• The Korean Journal of Applied Statistics
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• v.34 no.3
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• pp.427-438
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• 2021

Two-stage sampling allows us to estimate population characteristics by both unit and cluster level together. Given a complex auxiliary information, integrated calibration weighting would better reflect the level-wise characteristics as well as multivariate characteristics between levels. This paper explored the integrated calibration weighting methods by Estevao and Särndal (2006) and Kim (2019) through a simulation study, where the efficiency of those weighting methods was compared using an artificial population data. Two weighting methods among others are shown efficient: single step calibration at the unit level with stacked individualized auxiliary information and iterative integrated calibration at each level. Under both methods, cluster calibrated weights are defined as the average of the calibrated weights of the unit(s) within cluster. Both were very good in terms of the goodness-of-fit of estimating the population totals of mutual auxiliary information between clusters and units, and showed small relative bias and relative mean square root errors for estimating the population totals of survey variables that are not included in calibration adjustments.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.25 no.5
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• pp.719-730
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• 2021

We have demonstrated a sandwich-type ZnO-based piezoelectric energy harvesting nanogenerator, namely ZCZ-NG device, composed of symmetrically stacked layers of ZnO/carbon tape/ZnO structure. Especially, we have adopted a conductive double-sided adhesive carbon tape in an effort to fabricate a high-quality ZCZ-NG device, leading to its superior output performance in terms of the peak-to-peak output voltage. Effects of the device size, ZnO layer thickness, and bending strain rate on the device performance have been investigated by measuring the output voltage. Moreover, to evaluate the effectiveness of the fabricated ZCZ-NG devices, we have experimentally implemented a sensor network testbed which can utilize the output voltages of ZCZ-NG devices. This sensor network testbed consists of several components such as Arduino-based transmitter and receiver nodes, wirelessly transmitting the sensed information of each node. We hope that this research combining the ZnO-based energy harvesting devices and IoT sensor networks will contribute to the development of more advanced energy harvester-driven IoT sensor networks in the future.

• Journal of Dental Rehabilitation and Applied Science
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• v.37 no.4
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• pp.199-208
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• 2021

Purpose: The purpose of this study was to compare and evaluate the masking ability of three types of high translucent zirconia according to the various thicknesses and backgrounds. Materials and Methods: Using three types of high-translucency zirconia (Ceramill zolid fx white, Ceramill zolid ht+ white, Ceramill zolid ht+ preshade A2), 10 cylindrical specimens were fabricated in 10mm diameter and each with four thicknesses (0.6 mm, 1.0 mm, 1.5 mm, 2.0 mm), respectively by CAD/CAM method. The background was 10 mm in diameter and 10 mm in thickness. A1, A2, A3 flowable resin backgrounds, blue-colored core resin background, and Ni-Cr alloy background were prepared, and black, white backgrounds provided by the spectrophotometer manufacturer (x-rite, Koblach, Austria) were used. zirconia specimens and the background specimen were stacked to measure L, a^*, b^* with Spectrophotometer (Color i5, x-rite, Koblach, Austria) and the ΔE value with the other background is calculated. The Calculated mean ΔE values were compared based on perceptibility threshold 1.0 and acceptability threshold 3.7. Nonparametric tests such as Kruskal-Wallis test were performed to verify statistical significance (α = 0.05). Results: There was a significant difference in the mean ΔE value according to the zirconia type, background and thickness change (P = 0.000). Conclusion: According to the results of this study, the pre-colored high-translucent zirconia can obtain the desired zirconia shade when it is restored on teeth, composite resins, and abutments except for the blue resin core.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.25-29
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• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.

• Journal of the Korean Wood Science and Technology
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• v.30 no.2
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• pp.128-133
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• 2002

This study was conducted to investigate the influence of storage time on the sapstain development of Japanese red pine and Korean pine logs during storage in log yard, and their stain characteristics. Japanese red pine and Korean pine trees were harvested and cut into logs in mid January of 2001. These logs were transported to the two local sawmills where they were closely stacked in remote parts of log yard. The logs were then sampled destructively by cutting seven to nine 3-cm long discs along the length of each log at intervals of 3, 4, 5, 6, and 8 month after felling. The stain coverage and maximal radial penetration of stain were measured from the discs of the sampled logs after the isolation of causal staining fungi. The sapstain was primarily infested by the attack of bark beetles and the species of bark beetle was identified as Tomicus piniperda. The main fungal species isolated from stained wood was Ophiostoma species. Based on the present study, the logs could be stored in log yard until May without stain; but stain development was rapid after May and the severity of stain increased proportionally with storage time. Korean pine was more susceptible to fungal stain than Japanese red pine. During summer storage, decay started to develop in logs and the main species were identified as Tyromyces sp. and Schizophyllum commune. Information provided in this paper would be very useful to develop more effective control strategies for sapstain prevention in Japanese red pine and Korean pine logs.

