• 제목/요약/키워드: spray pyrolysis deposition

검색결과 52건 처리시간 0.019초

스퍼터링 증확 CdTe 박막의 두께 불균일 현상 개선을 위한 화학적기계적연마 공정 적용 및 광특성 향상 (Application of CMP Process to Improving Thickness-Uniformity of Sputtering-deposited CdTe Thin Film for Improvement of Optical Properties)

  • 박주선;임채현;류승한;명국도;김남훈;이우선
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.375-375
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    • 2010
  • CdTe as an absorber material is widely used in thin film solar cells with the heterostructure due to its almost ideal band gap energy of 1.45 eV, high photovoltaic conversion efficiency, low cost and stable performance. The deposition methods and preparation conditions for the fabrication of CdTe are very important for the achievement of high solar cell conversion efficiency. There are some rearranged reports about the deposition methods available for the preparation of CdTe thin films such as close spaced sublimation (CSS), physical vapor deposition (PVD), vacuum evaporation, vapor transport deposition (VTD), closed space vapor transport, electrodeposition, screen printing, spray pyrolysis, metalorganic chemical vapor deposition (MOCVD), and RF sputtering. The RF sputtering method for the preparation of CdTe thin films has important advantages in that the thin films can be prepared at low growth temperatures with large-area deposition suitable for mass-production. The authors reported that the optical and electrical properties of CdTe thin film were closely connected by the thickness-uniformity of the film in the previous study [1], which means that the better optical absorbance and the higher carrier concentration could be obtained in the better condition of thickness-uniformity for CdTe thin film. The thickness-uniformity could be controlled and improved by the some process parameters such as vacuum level and RF power in the sputtering process of CdTe thin films. However, there is a limitation to improve the thickness-uniformity only in the preparation process [1]. So it is necessary to introduce the external or additional method for improving the thickness-uniformity of CdTe thin film because the cell size of thin film solar cell will be enlarged. Therefore, the authors firstly applied the chemical mechanical polishing (CMP) process to improving the thickness-uniformity of CdTe thin films with a G&P POLI-450 CMP polisher [2]. CMP process is the most important process in semiconductor manufacturing processes in order to planarize the surface of the wafer even over 300 mm and to form the copper interconnects with damascene process. Some important CMP characteristics for CdTe were obtained including removal rate (RR), WIWNU%, RMS roughness, and peak-to-valley roughness [2]. With these important results, the CMP process for CdTe thin films was performed to improve the thickness-uniformity of the sputtering-deposited CdTe thin film which had the worst two thickness-uniformities of them. Some optical properties including optical transmittance and absorbance of the CdTe thin films were measured by using a UV-Visible spectrophotometer (Varian Techtron, Cary500scan) in the range of 400 - 800 nm. After CMP process, the thickness-uniformities became better than that of the best condition in the previous sputtering process of CdTe thin films. Consequently, the optical properties were directly affected by the thickness-uniformity of CdTe thin film. The absorbance of CdTe thin films was improved although the thickness of CdTe thin film was not changed.

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표면탄성파를 이용한 아황산 가스센서 개발에 관한 연구 (The Study on development of a SAW SO$_2$ gas sensor)

  • 이영진;김학봉;노용래;조현민;백성기
    • 한국음향학회지
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    • 제16권2호
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    • pp.89-94
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    • 1997
  • 아황산가스를 감지하기 위해 새로운 CdS 무기박막을 이용한 표면탄성파 센서를 구현하였다. LiTaO$_3$ 단결정 압전기판에 중심주파수 54MHz인 두 개의 SAW 소자 및 발진기를 제작하였으며 아황산가스가 흡착, 탈착할 수 있는 감지막을 지연선 상에 증착시키고 다른 변수로부터의 반응을 보상하기 위해 이중지연선 구조로 제작하였다. CdS 박막은 초음파 노즐을 이용하여 분무 열분해법을 이용하여 증착하였다. 실험결과 표면탄성파 센서는 아황산가스의 농도를 0.25 ppm 까지 검출할 수 있으며 20 ppm 이내의 안정도 및 5분 이내의 빠른 반응시간을 보였다. 또 가스감응 실험의 반복을 통해 센서의 반복성을 확인함으로써 본 연구에서 개발한 센서가 이황산가스 감지용 센서로 사용될 수 있음을 확인하였다. 향후 계획으로 CdS 박막 증착시에 적절한 원소를 첨가하여 박막의 반응성을 증가시키며 또한 표면탄성파 소자의 중심주파수를 증가시켜 센서의 가스감응성을 높이고자 하였다.

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