• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.3
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• pp.307-313
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• 2010

In this study, alternative designs for the bends used in district heating pipes are investigated. The district heating pipes, which are subjected to temperatures of 10 to $120^{\circ}C$ and a water pressure of $16\;kgf/cm^2$, have to withstand thermomechanical cyclic loads when in use. These pipes comprise three concentric tubes: a steel pipe (internal), polyurethane (PUR) insulator (middle), and a high-density polyethylene (HDPE) case (external). In addition, the bends in the district heating pipe system are covered with foam pads that cause aging. In this study, an alternative bend design that does not involve the use of a foam pad is proposed to overcome the aging problem in the bends. In the proposed design, "shear rings" are added to the surface of a bend, and its dimensions are determined by a combination of the statistical (Taguchi) method and FEM. The geometrical parameters such as thickness, height, and number of the rings significantly affect the design optimization, and hence, they affect the results of the FEM.

• Journal of the Korean Solar Energy Society
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• v.39 no.4
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• pp.1-9
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• 2019

Modules using 6 inch cells have problems with loss due to empty space between cells. To solve this problem made by shingled structure which can generate more power by utilizing empty space by increasing the voltage level than modules made in 6inch cell. Thus, in this paper, the c-Si cutting cells were produced using nanosecond green laser, and then the ECA was sprayed and cured to perform cutting cell bonding. Three types of ECA materials (B1, B2, B3) with Ag as the main component were used, and experimental conditions varied from 5 to 120 seconds of curing time, 130 to $210^{\circ}C$ of curing temperature, and 1 to 3 of curing numbers. As a results of experiments varying curing time, B1 showed efficiency 19.88% in condition of 60 seconds, B2 showed efficiency 20.15% in 90 seconds, and B3 showed efficiency 20.27% in 60 seconds. In addition, experiments with varying curing temperature, It was confirmed highest efficiency that 20.04% in condition of $170^{\circ}C$ with B1, 20.15% in condition of $150^{\circ}C$ with B2, 20.27% in condition of $150^{\circ}C$ with B3. These are because the Ag particles are densely formed on the surface to make the conduction path. After optimizing the conditions of temperature and curing time, the secondary-tertiary curing experiments were carried out. as the structural analysis, conditions of secondary-tertiary curing showed cracks that due to damp heat aging. As a result, it was found that the ECA B3 had the highest efficiency of 20.27% in condition of 60 seconds of curing time, $150^{\circ}C$ of curing temperature, and single number of curing, and that it was suitable for the manufacture of Solar cell of shingled structure rather than ECA B1 and B2 materials.

• Korean Journal of Food Science and Technology
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• v.48 no.2
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• pp.133-141
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• 2016

The physicochemical properties, antioxidant capacities, and sensory optimization of taro (Colocasia esculenta) under different aging conditions were investigated to develop black taro. Black taro was processed in three steps (steaming: $95{\pm}3^{\circ}C$ for 1 h; aging: 85, 90, $95^{\circ}C$ for 20, 40, and 60 h; drying: $60^{\circ}C$ for 24 h) and ground into a powder for all experiments. Black taro showed an increased crude fiber content and browning index compared to raw taro. Calcium oxalate contents, reducing sugar contents, moisture contents, and lightness values were decreased during the processing of taro. Improvements in total polyphenol content and antioxidant activity (DPPH, ABTS, FRAP) were observed in the black taro samples aged at higher temperature. Response surface methodology was used for sensory optimization, and the optimum aging conditions with the highest acceptance values were found to be $88.73^{\circ}C$ for 39.50 h for taste, and $88.82^{\circ}C$ for 42.60 h for overall acceptance.

• Restorative Dentistry and Endodontics
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• v.27 no.6
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• pp.569-576
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• 2002

