• Title/Summary/Keyword: spice

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A Method of Test Case Generation Based on Behavioral Model for Automotive SPICE (Automotive SPICE를 위한 행위 모델 기반의 테스트 케이스 생성 기법)

  • Kim, Choong S.;Yang, Jae-Soo;Park, Young B.
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.3
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    • pp.71-77
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    • 2017
  • As the automobile industry has shifted to software, the Automotive SPICE standard has been established to ensure efficient product development process and quality. In the assessment model, the HIS Scope is the minimum standard for small and medium automotive electric companies to meet OEM requirements. However, in order to achieve the HIS Scope, the output of each process stage that meets the verification criteria of Automotive SPICE must be created. In particular, the test phase takes a lot of resources, which is a big burden for small and medium-sized companies. In this paper, we propose a methodology for creating test cases of software integration test phase based on UML sequence diagram, which is a software design phase of Automotive SPICE HIS Scope, by applying behavior model based testing method. We also propose a tool chain for automating the creation process. This will reduce the resources required to create a test case.

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A Study on the RF and Microwave Circuit Analysis in the SPICE (SPICE에서의 RF와 Microwave회로 해석에 관한 연구)

  • 김학선;이창석;이형재
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.7 no.1
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    • pp.83-91
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    • 1996
  • The SPICE circuit analysis program has a limited math capability and, in general, cannot be used for RF and microwave simulation because a complex arithmetic is required to compute S-parameters from node voltages. This paper presents two test bench models that can be used to obtain node voltages proportional to incident, reflected, and transmitted signals. From SPICE computed node voltages, S-parameters are computed using the math capability of the PSPICE post processor, PROBE, as an example for a low-pass filter consisting of transmission line sections. The results of this example are compared with another high frequency circuit analysis program, TOUCHSTONE. The difference between the results of these two programs in magnitude was less than 0.003 and in phase was a few tenths of a degree. By using these test benchs to simulate a filter, RF and microwave analysis can be made with the SPICE, which can be a cost-effective and readily available computational tool for educators and practicing engineers.

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강원도 태백지역의 캄브리아기 세송층에서 나타나는 SPICE 구간에 관한 연구

  • Im, Jong-Nam;Jeong, Gong-Su;Park, Tae-Yun;Lee, Gwang-Sik
    • 한국지구과학회:학술대회논문집
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    • 2010.04a
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    • pp.20-20
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    • 2010
  • 강원도 태백 지역에 위치한 조선누층군의 세송층을 대상으로 암상변화, 해수면 변화, 안정탄소동위원소 층서를 조사하였다. 세송층은 중기에서 후기 캄브리아기에 속하는 지층으로서 직동지역과 사군다리지역에서 조사하였다. 직동지역의 세송층은 수평층리 이회암상, 리본 석회암상, 단괴 석회암상, 수평층리 사암상, 석회역암상으로 구성되어 있으며, 이들은 내부완사면, 중부완사면, 외부완사면의 세개의 상조합으로 분류되었다. 세송층의 하부로부터 약 30m 까지는 리본석회암상과 석회역암상, 일부 단괴석회암상이 나타나는 구간으로 중부완사면 환경에서 퇴적된 것으로 해석되며, 약 30m부터 42m 까지는 점차 이회암상의 비율이 증가하여 상향 세립화의 경향성을 보이는 구간으로 외부완사면 환경에서 퇴적된 것으로 해석된다. 사군다리 지역은 세송층의 상부가 나타나는 곳으로 평행엽층리사암상과 단괴석회암상이 관찰되며 중부완사면 환경에서 퇴적된 것으로 해석된다. 세송층의 석회암은 하부 이암, 중부 와케스톤, 상부 와케스톤과 팩스톤으로 변화하는 것으로 관찰되었다. 세송층에서의 안정탄소동위원소 잘량 분석결과 양의 값(2.5-3.0‰)을 보이는 Peak 구간이 하부로부터 25m 높이 부근에서 존재하는 것으로 나타났다. 이러한 분석결과는 Steptoean 시기(약 496 Ma)에 전 지구적으로 발생했던 안정탄소동위원소 값의 양(positive)의 변동을 반영한 SPICE(Steptoean positive carbon isotope excursion) 구간에 해당되는 것으로 해석된다. SPICE 구간은 세송층의 중상부에 해당하는 곳으로 와케스톤, 팩스톤의 석회암을 포함하는 석회역암상, 단괴 석회암상으로 구성되어 있으며 이는 상대적으로 해수면이 낮았던 시기를 지시한다. 이러한 SPICE는 큰 규모의 전 지구적 탄소순환의 변동을 대표하며 대륙 간의 대비를 용이하게 하고 퇴적당시의 환경적 변화를 해석하는데 도움을 준다. 북중국과 북미 Laurentia의 안정탄소동위원소 값을 비교해보면 두 지역 모두 세송층과 유사한 값을 보인다. 다만 북중국 지역은 Chuangia Zone에서 SPICE가 나타나는 반면 세송층은 Prochuangia Zone에서 SPICE가 나타난다는 차이가 있다.

