• Progress in Superconductivity
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• 제4권2호
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• pp.180-183
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• 2003

We evaluated the effect of alloying-element additions to Ag sheath on thermal conductivity of Bi-2223 superconductor tapes. In order to evaluate the effect of sheath alloys and their configuration on the properties of tape, various combinations of Ag and Ag alloys were selected as inner and outer sheath. Thermal conductivity of the tapes was measured by using thermal integral method at 10∼120 K. It is observed that the presence of alloying-elements such as Mg, Sb, and Au in Ag sheath results in decreased thermal conductivity at low temperature. Specifically, the thermal conductivity of AgMg, AgSb, and AgAu at 40 K were 411.4, 142.3, and 109.7 W/(m·K), respectively, which is about 2∼9 times lower than that of Ag (1004.6 W/(m·K)). In addition, the thermal conductivity of alloy-sheathed tape was significantly dependent on their values of constituent sheath materials.

• 한국전기전자재료학회논문지
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• 제13권3호
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• pp.241-246
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• 2000

We fabricated Bi-2223 multi-filaments superconductor tape and evaluated the effect of twisting on the microstructural evolution and critical current. Twist pitches of the tapes are in the range of 70- 8mm and uniformly deformed. It was observed that grain size and the degree of texture decreased as decreasing pitch probably due to the formation of the irregular interface between Ag and filaments. In addition critical current of the tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tape(12.5 A). These reduction of critical current may be related to the interface irregularity smaller grain size worse texture and the presence of cracks due to the induced strain during twisting processing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.69-72
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• 1999

A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

• 한국초전도ㆍ저온공학회논문지
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• 제12권2호
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2002년도 학술대회 논문집
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• pp.153-155
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• 2002

The thermal conductivity of Ag and Ag alloys at low temperature (10~110 K) were evaluated by direct measurement technique. It was observed that thermal conductivity decreased with increasing the content of alloying elements such as Mg and Cu. Thermal conductivity of pure Ag tape at 20 K was measured to be 2794 W/m$\cdot$K. On the other hand, the corresponding values of Ag/Al tape and Ag/Al/sus315L tape were 1235 and 352 W/m$\cdot$K, respectively, indicating 2 to 8 times lower than that of pure Ag tape.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 1999년도 제1회 학술대회논문집(KIASC 1st conference 99)
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• pp.18-21
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• 1999

The effects of joining process such as contact method, shape of joined area and pressure on the properties of Bi-2223 superconducting tape have been optimized. In the process tapes were etched to expose the superconductor core in the shape of 'ㅁ' and 'ㄷ'. The exposed cores of the two tapes were brought into contact, uniaxially pressed and sintered. Subsequently, the current capacity of the joined tape was measured as a function of uniaxial pressure. It was observed that the current capacity was significantly dependent on uniaxial pressure. The joined tape, fabricated with a pressure of 1,600 MPa, showed the highest value of current capacity(90%) of highest value of current capacity is resulted from improvements in core density, contacting area and grain alignment, etc. In addition the effect of processing variables on microstructural evolution and mechanical property of joined tape will be presented.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 B
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• pp.1225-1227
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• 2005

A Bi-2223 tape has beer developed for power applications such as a fault current limiter, a power cable and a superconducting magnetic energy storage system. In such applications, the Bi-2223 tape carries time varying transport current and in addition experiences time varying external magnetic field. It is well known that the external magnetic field not only causes magnetization loss in the Bi-2223 tape, but also drastically increases transport loss due to a so-called "dynamic resistance". We developed an evaluation setup, which can measure transport loss in external at magnetic fields. Using this equipment, we measured the dynamic resistances for various amplitudes and frequencies of an external ac magnetic field perpendicular to the face in the tape. Simultaneously we investigated the effect of an external ac field on transport loss with different experimental conditions. This paper describes test results and discussions on correlation between the dynamic resistance and the transport loss for the Bi-2223 tape.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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• pp.378-382
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• 1999

We evaluated the effect of joining process such as contact method, shape of joined area and pressure on the electrical property of Bi-2223 superconducting tape. It was observed that the current capacity was reduced at the transition area of the joined tape and was significantly dependent on the uniaxial pressure. The lap-joined tape, fabricated with a pressure of 1,000-1,600 MPa, show the highest value of current capacity(80-90%) of the tape itself. It is believed the highest value of current capacity results from improvement in core density, contacting area and grain alignment, etc. In addition, the irreversible strain( ${\varepsilon}$ irrev) for the joined tape· was measured to be 0.1%, smaller than that of enjoined tape( ${\varepsilon}$ irrev = 0.3%). The decrease in the strength and irreversible strain for joined tape is believed to be due to the irregular geometry/morphology of the transition area of the tape.

• 한국전기전자재료학회논문지
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• 제20권7호
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• pp.626-630
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• 2007

The AC loss is an important issue in the design of the high temperature superconductor (HTS) power cables and fault current limiters. In these applications, a cylindrical HTS conductor is often used. In commercialization of these apparatuses, AC loss is a critical factor but not elucidated completely because of complexities in its measurement, e.g. non-uniform current distribution and phase difference between currents flowing in an individual HTS tape. We have prepared two cylindrical conductors composed of a Bi-2223 tape with different critical current density. In this paper, the AC loss characteristics of the conductors have been experimentally investigated and numerically analyzed. The result show that the measured losses for two conductors are not dependent on both arrangements and contact positions of a voltage lead. This implies that most of loss flux is only in the conductors. The loss for the Bi-2223 conductor with low critical current density is in good agreement with the calculated loss from Monoblock model, whereas the loss measured for the Bi-2223 conductor with high critical current density doesn't coincide with the loss calculated from the Monoblock model. The measured loss is also different from numerically calculated one based on the polygon model especially in low transport current.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2001년도 학술대회 논문집
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• pp.6-8
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• 2001

We evaluated the degree of texture through depth of the superconductor core of Bi-Sr-Ca-Cu-O(BSCCO) superconductor tape. The degree of texture was characterized by pole figure analysis, indicating that the degree of texture varied significantly with depth of the superconductor core. It was observed that the degree of texture was higher near the interface than inside the superconducting core. Based on the result of degree of texture, the region near the interface is thought to carry significant current compared to that inside the core.