• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.11a
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• pp.153-154
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• 2020

This study aims to find out the reason that tile adhesive(type III) for ceramic tile does not harden under some conditions especially high humidity even though long curing time. Bonding strength of adhesive between substrate and ceramic tile is evaluated depending on bonding conditions such as substrate kind(concrete, board), bonding material (tile adhesive, tile cement) and curing condition(humidity 50, 70%). Based on the results, this study aimed to establish the quality of tile adhesion strength under the relevant conditions.

• Journal of Korea Foundry Society
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• v.13 no.5
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• pp.476-483
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• 1993

The influence of substrate materials on the degree of basal porosity during spray casting process has been investigated. Different conditions of droplet spreading on the substrate were induced by varying the substrate material. Flat sections of cast iron and aluminum have been spray deposited via spray casting process onto an aluminum substrate, a low carbon steel substrate, and an alumina based refractory substrate. Results for cast iron and aluminum sprayed onto the aluminum substrate showed significant improvements in the surface condition and degree of basal porosity with evidence of substrate deformation that round pits ranging from $5{\mu}m$ to $20{\mu}m$ in diameter are distributed on the surface of aluminum substrate. The lowest level of porosity was developed in alumina based refractory material. Several mechanisms for porosity formation were discussed with droplet impact pressure and droplet spreading. Adopting a spray cutting mechanism for removing the periphery of spray cone, porosity level was remarkably decreased.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.336-341
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• 2008

Recently, research on a flat panel display(FPD) has focused on organic light-emitting display(OLED) which has wide angle of view, high contrast ratio and low power consumption. ITO(Indium-Tin-Oxide) films are the most widely used material as a transparent electrode of OLED and also in many other display devices like LCD or PDP. The performance and efficiency of OLED is related to the surface condition of ITO coated glass substrate. The typical surface defect of glass substrate is measured for electric characteristics and physical condition for transmittance and roughness. Since ITO coated glass substrate can be destroyed for inspection about surface roughness, sheet resistance, film thickness and transmittance, precise fabrication condition should be made based on the estimated relationship. In this paper, ITO films were prepared on the commercial glass substrate by the Ion-Plating method changing the partial pressure of gas(Ar, 02) and the chamber temperature between $200^{\circ}C$ and $300^{\circ}C$. The characteristics of films were examined by the 4-point probe, supersonic thickness measurement, transmittance measurement and AFM. We estimated the relationship between processing parameters(Ar gas, O2 gas, Temperature) and properties of ITO films (Sheet Resistance, Film Thickness, Transmittance, Surface Roughness).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.5
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• pp.411-414
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• 2009

It has been investigated for the film uniformity and deposition rate of a-C:H films on glass substrate and polymeric materials in the presence of the modulated crossed magnetic field. We used Plasma CVD, i.e, using a crossed electromagnetic field, for uniform depositing thin film. The optimum discharge condition has been discussed for the gas pressure, the magnetic flux density and the distance between substrate and electrodes, As a result, it is found that the optimum discharge conditions are $CH_4$ concentration $CH_4$=10 %, modulated magnetic flux density B=48 Gauss, pressure P=100 mTorr, discharge power supply voltage V=l kV under these experimental conditions. By using these experimental condition, it is possible to prepare the most uniform film extends over about 160 mm of the film width. In this study, we deposited a-C:H thin film on glass substrate, and have a plan that using this condition, study depositing a-C:H thin film on polymeric substrate in next studies.

• Tribology and Lubricants
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• v.37 no.5
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• pp.195-202
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• 2021

This paper presents a numerical analysis of the lubrication characteristics of condensed water molecules on a solid surface by conducting molecular dynamics simulations. We examine two models consisting of a simple hexahedral substrate with and without water molecules to reveal the lubrication mechanism of mono-layered water molecules. We perform a sliding simulation by contacting and translating a single asperity on the substrate under various normal loads. During the simulation, we measure the friction coefficient and atomic stress. When water molecules were interleaved between solid surfaces, atomic stress exerted on individual atom and friction coefficient were smaller than those of model without water molecule. Particularly, at a low load, the efficacy of water molecules in the reduction of atomic stress and friction is remarkable. Conversely, at high loads, water molecules rarely lubricate solid surfaces and fail to effectively distribute the contact stress. We found a critical condition in which the lubrication regime changes and beyond the condition, significant plastic deformation was created. Consequently, we deduce that water molecules can distribute and reduce contact stress within a certain condition. The reduced contact stress prevents plastic deformation of the substrate and thus diminishes the mechanical interlocking between the asperity and the substrate.