This study was peformed to evaluate the interfacial shear bond strength of base (direct and indirect) and repair composites with aging and surface treatment methods. Direct composite resin specimens ($Charisma^{\circledR}$, Heraeus Kulzer, Germany) were aged for 5 min, 1 hour, 24 hours, and 1 week in $37^{\circ}C$ distilled water before surface treatment, and then divided into five groups Group 1, grinding; Group 2, grinding and application of bonding agent, Group 3, grinding, etching with 37% phosphoric acid for 30sec, and application of bonding agent, Group 4, grinding, etching with 37% phosphoric acid for 30sec, silane treatment, and application of bonding agent ; Group 5, grinding, etching with 4% hydrofluoric acid for 30sec. silane treatment, and application of bonding agent. Indirect composite resin specimens ($Artglass^{\circledR}$, Heraeus Kulzer, Germany) were aged for 1 week in $37^{\circ}C$ distilled water and divided into seven groups Group 1 - Group 5, equal to Charisma specimens; Group 6, grinding, etching with 37% phosphoric acid for 60sec, silane treatment, and application of bonding agent; Group7, grinding, etching with 4% hydrofluoric acid for 60 sec, silane treatment, and application of bond-ing agent. The repair material($Charisma^{\circledR}$) was then added on the center of the surface (5 mm in diameter. 5 mm in height). The shear bond strength was tested and the data was analyzed using one-way ANOVA and the Student- Newman-Keuls test. The following conclusions were drawn. 1 The shear bond strength of $Charisma^{\circledR}$ specimens aged for 1 hour was significantly higher in Group 2 and Group 5 than in Group 1 (p<0.05), and that of $Charisma^{\circledR}$ specimens aged for 1 week was signifi-cantly higher in Group 3 and Group 5 than in Group 1 (p<0.05). No significant difference was found in the bond strength of specimens aged for 5 min and 24 hours. 2. In Group 2 of the $Charisma^{\circledR}$ specimens, there was significant difference between the bond strength of 24 hours and that of 1 week (p<0.05). 3. In Group 4 of the $Charisma^{\circledR}$ specimens, the shear bond strength of specimens aged for 24 hours was significantly higher than the others(p<0.05) 4. There was no significant difference between the shear bond strength of the $Artglass^{\circledR}$ specimens, 5. Most of the $Charisma^{\circledR}$ specimens showed cohesive fractures. Artglass^{\circledR}$ specimens that were etched with acid (phosphoric or hydrofluoric) for 30 sec showed more cohesive fractures.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.36 no.1
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• pp.39-47
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• 2016

Repair methods of aging concrete pavement are generally used composite structure pavements, such a composite structure is subjected to a large impact on the mechanical behavior and ensure long-term commonality integrated under vehicle loads, environmental loads of the public in accordance with the bond strength between old and new concrete. A common of bonded concrete overlays that are currently available is Interface arrangements using a variety of equipment to ensure the excellent bond strength between old and new concrete than standard concrete, mixed with a material such as a polymer in order to improve the adhesion with the material itself. However, these method of constructions are being applied, depending on the developer site presents no special specifications apply when a specific application criteria objectively, this is due to the situation of each individual method, which is based on the difficulty in quality control of the site manager. In this study by performing a field test for polymer content via the variables that contribute most significantly to ensure bond strength and the field element core of the interface processing method and materials to ensure bond strength between the old and the new concrete, it was to derive the construction site construction method that can improve the performance of the bond strength through a review of the construction around the correlations and the bond strength according to the effective performance analysis of the conventional surface treatment process and variation of polymer volume fraction.

• Journal of Advanced Navigation Technology
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• v.6 no.3
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• pp.195-202
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• 2002

Recently, as the range of mobile communication services is extended, the interference between adjacent base-stations is increased. Nowdays, one of the important factors causing interference is IMD (Inter-Modulation Distortion) problems. Not only active IMD but also passive IMD effects must be considered to design a CDMA system. In this study, we design and implement 7/16" DIN connectors which have a various intensity of surface illumination, thickness and quality of plating material to analyze the effects of PIMD. And propose the methods for improving the PIMD characteristics: First, it is more profitable to use the metal which has good intensity of surface illumination where most of all electric currents passes through it. Secondly, we should plate metals more than $5{\mu}m$ for RF energy enough to propagate in a medium. Thirdly, it is necessary to select a metal having high conductivity and specific heat to protect the aging phenomenon of plate material. And it is required to develop a new plating material to replace the current materials, such as the alloy of three components for cost reduction. We have to know that the plate which has intensity of surface illumination 6 S and the thickness of plating material $5{\mu}m$ satisfy the domestic PIMD specification (KTF) -150 dBc, regardless of the plate material in case of 7/16" DIN connector.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.2
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• pp.302-322
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• 1998

