• Elastomers and Composites
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• v.57 no.4
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• pp.197-204
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• 2022

Recently, the demand has increased for protective clothing materials capable of shielding the wearer from bullets, fragment bullets, knives, and swords. It is therefore necessary to develop light and soft protective clothing materials with excellent wearability and mobility. To this end, research is being conducted on hybrid design methods for various highly functional materials, such as carbon nanotube (CNT) sheets, which are well known for their low weight and excellent strength. In this study, a hybrid protective material using CNT sheets was developed and its performance was evaluated. The material design incorporated a bonding method that used a binder for interlayer combination between the CNT sheets. Four types of binders were selected according to their characteristics and impregnated within CNT sheets, followed by further combination with aramid fabric to produce the hybrid protective material. After applying the binder, the tensile strength increased significantly, especially with the phenoxy binder, which has rigid characteristics. However, as the molecular weight of the phenoxy binder increased, the adhesive force and strength decreased. On the other hand, when a 25% lightweight-design and high-molecular-weight phenoxy binder were applied, the backface signature (BFS) decreased by 6.2 mm. When the CNT sheet was placed in the middle of the aramid fabric, the BFS was the lowest. In a stab resistance test, the penetration depth was the largest when the CNT sheet was in the middle layer. As the binder was applied, the stab resistance improvement against the P1 blade was most effective.

• Composites Research
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• v.21 no.5
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• pp.23-30
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• 2008

Stab threats using sharp edged or pointed Instruments could be easily encountered by police officers or soldiers. In this study, the shear thickening fluids (STF) was impregnated into Kevlar fabrics to improve the stab protection and the resistance of STF impregnated Kevlar fabrics was experimentally investigated. The puncture and cut resistance were tested using a drop test machine withspike and knife indenters fabricated based on the National Institute of Justice (NIJ) standard. The STF was filled with spherical $SiO_2$ particles having an average diameter of 100nm, 300nm, and 500nm. The effect of particle size on puncture and cut resistance of STF impregnated Kevlar fabrics was also investigated. The measured impact load histories showed that STF impregnation into fabric leads to withstand higher peak loads than that of neat fabrics under spike test. The test results showed that Kevlar impregnated with STF exhibit remarkable improvements in puncture resistance while it is slightly influential on the cut resistance. Specifically, particle size is the one of the dominant factors controlling fabric resistance to puncture under spike impact test.

• Korean Journal of Materials Research
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• v.4 no.1
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• pp.81-89
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• 1994

Ti film of lOnm thickness and Co film of 18nm thickness were sequentially e-heam evaporated onto Si (100) substrates. Metal deposited samples were rapidly thermal-annt.aled(KTA) in thr N1 en vironment a t $900^{\circ}C$ for 20 sec. to induce the reversal of metal bilayer, so that $CoSi_{2}$ thin films could be formed. The sheet resistance measured by the 4-point probe was 3.9 $\Omega /\square$This valur was maintained with increase in annealing time upto 150 seconds, showing high thermal stab~lity. Thc XRII spectra idrn tified the silicide film formed on the Si substrate as a $CoSi_{2}$ epitaxial layer. The SKM microgr;iphs showed smooth surface, and the cross-sectional TKM pictures revealed that the layer formed on the Si substrate were composed of two Co-Ti-Si alloy layers and 70nm thick $CoSi_{2}$ epl-layer. The AES analysis indicated that the native oxide on Si subs~rate was removed by TI ar the beginning of the RTA, and Ihcn that Co diffused to clean surface of Si substrate so that epitaxial $CoSi_{2}$ film could bt, formed. In thc rasp of KTA at $700^{\circ}C$. 20sec. followed by $900^{\circ}C$, 20sec., the thin film showed lower sheet resistance, but rough surface and interface owing to $CoSi_{2}$ crystal growth. The application scheme of this $CoSi_{2}$ epilayer to VLSI devices and the thermodynarnic/kinetic mechan~sms of the $CoSi_{2}$ epi-layer formation through the reversal of Co/Ti bdayer were discussed.