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Design and Implementation of Assessment System for SPICE Maintenance Process (SPICE 유지보수 프로세스 심사 시스템 설계 및 구현)

  • Kwon, Young-Oh;Ko, Young-Cheol;Kim, Jin-Woen;Koo, Yeon-Seol
    • Journal of KIISE:Computing Practices and Letters
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    • v.8 no.2
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    • pp.141-154
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    • 2002
  • More efforts have been given to solve the problems related to computer software by process assessment. ISO/IEC 15504(SPICE) has been developed as standardized means for process assessment. The purpose of this paper is to design and implement a process assessment system which is appropriated to the Korean assessment environment based on ISO/IEC 15504. Referring documents are: IS0/1EC 15504 standardized documents, the assessment provisions of the SPICE committee in Korea, and research papers applied the existing process assessment system to real cases. Among a lot of processes, this system is designed for (ENG2). The proposed system in the paper will support the whole process of assessment, presenting the goals and end-products for each assessment step and making it possible to compose and save the product on the same screen. In determining process rating, assessors can retrieve the saved data and documents. By doing so, the system will improve reliability in process rating. The proposed system includes 7 steps of pre-assessment and 9 steps of actual assessment in order to fully prepare assessors for process assessment. And each step has been standardized to improve user-friendliness. This system is designed to provide assessors with specific details of standardized documents, the goals of the process, outcomes of implementing the process, and presentations of base practices and input/output products. Above all, the system automatically generates an assessment rating, by calculating based on input data which assessors make out. It also presents outcomes graphically.

Physics-Based SPICE Model of a-InGaZnO Thin-Film Transistor Using Verilog-A

  • Jeon, Yong-Woo;Hur, In-Seok;Kim, Yong-Sik;Bae, Min-Kyung;Jung, Hyun-Kwang;Kong, Dong-Sik;Kim, Woo-Joon;Kim, Jae-Hyeong;Jang, Jae-Man;Kim, Dong-Myong;Kim, Dae-Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.11 no.3
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    • pp.153-161
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    • 2011
  • In this work, we report the physics-based SPICE model of amorphous oxide semiconductor (AOS) thin-film transistors (TFTs) and demonstrate the SPICE simulation of amorphous InGaZnO (a-IGZO) TFT inverter by using Verilog-A. As key physical parameter, subgap density-of-states (DOS) is extracted and used for calculating the electric potential, carrier density, and mobility along the depth direction of active thin-film. It is confirmed that the proposed DOS-based SPICE model can successfully reproduce the voltage transfer characteristic of a-IGZO inverter as well as the measured I-V characteristics of a-IGZO TFTs within the average error of 6% at $V_{DD}$=20 V.

Evaluation of the Quality of Canned Seafood with Added Spice-oil Extract

  • Yoon, Ho Dong;Shulgin, Yu.P.;Lazhentseva, L. Yu;Shulgina, L.V.;Xie, Chengliang;Mok, Jong Soo;Kim, Jeong Gyun
    • Fisheries and Aquatic Sciences
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    • v.18 no.1
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    • pp.7-11
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    • 2015
  • The influence of spice (cinnamon, allspice, black pepper)-oil extract on canned seafood quality was studied. During the processing of canned seafood, the substitution of spice-oil extract for vegetable oil (refined sunflower, corn, soybean and olive oil) resulted in a decrease in the heat resistance of spore microorganisms, making it possible to reduce the duration of sterilization for canned food to 5-10 min at $115^{\circ}C$. This reduction in the sterilization duration of canned seafood with spice-oil extract inhibited residual microflora in the product, thus reducing the deleterious effect of heating on the main food compounds while preserving protein digestibility.

