• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.739-742
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• 2005

In this paper, an efficient detection algorithm for the flicker, which is caused by mismatching between light frequency and exposure time at CMOS image sensor (CIS), is proposed. The flicker detection can be implemented by specific hardware or complex signal processing logic. However it is difficult to implement on single chip image sensor, which has pixel, CDS, ADC, and ISP on a die, because of limited die area. Thus for the flicker detection, the simple algorithm and high accuracy should be achieved on single chip image sensor,. To satisfy these purposes, the proposed algorithm organizes only simple operation, which calculates the subtraction of horizontal luminance mean between continuous two frames. This algorithm was verified with MATLAB and Xilinx FPGA, and it is implemented with Magnachip 0.18 standard cell library. As a result, the accuracy is 95% in average on FPGA emulation and the consumed gate count is about 7,500 gates (@40MHz) for implementation using Magnachip 0.18 process.

• Design & Manufacturing
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• v.8 no.2
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• pp.12-17
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• 2014

Currently, injection molding process is a very useful technique that be applied to many field. And injection molding technology has been commercial based on many studies. However, there is no standard of surface roughness because there are few studies about surface technology of injection product. In addition, when designing the mold, changes of the core surface and the injection conditions are not considered. In this paper, change of surface according to the core and the injection conditions was compared with the surface of the injection product. Accumulation of these technologies will propose direction in mold design, manufacturing and injection molding technology.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.1
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• pp.63-73
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• 2001

This paper presents a process and operation planning system with an NC code post-processor for effective machining of press dies for production of cars. Based on the machining features, major parts of press dies are categorized into 15 groups and a standard process plan is defined for each group. The standard process plan consists of a series of processes where a process is defined as a group of operations that can be done with one setup. Details such as cutting tools, cutting conditions, and tool paths are decided at the operation planning stage. At the final stage of process and operation planning, the NC code post-processor we developed adjusts feedrates along the tool path to reduce machining time. The adjustment rule is selected based on the metal removal rate estimated by virtually machining with virtual cutting tool.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.2
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• pp.349-355
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• 2017

Bending work using press dies involves bending a flat blank to a desired angle. The bending produces a flange (the bent part) and a web (the unbent part). The bending line will have a bending angle, and there is an inner and outer bending radius. The minimum inner radius size is determined by the material used. When the inner radius size is too small, there will be excess metal welding, which will cause a crack in the outer radius part. The outer bending radius size cannot be controlled by a bending punch and die block. Types of bending include V-bending, U-bending, O-bending, edge bending, twist bending, and crimping. Z-bending involves two bending lines, which are set on the upper side and under surface of the blank, respectively, and upward or downward bending is used. Z-bending is also called crank bending. Z-bending using this type of die structure will produce a standard inner bending radius. The standard size is the minimum bending radius that represents the angle radius of the bending punch. In industry, there is a need for a sharp edge shape with a very small size (R=0.2mm), but that is not possible when using bending punch and die block. The purpose of this research is to meet the need by development.

• Journal of Korean Society of Environmental Engineers
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• v.30 no.3
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• pp.331-338
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• 2008

Coal-tar enamel, blown asphalt and polyethylene have been used as wrapping materials of steel pipe in Korea. Currently, every manufacturer produces wrapped steel pipes with different materials and methods, and little research has been performed to get on wrapping methods and materials. In this research, properties of wrapping material of steel pipe used for water supply have been evaluated. All of the materials tested in this work were found to meet the standard. Among the wrapping materials of steel pipe tested, blown asphalt and coal-tar enamel were reasonable in price, and their mechanical properties were excellent. The quality of the wrapped steel pipes was being melted easily in organic solvent. When coated thick, the load of the steel pipes was higher than necessary. Tensile strength of cathode exfoliation and PE 3-layer wrapping method was excellent. The pulling intensity of T-Die PE 3-layer was stronger than PE fluidized in PE wrapping method. Cathode exfoliation area was smaller than PE fluidized. Mechanical property and thermo-property of T-Die PE 3-layer were excellent and its anti-chemical property was great. Liquid epoxy can change the property of coating materials depending on the hardening condition and resin selection. Polyurethane used in this test showed a less adhesive strength with steel pipes than epoxy. Moisture absorbance rate was higher than Epoxy's, however. To utilize polyurethane as wrapping materials, basic property of the matter should be improved followed by finding the best suited coating condition. The method of PE 3-layer by extrude method appeared to be the best in this study. However, identification of other wrapping materials requires further additional tests.

