• Journal of the Korean institute of surface engineering
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• v.44 no.2
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• pp.50-54
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• 2011

Hydrophobic a-C:F film was coated on polycarbonate film with $CF_4$, $C_2F_6$ and HFC ($C_2F_4H_2$) gas in helium discharge generated by 5~100 kHz AC power supply at atmospheric pressure and room temperature. The highest water contact angle of the a-C:F film formed with $He/C_2F_6$ mixed gas is $155^{\circ}$. X-ray photoelectron spectrum showed that there was 40% of C-$CF_3$ bond at the surface of the super hydrophobic film. The contact angle and deposition rate were decreased with increasing substrate temperature. The contact angle was generally increased with the surface roughness of the film. The contact angle was high when the surface microstructure of the film was fine and sharp at the similar roughness and chemical composition of the surface.

• Progress in Superconductivity and Cryogenics
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• v.12 no.4
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• pp.17-19
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• 2010

In this work, the optimized process condition of chemical solution deposition which is used to planarize the surface of the metal tape (which is used to grow IBAD-MgO texture template) was investigated. $Y_2O_3$ films were dip-coated on the surface of the unpolished metal tape as the seed and barrier layer. The effects of $Y_2O_3$ concentration of the solution (0.5wt.%, 1.3wt.%, 2.8wt.%, 5.6wt.%) and the number of coatings on the surface morphology and barrier capability against the diffusion from the metal tape were examined. The surface morphology and the thickness of the film were observed using the scanning electron microscope and the atomic force microscope. The presence of elements in metal tape on the film surface was analyzed using the auger electron spectroscopy. The $Y_2O_3$ film thickness increases with increasing the $Y_2O_3$ concentration in the solution, and the surface became smoother with increasing the number of coating cycles. The best result was obtained from the $Y_2O_3$ film coated 4 cycles using 2.8wt.% solution.

• Corrosion Science and Technology
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• v.5 no.4
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• pp.137-140
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• 2006

The effect of pre-existing barrier-type film on porous aluminum oxide film formation during anodization was investigated to control the uniform film growth rate. Initial potential fluctuations during anodization indicated that the breakdown of barrier-film is preceded before the porous formation and the induction time for the porous film growth increases with the increases of pre-existing film thickness. The porous film growth mechanism is lot affected by the presence of barrier film on aluminum surface. In parallel, uniform growth of barrier film underneath the porous structure was attained by two-step anodization processes.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.657-659
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• 2008

Barrier coating properties of PVA/$SiO_2$ on the flexible substrates (PEN) have been investigated. Thin layer of PVA/$SiO_2$ organic-inorganic hybrid materials were deposited on PEN substrate by the spin-coating. The optical properties and surface roughness of barrier layer on flexible substrate were characterized by AFM, UV-Vis and WVTR/ OTR.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11a
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• pp.133-138
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• 2001

Traffic noise is a significant national problem in many communities. Construction of noise barriers has been the most often used mechanism to mitigate vehicle noise for residents next to high density roadways. The most common materials for constructing noise barriers are metal. The character of the wall can be significantly modified by the type of surface treatment used on the wall body. Noise barrier walls can be softened through the use of plants. Greening Noise Barrier helps blend the roadway into the surrounding landscape and provides an interesting and aesthetic view of the road.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.768-769
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• 2008

This paper examines an design of double-barrier rotor structure for improving the efficiency performance in a single-phase line-start permanent magnet(LSPM) motor. By utilizing the advantages of double-barrier rotor design that by increasing reluctance torque generation to compensate magnet torque production, the copper loss reduction is achieved. The optimal approach of response surface methodogy(RSM) is performed for determining a optimum double-barrier rotor structure. The improving of efficiency performance is confirmed by finite element method(FEM) and test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.365-370
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• 2000

Schottky contacts on n-In$\_$0.53//Ga$\_$0.47//As have been made by metal deposition on substrates cooled to a temperature of 77K. The current-voltage and capacitance-voltage characteristics showed that the Schottky diodes formed at low temperature had a much improved barrier height compared to those formed at room temperature. The Schottky barrier height ø$\_$B/ was found to be increased from 0.2eV to 0.6eV with Ag metal. The saturation current density of the low temperature diode was about 4 orders smaller than for the room temperature diode. A current transport mechanism dominated by thermionic emission over the barrier for the low temperature diode was found from current-voltage-temperature measurement. Deep level transient spectroscopy studies exhibited a bulk electron trap at E$\_$c/-0.23eV. The low temperature process appears to reduce metal induced surface damage and may form an MIS (metal-insulator-semiconductor)-like structure at the interface.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.246-246
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• 2010

As the trench width in the interconnect technology decreases down to nano-scale below 50 nm, superconformal gap-filling process of Cu becomes very critical for Cu interconnect. Obtaining superconfomral gap-filling of Cu in the nano-scale trench or via hole using MOCVD is essential to control nucleation and growth of Cu. Therefore, nucleation of Cu must be suppressed near the entrance surface of the trench while Cu layer nucleates and grows at the bottom of the trench. In this study, suppression of Cu nucleation was achieved by treating the Ru barrier metal surface with capacitively coupled hydrogen plasma. Effect of hydrogen plasma pretreatment on Cu nucleation was investigated during MOCVD on atomic-layer deposited (ALD)-Ru barrier surface. It was found that the nucleation and growth of Cu was affected by hydrogen plasma treatment condition. In particular, as the plasma pretreatment time and electrode power increased, Cu nucleation was inhibited. Experimental data suggests that hydrogen atoms from the plasma was implanted onto the Ru surface, which resulted in suppression of Cu nucleation owing to prevention of adsorption of Cu precursor molecules. Due to the hydrogen plasma treatment of the trench on Ru barrier surface, the suppression of Cu nucleation near the entrance of the trenches was achieved and then led to the superconformal gap filling of the nano-scale trenches. In the case for without hydrogen plasma treatments, however, over-grown Cu covered the whole entrance of nano-scale trenches. Detailed mechanism of nucleation suppression and resulting in nano-scale superconformal gap-filling of Cu will be discussed in detail.

• The KSFM Journal of Fluid Machinery
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• v.18 no.3
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• pp.38-45
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• 2015

In this study, two computational methodologies were compared to consider an effective conjugate heat transfer analysis technique for the cooled vane with thermal barrier coating. The first one is the physical modeling method of the TBC layer on the vane surface, which means solid volume of the TBC on the vane surface. The second one is the numerical modeling method of the TBC layer by putting the heat resistance interface condition on the surface between the fluid and solid domains, which means no physical layer on the vane surface. For those two methodologies, conjugate heat transfer analyses were conducted for the cooled vane with TBC layer having various thickness from 0.1 mm to 0.3 mm. Static pressure distributions for two cases show quite similar patterns in the overall region while the physical modeling shows quite a little difference around the throat area. Thermal analyses indicated that the metal temperature distributions are quite similar for both methods. The results show that the numerical modeling method can reduce the computational resources significantly and is quite suitable method to evaluate the overall performance of TBC even though it does not reflect the exact geometry and flow field characteristics on the vane surface.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.