A SPICE-based 3-dimensional circuit model for Light-Emitting Diode (SPICE 기반의 발광 다이오드 3차원 회로 모델)

  • Eom, Hae-Yong;Yu, Soon-Jae;Seo, Jong-Wook
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.2
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    • pp.7-12
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    • 2007
  • A SPICE-based 3-dimensional circuit model of LED(Light-Emitting Diode) was developed for the design optimization and analysis of high-brightness LEDs. An LED is represented as an array of pixel LEDs with small preassigned areas, and each of the pixel LEDs is composed of circuit networks representing the thin-film layers(n-metal, n- and p-type semiconductor layers, and p-metal), ohmic contacts, and pn-junctions. Each of the thin-film layers and contact resistances is modeled by a resistance network, and the pn-junction is modeled by a conventional pn-junction diode. It has been found that the simulation results using the model and the corresponding parameters precisely fit the measured LED characteristics.

A Study on Improved SPICE MOSFET RF Model Considering Wide Width Effect (Wide Width Effect를 고려하여 개선된 SPICE MOSFET RF Model 연구)

  • Cha, Ji-Yong;Cha, Jun-Young;Lee, Seong-Hearn
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.2
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    • pp.7-12
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    • 2008
  • In this study, the wide width effect that the increasing rate of drain current and the value of cutoff frequency decrease with larger finger number is observed. For modeling this effect, an improved SPICE MOSFET RF model that finger number-independent external source resistance is connected to a conventional BSIM3v3 RF model is developed. Better agreement between simulated and measured drain current and cutoff frequency at different finger number is obtained for the improved model than the conventional one, verifying the accuracy of the improved model for $0.13{\mu}m$ multi-finger MOSFET.

An Analysis of S/W Project Quality and Organizational Performance by SPICE Certification (SPICE인증 여부에 따른 프로젝트 품질성과 및 조직성과 분석)

  • Ryu Sung Hun;Lee Jea Hun;Lee Ki Hun;Lee Eunseok
    • Proceedings of the Korean Information Science Society Conference
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    • 2005.11b
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    • pp.403-405
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    • 2005
  • IT산업이 발달하고 고도화 됨에 따라 소프트웨어가 차지하는 비중이 점차 높아지고 있다. 국내의 경우 정보통신부가 2001년 하반기부터 소프트웨어업체 사업자 평가제도를 도입/시행 중으로 이에 따라 소프트웨어 개발/관리 조직들은 소프트웨어 품질 평가 심사모형인 5티CE 및 CMM의 등급 인증획득과 등급 상향을 위해 큰 관심과 노력을 기울이고 있다. 그러나 이중 SPICE 인증의 신뢰성이나 효과에 대한 충분한 검증 및 연구가 이루어 지고 있지 않아, 본 논문에서는 특히 SPICE 등급을 인증받은 조직이 비인증 조직과 비교하여 품질 및 성과에 차이를 보이는지 조사하였다. 자료수집의 한계에도 불구하고 본 논문을 통해 SPICE 인증 조직이 비인증 조직보다. 프로젝트 품질 성과 및 조직성과 측면에서 어떤 개선효과를 거두고 있는지 특히 피심사부서의 담당관련자들을 중심으로 조사, 분석하여 그 결과를 요약하였다.

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A SPICE Modeling and Simulation of Electrodeless fluorescent lamp Endura (SPICE를 이용한 무전극 램프의 모델링 및 시뮬레이션)

  • 박석인;한수빈;정봉만;유승원;장우진
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2002.11a
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    • pp.19-21
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    • 2002
  • Electroded lamps operated at a high enough frequency can usually be modeled for the purpose of ballast design, as a resistor. Electrodeless fluorescent lamps include other components such as the arc tube's inductance. But that's impedance is small and so will be neglected in this paper. So, electrodeless fluorescent lamps is modeled as a resistor. A SPICE compatible model was developed for an electrodeless fluorescent lamp(OSRAM SYLVANIA ICETRON/ENDURA 150W).

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