• Title/Summary/Keyword: strong thin layer

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Vibration Analysis of the Sandwich Plates with very thin faces (얇은 면재를 갖는 샌드위치 평판의 진동해석)

  • In-Kyu Park;Ik-Tai Kim;Choong-Yul Son
    • Journal of the Society of Naval Architects of Korea
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    • v.30 no.1
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    • pp.134-144
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    • 1993
  • Sandwich plate is consisted of equal two isotropic, thin, stiff and strong sheets of dense material separated symmetrically by an isotropic thick layer which may be much less stiff and strong. This study analyzed the dependency of the natural frequencies and mode shapes of sandwich plates on material properties, thicknesses of faces and cores, and various boundary conditions using Rayleigh-Ritz method. E-glass Woven Roving and another two kinds of materials were selected as a face, P.V.C. and another kinds of materials were selected as a core. Natural frequencies and mode shapes obtained by Rayleigh-Ritz method were compared with F.E.M. solutions using ADINA program.

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Shape anisotropy and magnetic properties of Co/Ni anti-dot arrays

  • Deshpande, N.G.;Seo, M.S.;Kim, J.M.;Lee, S.J.;Lee, Y.P.;Rhee, J.Y.;Kim, K.W.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.444-444
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    • 2011
  • Recently, patterned magnetic films and elements attract a wide interest due to their technological potentials in ultrahigh-density magnetic recording and spintronic devices. Among those patterned magnetic structures, magnetic anti-dot patterning induces a strong shape anisotropy in the film, which can control the magnetic properties such as coercivity, permeability, magnetization reversal process, and magneto-resistance. While majority of the previous works have been concentrated on anti-dot arrays with a single magnetic layer, there has been little work on multilayered anti-dot arrays. In this work, we report on study of the magnetic properties of bilayered anti-dot system consisting of upper perforated Co layer of 40 nm and lower continuous Ni layer of 5 nm thick, fabricated by photolithography and wet-etching processes. The magnetic hysteresis (M-H) loops were measured with a superconducting-quantum-interference-device (SQUID) magnetometer (Quantum Design: MPMS). For comparison, investigations on continuous Co thin film and single-layer Co anti-dot arrays were also performed. The magnetic-domain configuration has been measured by using a magnetic force microscope (PSIA: XE-100) equipped with magnetic tips (Nanosensors). An external electromagnet was employed while obtaining the MFM images. The MFM images revealed well-defined periodic domain networks which arise owing to the anisotropies such as magnetic uniaxial anisotropy, configurational anisotropy, etc. The inclusion of holes in a uniform magnetic film and the insertion of a uniform thin Ni layer, drastically affected the coercivity as compared with single Co anti-dot array, without severely affecting the saturation magnetization ($M_s$). The observed changes in the magnetic properties are closely related to the patterning that hinders the domain-wall motion as well as to the magneto-anisotropic bilayer structure.

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The Properties of GaN Grown by BVPE Method on the Si(111) Substrate with Pre-deposited Al Layer (Al 박막이 증착 된 Si(111) 기판 위에 HVPE 방법으로 성장한 GaN의 특성)

  • Shin Dae Hyun;Baek Shin Young;Lee Chang Min;Yi Sam Nyung;Kang Nam Lyong;Park Seoung Hwan
    • Journal of the Korean Vacuum Society
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    • v.14 no.4
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    • pp.201-206
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    • 2005
  • In this work, we tried to improve the fabrication process in HVPE (Hydride Vapor Phase Epitaxy) system by using Si(111) substrate with pre-deposited Al layer. PL measurements was done for samples with and without pre-deposited Al on Si and it was also examined the dependence of the optical characteristic properties on AlN buffer thickness for GaN/AIN/Al/Si. A sample with thin Al nucleation layer on Si substrate reveals a better optical property than the other. And it suggests that the thickness for AlN buffer layer with thin Al nucleation layer on Si(111) substrate is most proper about $260{\AA}$ to grow GaN in HVPE system. The surface morphology of GaN clearly shows the hexagonal crystallization. The XRD pattern showed strong peak at GaN{0001} direction.

