollution dispersion using FLUENT computational fluid dynamics (CFD) model. Simulated road shapes are three types, namely at-grade, depressed, and filled road. The realizable k-${\varepsilon}$ model in FLUENT CFD code was used to simulate the flow and dispersion around road. The selected concentration profile results were compared with the wind tunnel experiments. The overall concentration profile results show good agreement with the wind tunnel results. The results showed that noise barriers, which positioned around the at-grade road, decrease the horizontal impact distance (In this study, the impact distance was defined as the distance from road surface origin coordinate to the position whose mass fraction is 0.1.) lower 0.33~0.65 times and change the vertical air pollution impact distance larger 2.0~2.27 times than those of no barrier case. In case of filled road, noise barriers decrease the horizontal impact distance lower 0.24~0.65 times and change the vertical air pollution impact distance larger 3.33~3.55 times than those of no barrier case. The depressed road increase 1.53~1.68 times the vertical air pollution impact distance. It contributes the decrease of horizontal air pollution impact distance 0.32~0.60 times compare with no barrier case.

• 한국재료학회지
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• 제13권2호
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• pp.101-105
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• 2003

In this study, we have investigated the availability of the electroless Ni-B plating for a diffusion barrier of the bus electrode. The Ni-B layer of 1$\beta$: thick was electroless deposited on the electroplated Cu bus electrode for AC plasma display. The layer was to encapsulate Cu bus electrode to prevent from its oxidation and to serve as a diffusion barrier against Cu contamination of the transparent dielectric layer in AC plasma display. The microstructure of the as-plated barrier layer was made of an amorphous phase and the structure was converted to crystalline at about 30$0^{\circ}C$. The concentration of boron was about 5∼6 wt.% in the electroless Ni-B deposit regardless of DMAB concentration. The electroless Ni-B deposit was coated on the surface of the electroplated Cu bus electrode uniformly. And the electroless Ni-B plating was found to be an appropriate process to form the diffusion barrier.

• 한국수소및신에너지학회논문집
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• 제34권6호
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• pp.734-740
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• 2023

Hydrogen emphasis on safety management due to its high potential for accidents from wide explosive limits and low ignition energy. To prevent accidents, appropriate explosion-proof electrical equipment with installed to safe management of ignition sources. However, designing all facilities with explosion-proof structures can significantly increase costs and impose limitations. In this study, we optimize the barrier to effectively control the initial momentum in case of hydrogen release and form the control room as a non-hazardous area. We employed response surface method (RSM), the barrier distance, width and height of the barrier were set as variables. The Box-Behnken design method the selection of 15 cases, and FLACS assessed the presence of hazardous area. Analysis of variance (ANOVA) analysis resulting in an optimized barrier area. Through this methodology, the workplace can optimize the barrier according to the actual workplace conditions and classify reasonable hazardous area, which is believed to secure safety in hydrogen facilities and minimize economic burden.