• 연구논문집
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• s.27
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• pp.183-200
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• 1997

We have calculated the energy of three distinct grain configurations, namely completely connected, partially connected and unconnected configurations, evolving during a spheroidization of polycrystalline thin film by extending a geometrical model due to Miller et al. to the case of spheroidization at both the surface and film-substrate interface. "Stabilitl" diagram defining a stable region of each grain configuration has been established in terms of the ratio of grain size to film thickness vs. equilibrium wetting or dihedral angles at various interface energy conditions. The occurrence of spheroidization at the film-substrate interface significantly enlarges the stable region of unconnected grain configuration thereby greatly facilitating the occurrence of agglomeration. Complete separation of grain boundary is increasingly difficult with a reduction of equilibrium wetting angle. The condition for the occurrence of agglomeration differs depending on the equilibrium wetting or dihedral angles. The agglomeration occurs, at low equilibrium angles, via partially connected configuration containing stable holes centered at grain boundary vertices, whereas it occurs directly via completely connected configuration at large equilibrium angles except for the case having small surface and/or film-substrate interface energy. The initiation condition of agglomeration is defined by the equilibrium boundary condition between the partially connected and unconnected configurations for the former case, whereas it can, for the latter case, largely deviate from the equilibrium boundary condition between the completely connected and unconnected configurations because of the presence of a finite energy barrier to overcome to reach the unconnected grain configuration.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.05a
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• pp.979-984
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• 2001

Poor water-proofing integrity is related to many factors : site procedure, workmanship, weather. substrate conditions, installation(including asphalt application) conditions. The evaluation of adhesive properties tested by concrete surface moisture and asphalt application was based on laboratory test and observations. This report describes the pull-off test results of waterproofing systems currently used for installing and reparing for concrete bridge decks. The test results showed that the moisture condition fully affected the adhesive properties of sheet membranes and sealer but partially for liquid membranes.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.1
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• pp.92-99
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• 1994

Diamond thin film was deposited on n type (100) Si substrate by MPECVD(Microwave plasma Enhanced Chemical Vapor Deposition). For the increase in nucleation density of diamond, Si substrate was pretreated by diamond powder or negative bias voltage was applied to the substrate during the initial deposition. In the case of retreated Si substrate, the diamond thin film quality was enhanced with increasing the total pressure in the range of 20~150 Torr. For the negative bias voltage, the formation condition of the diamond was seriously affected by $CH_4$ concentration and total pressure. The formation condition will be discussed with electrical current of substrate generated by plasma ions which depend on $CH_4$concentration, bias voltage, and total pressure.

• Journal of the Korea Concrete Institute
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• v.13 no.5
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• pp.507-515
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• 2001

Significant improvements in bond strength between new and existing concrete can be achieved through the modification of the new concrete by latex. This study focuses on the investigation of bond strength of latex modified concrete. Pull-out bond test and uniaxial direct tensile bond test are adopted for evaluating the adhesion characteristics of latex modified concrete to conventional concrete substrate. The main experimental variables are test methods, latex-cement ratio, surface preparations and moisture levels. The results are as follows; The increase of latex-cement ratio substantially improves the adhesion between latex modified concrete and substrate. The effects of surface preparation at substrate into the bonding of latex modified concrete are quite different according to the conditions of surfaces. Thus, an adequate surface preparations are essential for good bond strength. Because the moisture level of the substrate may be critical to achieving bond, optimum moisture condition for a conventional concrete has evaluated in this study. The saturated condition of surface is the most appropriate moisture level among the considered, followed by dry condition and wet condition.

• Journal of the Korean institute of surface engineering
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• v.28 no.5
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• pp.309-319
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• 1995

The substrate patterned with the dry film has the cavity which has the $90^{\circ}$ wall angle. Electroplating Cu on this patterned substrate has the differrent shape history with the electrochemical parameters. By potential theory model, the reason of the variation of the shape change with the these parameters was investigated. The shape history could be explained by the current flow and the correlated area effects. By embedding the Ni layer between the Cu layers, shape history with the time was obtained experimentally and the results was compared with the numerical analysis by BEM. The adhesive Cr-Cu film in TAB application was etched with the various condition. The best condition for the etchant of the Cr-Cu film was found.