Characteristics of MOCVD Cobalt on ALD Tantalum Nitride Layer Using $H_2/NH_3$ Gas as a Reactant

  • Park, Jae-Hyeong;Han, Dong-Seok;Mun, Dae-Yong;Yun, Don-Gyu;Park, Jong-Wan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.377-377
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    • 2012
  • Microprocessor technology now relies on copper for most of its electrical interconnections. Because of the high diffusivity of copper, Atomic layer deposition (ALD) $TaN_x$ is used as a diffusion barrier to prevent copper diffusion into the Si or $SiO_2$. Another problem with copper is that it has weak adhesion to most materials. Strong adhesion to copper is an essential characteristic for the new barrier layer because copper films prepared by electroplating peel off easily in the damascene process. Thus adhesion-enhancing layer of cobalt is placed between the $TaN_x$ and the copper. Because, cobalt has strong adhesion to the copper layer and possible seedless electro-plating of copper. Until now, metal film has generally been deposited by physical vapor deposition. However, one draw-back of this method is poor step coverage in applications of ultralarge-scale integration metallization technology. Metal organic chemical vapor deposition (MOCVD) is a good approach to address this problem. In addition, the MOCVD method has several advantages, such as conformal coverage, uniform deposition over large substrate areas and less substrate damage. For this reasons, cobalt films have been studied using MOCVD and various metal-organic precursors. In this study, we used $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) as a cobalt precursor because of its high vapor pressure and volatility, a liquid state and its excellent thermal stability under normal conditions. Furthermore, the cobalt film was also deposited at various $H_2/NH_3$ gas ratio(1, 1:1,2,6,8) producing pure cobalt thin films with excellent conformality. Compared to MOCVD cobalt using $H_2$ gas as a reactant, the cobalt thin film deposited by MOCVD using $H_2$ with $NH_3$ showed a low roughness, a low resistivity, and a low carbon impurity. It was found that Co/$TaN_x$ film can achieve a low resistivity of $90{\mu}{\Omega}-cm$, a low root-mean-square roughness of 0.97 nm at a growth temperature of $150^{\circ}C$ and a low carbon impurity of 4~6% carbon concentration.

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The Physical Properties and Efficiencies of Cu(In,Ga)Se2 Thin Films Depending on the Mo:Na Thickness (Mo:Na 두께에 따른 Cu(In,Ga)Se2 박막의 물성과 효율변화)

  • Shin, Younhak;Kim, Myunghan
    • Korean Journal of Materials Research
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    • v.24 no.3
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    • pp.123-128
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    • 2014
  • To realize high-performance thin film solar cells, we prepared CIGS by the co-evaporation technique on both sodalime and Corning glass substrates. The structural and efficient properties were investigated by varying the thickness of the Mo:Na layer, where the total thickness of the back contact was fixed at 1${\mu}m$. As a result, when the Mo:Na thickness was 300 nm on soda-lime glass, the measured Na content was 0.28 %, the surface morphology was a plate-like compact structure, and the crystallinity by XRD showed a strong peak of (112) preferential orientation together with relatively intense (220) and (204) peaks as the secondary phases influenced crystal formation. In addition, the substrates on soda-lime glass effected the lowest surface roughness of 2.76 nm and the highest carrier density and short circuit current. Through the optimization of the Mo:Na layer, a solar conversion efficiency of 11.34% was achieved. When using the Corning glass, a rather low conversion efficiency of 9.59% was obtained. To determine the effects of the concentration of sodium and in order to develop a highefficiency solar cells, a very small amount of sodium was added to the soda lime glass substrate.

THIN FILM ADHESION IN Cu/Cr/POLYIMIDE AND Cu/Cu-Cr/POLYIMIDE SYSTEMS

  • Joh, Cheol-Ho;Kim, Young-Ho;Oh, Tae-Sung;Park, Ik-Sung;Yu, Jin
    • Journal of the Korean institute of surface engineering
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    • v.29 no.5
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    • pp.379-385
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    • 1996
  • Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

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Wind loading of a finite prism: aspect ratio, incidence and boundary layer thickness effects

  • Heng, Herman;Sumner, David
    • Wind and Structures
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    • v.31 no.3
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    • pp.255-267
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    • 2020
  • A systematic set of low-speed wind tunnel experiments was performed at Re = 6.5×104 and 1.1×105 to study the mean wind loading experienced by surface-mounted finite-height square prisms for different aspect ratios, incidence angles, and boundary layer thicknesses. The aspect ratio of the prism was varied from AR = 1 to 11 in small increments and the incidence angle was changed from α = 0° to 45° in increments of 1°. Two different boundary layer thicknesses were used: a thin boundary layer with δ/D = 0.8 and a thick boundary layer with δ/D = 2.0-2.2. The mean drag and lift coefficients were strong functions of AR, α, and δ/D, while the Strouhal number was mostly influenced by α. The critical incidence angle, at which the prism experiences minimum drag, maximum lift, and highest vortex shedding frequency, increased with AR, converged to a value of αc = 18° ± 2° once AR was sufficiently high, and was relatively insensitive to changes in δ/D. A local maximum value of mean drag coefficient was identified for higher-AR prisms at low α. The overall behaviour of the force coefficients and Strouhal number with AR suggests the possibility of three flow regimes.