• Journal of Broadcast Engineering
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• v.26 no.4
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• pp.429-440
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• 2021

With the recent development of deep convolutional neural network learning, deep learning techniques applied to single image super-resolution are showing good results. One of the existing deep learning-based super-resolution techniques is RDN(Residual Dense Network), in which the initial feature information is transmitted to the last layer using residual dense blocks, and subsequent layers are restored using input information of previous layers. However, if all hierarchical features are connected and learned and a large number of residual dense blocks are stacked, despite good performance, a large number of parameters and huge computational load are needed, so it takes a lot of time to learn a network and a slow processing speed, and it is not applicable to a mobile system. In this paper, we use the residual dense structure, which is a continuous memory structure that reuses previous information, and the residual dense channel attention block using the channel attention method that determines the importance according to the feature map of the image. We propose a method that can increase the depth to obtain a large receptive field and maintain a concise model at the same time. As a result of the experiment, the proposed network obtained PSNR as low as 0.205dB on average at 4× magnification compared to RDN, but about 1.8 times faster processing speed, about 10 times less number of parameters and about 1.74 times less computation.

• Journal of the Korea Institute of Building Construction
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• v.22 no.2
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• pp.161-169
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• 2022

The government [3] specifies steel pipe scaffolding as conventional scaffolding and is promoting the installation of system scaffolding, an integrated work platform, and avoidance of the use of steel pipe scaffolding as much as possible. However, in places where equipment cannot enter, such as power plants and plant sites, places the structure is complex, and places where scaffolding cannot be stacked on the ground, there is no choice but to install steel pipe scaffolding. When installing steel pipe scaffolding on an H-beam structure at a high place, the performance of the steel frame clamp is very important in order to form a work space which workers can work safely. In this study, the displacement magnitude and tensile load of members in each installation direction of the clamp for steel frame were verified through performance tests and structural analysis modeling. As a result, it was confirmed that the performance for each installation direction satisfies the safety certification standard tensile load of 10,000N. Although the performance value is satisfactory, deformation of the attachment pressing bolt was verified and was confirmed to have minimal deformation. Thus, to ensure the load is properly to the attachment body, the clamp for a steel frame must be installed in the direction in which the load is transmitted.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.35 no.1
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• pp.15-22
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• 2022

This paper introduces research on the hinge joint of modular structure joints using finite element analysis. The modular structure has a characteristic in that it is difficult to expect the integrity of columns and beams between unit modules because the construction is carried out such that the modules are stacked. However, the current modular design ignores these structural characteristics, considers the moment transmission for the lateral force, and analyzes it in the same manner as the existing steel structure. Moreover, to fasten the moment bonding, bolts are fastened outside and inside the module, resulting in an unreasonable situation in which the finish is added after assembly. To consider the characteristics that are difficult to expect, such as unity, a modular structure system using hinge joints was proposed. This paper proposed and reviewed the basic theory of joints by devising a modified scissors model that is modified from the scissors model used in other research to verify the transmission of load when changing from the existing moment junction to a hinge junction. Based on the basics, the results were verified by comparing them with Midas Gen, a structural analysis program. Additionally, the member strength and usability were reviewed by changing the modular structure designed as a moment joint to a hinge joint.

• Clean Technology
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• v.29 no.4
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• pp.244-248
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• 2023

Recently, displays play an important role in quickly delivering a lot of information. Research is underway to reproduce various colors close to natural colors. In particular, research is being conducted on the light emitting structure of displays as a method of expressing accurate and rich colors. Due to the advancement of technology and the miniaturization of devices, the need for small but high visibility displays with high efficiency in energy consumption continues to increase. Efforts are being made in various ways to improve OLED efficiency, such as improving carrier injection, structuring devices that can efficiently recombine electrons and holes in a numerical balance, and developing materials with high luminous efficiency. In this study, the electrical and optical properties of the seven-layer stacked structure rear-light emitting blue OLED device were analyzed. 4,4'-Bis(carazol-9-yl)biphenyl:Ir(difppy)2(pic), a blue light emitting material that is easy to manufacture and can be highly efficient and brightened, was used. OLED device manufacturing was performed via the in-situ method in a high vacuum state of 5×10-8 Torr or less using a Sunicel Plus 200 system. The experiment was conducted with a seven-layer structure in which an electron or hole blocking layer (EBL or HBL) was added to a five-layer structure in which an electron or hole injection layer (EIL or HIL) or an electron or hole transport layer (ETL or HTL) was added. Analysis of the electrical and optical properties showed that the device that prevented color diffusion by inserting an EBL layer and a HBL layer showed excellent color purity. The results of this study are expected to greatly contribute to the R&D foundation and practical use of blue OLED display devices.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.6
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• pp.509-518
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• 2023

In this paper, we designed a 4Kb poly-fuse OTP IP (Intellectual Property) required for analog circuit trimming and calibration. In order to reduce the BL resistance of the poly-fuse OTP cell, which consists of an NMOS select transistor and a poly-fuse link, the BL stacked metal 2 and metal 3. In order to reduce BL routing resistance, the 4Kb cells are divided into two sub-block cell arrays of 64 rows × 32 rows, with the BL drive circuit located between the two 2Kb sub-block cell arrays, which are split into top and bottom. On the other hand, in this paper, we propose a core circuit for an OTP cell that uses one poly-fuse link to one select transistor. In addition, in the early stages of OTP IP development, we proposed a data sensing circuit that considers the case where the resistance of the unprogrammed poly-fuse can be up to 5kΩ. It also reduces the current flowing through an unprogrammed poly-fuse link in read mode to 138㎂ or less. The poly-fuse OTP cell size designed with DB HiTek 90nm CMOS process is 11.43㎛ × 2.88㎛ (=32.9184㎛2), and the 4Kb poly-fuse OTP IP size is 432.442㎛ × 524.6㎛ (=0.227mm²).