• Journal of the Korean Wood Science and Technology
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• v.41 no.4
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• pp.346-357
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• 2013

In this study, it was conducted to produce wood pellets using domestic forest thinning residues and examine their quality according to Korean pellet quality standard. Raw materials were composed of larch and mixed broad leaves species. Based on the small-end diameter (6 cm), they were classified into four different types of raw materials such as LM (larch with middle diameter), LS (larch with small diameter), MM (mixed broadleaf with middle diameter), and MS (mixed broadleaf with small diameter). After crushing and drying process, wood pellets were produced by a ring-die type pelletizer using each raw material. Wood pellets made from four different types of raw materials were tested for their quality such as calorific value, moisture content, ash content, inorganic matters and so on. As results of quality analysis, the calorific values of all wood pellets were higher than 198 kcal/kg, and satisfied with the first grade of Korea wood pellet standard. The ash content was slightly increased after pelletizing. Mechanical durability of wood pellets was highly dependent on the types of raw materials. The quality differences among wood pellets were turned out due to different physical and chemical characteristics of raw materials even though the same pelletizing condition was applied.

• Transactions of Materials Processing
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• v.24 no.3
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• pp.187-193
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• 2015

The objective of the current study is to determine cross-sectional profile of intermediate dies in order to improve the plastic strain homogeneity which directly affects not only the dimensional accuracy but also the mechanical properties of final product by redesigning the intermediate dies using the conventional electric field analysis (EFA) method. Initially, the multi-pass shape wire drawing was designed by using the equivalent potential lines from EFA. The area reduction ratio was calculated from the number of passes in multi-pass shape wire drawing but constrained by the capacity of the drawing machine and the drawing force. In order to compensate for a concentration of strain in a region of the cross section of the wire, the process for multi pass wire drawing from initial round material to an intermediate die was redesigned again using the electric field analysis. Both drawing process designs were simulated by the finite element method in which the strain distribution and standard deviation plastic strain of the cross section of drawn wires were examined.

• Design & Manufacturing
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• v.15 no.4
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• pp.1-7
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• 2021

A study on in-mold punching technology for hole piercing during molding of hollow plastic parts was conducted. Considering the non-linearity of the HDPE plastic material, mechanical properties were obtained according to the change in temperature and load speed. A standard specimen for the in-mold punching test was designed to implement the in-mold punching process, and the specimen was obtained through injection molding. In order to analyze the influence of process variables during in-mold punching, an in-mold punching mold capable of controlling variables such as temperature and support pressure of the specimen was designed and manufactured. Mold heating characteristics were confirmed through finite element analysis, and punching simulations for changes in process conditions were performed to analyze punching characteristics and reflected in the experiment. Through simulations and experiments, it was found that the heating temperature, punch shape, punching speed, and pressure of the back side of the specimen were very important during in-mold punching of HDPE materials, and optimal conditions were acquired within a given range.

• Applied Microscopy
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• v.52
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• pp.1.1-1.8
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• 2022

As semiconductor device architecture develops, from planar field-effect transistors (FET) to FinFET and gate-all-around (GAA), there is an increased need to measure 3D structure sidewalls precisely. Here, we present a 3-Dimensional Atomic Force Microscope (3D-AFM), a powerful 3D metrology tool to measure the sidewall roughness (SWR) of vertical and undercut structures. First, we measured three different dies repeatedly to calculate reproducibility in die level. Reproducible results were derived with a relative standard deviation under 2%. Second, we measured 13 different dies, including the center and edge of the wafer, to analyze SWR distribution in wafer level and reliable results were measured. All analysis was performed using a novel algorithm, including auto fattening, sidewall detection, and SWR calculation. In addition, SWR automatic analysis software was implemented to reduce analysis time and to provide standard analysis. The results suggest that our 3D-AFM, based on the tilted Z scanner, will enable an advanced methodology for automated 3D measurement and analysis.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.4
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• pp.1-15
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• 1997

This paper proposes CMOS on-chip voltage and current reference circuits that operate at supply voltages between 2.5V and 5.5V without using a vonventional bandgap voltage structure. The proposed reference circuits based on enhancement-type MOS transistors show low cost, compatibility with other on-chip MOS circuits, low-power consumption, and small-chip size. The prototype was implemented in a 0.6 um n-well single-poly double-metal CMOS process and occupies an active die area of $710 um \times 190 um$. The proposed voltage reference realizes a mean value of 0.97 V with a standard deviation of $\pm0.39 mV$, and a temperature coefficient of $8.2 ppm/^{\circ}C$ over an extended temeprature range from TEX>$-25^{\circ}C$ to $75^{\circ}C$. A measured PSRR (power supply rejection ratio) is about -67 dB at 50kHz.