High Performance Amorphous Silicon Oxide Thin Film Solar Cells Fabricated at Very Low Temperature (극저온에서 증착된 비정질실리콘 산화막 기반의 고성능 박막태양전지)

  • Kang, Dong-Won
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.65 no.10
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    • pp.1694-1696
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    • 2016
  • Present thin film solar cells with hydrogenated amorphous silicon oxide (a-SiO:H) as an absorber suffer from low fill factor(FF) of 61~64 [%] in spite of its benefits related to high open circuit voltage ($V_{oc}$). Since degraded quality of a-SiO:H absorber by alloying with oxygen can affect the FF, we aimed to achieve high photosensitivity by minimizing $CO_2$ gas addition. Improving optical gap($E_{opt}$) has been attained by strong hydrogen dilution combined with lowering substrate temperature down to 100 [$^{\circ}C$]. Small amount of the $CO_2$ was added in order to disturb microcrystalline formation by high hydrogen dilution. The developed a-SiO:H has high photosensitivity (${\sim}2{\times}10^5$) and high $E_{opt}$ of 1.85 [eV], which contributed to attain remarkable FF of 74 [%] and high $V_{oc}$ (>1 [V]). As a result, high power conversion efficiency of 7.18 [%] was demonstrated by using very thin absorber layer of only 100 [nm], even though we processed all experiment at extremely low temperature of 100 [$^{\circ}C$].

Electrical Properties and Reliability of CdS Thin Film Deposited by R.F. Sputtering (유연성 기판위에 스퍼터링 방법으로 증착한 CdS 박막의 전기적 특성 및 신뢰성 평가)

  • Hur, Sung-Gi;Hwang, Mi-Na;Ahn, Jun-Ku;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.26-26
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    • 2010
  • Cadmium sulfide (CdS) thin film for flexible optical device applications were prepared at $H_2(Ar+H_2)$ flow ratios on polyethersulfon(PES) flexible polymer substrates at room temperature by radio frequency magnetron sputtering technique. The CdS thin films deposited at room temperature showed a (002) preferred orientation and the smooth surface morphologies. Films deposited at a hydrogen flow ratio of 25% exhibited a photo- and dark-sheet resistance of about 50 and $2.7{\times}10^5{\Omega}$/square, respectively. From the result of the bending test, CdS films exhibit a strong adhesion with the PES polymer substrates and the $Al_2O_3$ passivation layer deposited on the CdS films only shows an increase of the resistance of 8.4% after exposure for 120 h in air atmosphere.

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Effects of Ultrathin Co Insertion Layer on Magnetic Anisotropy and GMR Properties of NiFe/Cu/Co Spin Valve Thin Films (NiFe/Cu 계면에 삽입된 Co 층이 NiFe/Cu/Co 스핀밸브 박막의 거대자기저항 특성과 자기이방성에 미치는 영향)

  • 김형준;조권구;주승기
    • Journal of the Korean Magnetics Society
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    • v.9 no.5
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    • pp.251-255
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    • 1999
  • NiFe(60 $\AA$)/Co(0$\AA$$\leq$x$\AA$$\leq$15$\AA$)/Cu(60$\AA$)/Co(30$\AA$) spin valve thin films were prepared on 4$^{\circ}$ tilt-cut Si(111) substrates with a 50 $\AA$ thick Cu underlayer without applying any external magnetic field during the deposition, and the effects of inserted ultrathin Co layer on magnetic anisotropy and GMR properties of the NiFe(60 $\AA$)/Cu(60$\AA$)/Co(30$\AA$) spin valves were investigated. As the ultrathin Co layer was inserted into the NiFe/Cu interface of the spin valves, GMR ratio was increased from about 1.5% to 3.5%, and the easy axis of NiFe(60 $\AA$) layer was rotated by 90$^{\circ}$. Accordingly, it was aligned along the same direction with the easy axis of Co(30 $\AA$)layer. Therefore, squared R-H curves was obtained in the spin valves, which is favorable properties for the digital GMR devices such as MRAM. In order to investigate the change of magnetic anisotropy of NiFe layer of the spin valves in more details,XRD measurement was performed using NiFe(500 $\AA$) and NiFe(500 $\AA$)/Co(10 $\AA$) thin films on the same templates. Strong (220) NiFe peak was observed in both films regardless of the inserted Co layer, so it was thought that the variation of magnetic anisotropy of NiFe layer is from the interface effect, the change of interface from NiFe/Cu to NiFe/Co, rather than the volume effect such as the change of magnetocrystalline effect.

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