This study was accompolished to analyze and compare the number and area of the occlusal contact points in healthy volunteers and athletes with normal occlusion. For this study, 15 athletes(13 amles and 2 females with average age 20) and 21 healthy volunteers(14 mles and 7 females with average age 20.09) were selected. The visual display acquired by scanning of occlusal record in maximal intercuspation was converted into 16 gray value image. Then, using computer program(J & Lee Occlusal Analyser), the pixel which was in definite range of the gray value was recognized, and the numbers of recognized pixel were calculated to area. The results were as follows ; 1. The average numbers of total occlusal contact feints were 31.05 in control group, and 34.67 in athlete group. The average area of total occlusal contacts was $100.25mm^2$ in control group, and $127.78mm^2$ in athlete group. 2. In control group, the average numbers of occlusal contact points were revealed in order as follows ; the first molar(8.48), the second molar(8.24), the second premolar(4.71), the lateral incisor(2.90), the first premor(2.43), the central incisor(2.19), and the canine(2.1). The least average in canine(2.1) was similar to the average(2.19) in central incisor and (2.09) in lateral incisor. In athlete group, the average numbers of occlusal contact points were revealed in order as follows ; the first molar(8.97), the second molar(8.47), the second premolar(5.60), the canine(3.80), the lateral incisor(3.33), the first premolar(2.67), and the central incisor(1.93). 3. In control group, the average areas of occlusal contact surface were revealed in order as follows ; the first molar($39.47mm^3$), the second molar($37.54mm^3$), the second premolar($9.54mm^3$) the first premolar($6.18mm^3$), canine($3.49mm^3$), the central incisor($2.76mm^3$), and the lateral incisor($1.28mm^3$). In athlete group, the average areas of occlusal contact surface were revealed in order as follows ; the first molar($44.11mm^3$), the second molar($40.69mm^3$), the second premolar($16.50mm^3$), the first premolar($9.39mm^3$), the canine($5.08mm^3$), the lateral incisor($3.7mm^3$), and the central incisor($2.25mm^3$). 4. With aging in both control and athlete group, there was a decreasing tendancy in average number of occlusal contact point, and was an increasing tendancy in average area of occlusal contact surface. In comparison at each age, both the numbers and area of occlusal contact were greater in athlete group than in control group. It was not significant in the numbers of occlusal contact points beween athlete and control group(p>0.1), but significant in the area of occlusal contact surface(p<0.03). 5. In comparision as to the kind of sports(Gymnastics : 2, Rugby : 3, Soccor : 5, Ice hocky : 5), the numbers of occlusal contact points were the most in ice hocky, and the area of occlusal contact surface was the greatest in gymnastics. With increasing a career in athlete group, there was a decreasing tendancy in average numbers of occlusal contact points and was an increasing tendancy in average area of occlusal contact surface. 6. By T-scan analyzing, the contact numbers on the anterior teeth were greater in control group than in athlete group, and on the posterior teeth were greater in athlete group than in control group. And the results acquired by T-scan were lesser than that caquired by the silicone bite records. It was not significant in the posterior teeth, but significant in the anterior teeth. In T-scan records, the numbers of occlusal contact points on second molar were the greatest, but in the silicone records, the numbers on first molar were the greatest.

• Journal of Dental Rehabilitation and Applied Science
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• v.18 no.4
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• pp.235-249
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• 2002

This study was accompolished to analyze and compare the number and area of the occlusal contact points in healthy volunteers and athletes with normal occlusion. Before the study, 89 athletes(sports career:8.6 years, average age 20) at Kyung Hee University were selected, and survey was accomplished for athlete's recognition about sports dentistry. For this study, 15 athletes(13 amles and 2 females with average age 20) and 21 healthy volunteers(14 mles and 7 females with average age 20.09) at Kyung Hee University were selected. The visual display acquired by scanning of occlusal record in maximal intercuspation was converted into 16 gray value image. Then, using computer program(J & Lee Occlusal Analyser), the pixel which was in definite range of the gray value was recognized, and the numbers of recognized pixel were calculated to area. The results were as follows : (1) On the survey about sports dentistry, 28% of 89 athletes didn't agree that human occlusion may be important, and 30% didn't have any idea of the influence of human occlusion during their sports activities. (2) The average numbers of total occlusal contact points were 31.05 in control group, and 34.67 in athlete group. The average area of total occlusal contacts was $100.25mm^2$ in control group, and $127.78mm^2$ in athlete group. (3) In control group, the average numbers of occlusal contact points were revealed in order as follows; the first molar(8.48), the second molar(8.24), the second premolar(4.71), the lateral incisor(2.90), the first premor(2.43), the central incisor(2.19), and the canine(2.1). The least average in canine(2.1) was similar to the average(2.19) in central incisor and (2.09) in lateral incisor. In athlete group, the average numbers of occlusal contact points were revealed in order as follows; the first molar(8.87), the second molar(8.47), the second premolar(5.60), the canine(3.80), the lateral incisor(3.33), the first premolar(2.67), and the central incisor(1.93). (4) In control group, the average areas of occlusal contact surface were revealed in order as follows; the first molar($39.47mm^3$), the second molar($37.54mm^3$), the second premolar($9.54mm^3$) the first premolar($6.18mm^3$), canine($3.49mm^3$), the central incisor($2.76mm^3$), and the lateral incisor($1.28mm^3$). In athlete group, the average areas of occlusal contact surface were revealed in order as follows; the first molar($44.11mm^3$), the second molar($40.69mm^3$), the second premolar($16.50mm^3$), the first premolar($9.39mm^3$), the canine($5.08mm^3$), the lateral incisor($3.7mm^3$), and the central incisor($2.25mm^3$). (5). With aging in both control and athlete group, there was a decreasing tendancy in average number of occlusal contact point, and was an increasing tendancy in average area of occlusal contact surface. In comparison at each age, both the numbers and area of occlusal contact were greater in athlete group than in control group. It was not significant in the numbers of occlusal contact points beween athlete and control group(p>0.1), but significant in the area of occlusal contact surface(p<0.05). (6) In comparision as to the kind of sports(Gymnastics:2, Rugby:3, Soccor:5, Ice hocky:5), the numbers of occlusal contact points were the most in ice hocky, and the area of occlusal contact surface was the greatest in gymnastics. With increasing a career in athlete group, there was a decreasing tendancy in average numbers of occlusal contact points, and was an increasing tendancy in average area of occlusal contact surface.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.