• Title/Summary/Keyword: solar cells

Search Result 2,368, Processing Time 0.031 seconds

Study for Recovery Silicon and Tempered Glass from Waste PV Modules (태양전지(太陽電池) 폐(廢) 모듈로부터 실리콘 및 강화(彈化)유리 회수(回收)에 관(關)한 연구(硏究))

  • Kang, Suk-Min;Yoo, Sung-Yeol;Lee, Jin-A;Boo, Bong-Hyun;Ryu, Ho-Jin
    • Resources Recycling
    • /
    • v.20 no.2
    • /
    • pp.45-53
    • /
    • 2011
  • We devised a procedure for the recovery of silicon and tempered glass from waste photovoltaic (PV) modules using optimized conditions. The tempered glass was recovered without any damage using organic solvents. The surface material is removed by applying an acid solution on the surface of the PV cell. Through our proposed method, we offer a much more efficient approach for recycling solar cells with a surfactant than the conventional method. This process, we obtained pure silicon with a yield of 90% by chemical treatment with the surfactant at room temperature for 18 min. The silicon yield was characterized using an inductively coupled plasma-atomic emission spectrometer.

Fabrication and Time-Dependent Analysis of Micro-Hole in GaAs(100) Single Crystal Wafer Using Wet Chemical Etching Method (습식 화학적 식각 방법에 의한 시간에 따른 GaAs(100) 단결정 웨이퍼에서의 마이크로 구멍의 제작 및 분석)

  • Lee, Ha Young;Kwak, Min Sub;Lim, Kyung-Won;Ahn, Hyung Soo;Yi, Sam Nyung
    • Korean Journal of Materials Research
    • /
    • v.29 no.3
    • /
    • pp.155-159
    • /
    • 2019
  • Surface plasmon resonance is the resonant oscillation of conduction electrons at the interface between negative and positive permittivity material stimulated by incident light. In particular, when light transmits through the metallic microhole structures, it shows an increased intensity of light. Thus, it is used to increase the efficiency of devices such as LEDs, solar cells, and sensors. There are various methods to make micro-hole structures. In this experiment, micro holes are formed using a wet chemical etching method, which is inexpensive and can be mass processed. The shape of the holes depends on crystal facets, temperature, the concentration of the etchant solution, and etching time. We select a GaAs(100) single crystal wafer in this experiment and satisfactory results are obtained under the ratio of etchant solution with $H_2SO_4:H_2O_2:H_2O=1:5:5$. The morphology of micro holes according to the temperature and time is observed using field emission - scanning electron microscopy (FE-SEM). The etching mechanism at the corners and sidewalls is explained through the configuration of atoms.

Application of rapid thermal annealing process to the aluminum induced crystallization of amorphous silicon thin film (비정질 실리콘의 부분적 알루미늄 유도 결정화 공정에서의 급속 열처리 적용 가능성)

  • Hwang, Ji-Hyun;Yang, Su-Won;Kim, Young-Kwan
    • Journal of the Korean Crystal Growth and Crystal Technology
    • /
    • v.29 no.2
    • /
    • pp.50-53
    • /
    • 2019
  • In this study, polycrystalline silicon thin film useful for the solar cells was fabricated by AIC(Aluminum Induced Crystallization) process. A diffusing barrier for this process is prepared with $Al_2O_3$. For the maximization of the grain size of the polycrystalline silicon, a selective blasting of the $Al_2O_3$ diffusing barrier was conducted before annealing treatment. The heat treatment for the activation of the amorphous-Si (a-Si) layer was carried out with Rapid Thermal Annealing (RTA) process. Crystallization of the a-Si layer was analyzed with XRD. It was confirmed that a-Si was crystallized at $500^{\circ}C$ and the silicon crystal is observed to be formed and the grain size of the polycrystalline silicon was observed to be $15.9{\mu}m$.

Simultaneous Transmission of Optical Wireless Power Transfer and Optical Wireless Communication using a Laser Diode (레이저 기반의 광 무선충전 및 광 무선통신의 동시전송)

  • Shin, Jae-Woo;Yun, Tae-Uk;Kim, Sung-Man
    • The Journal of the Korea institute of electronic communication sciences
    • /
    • v.16 no.4
    • /
    • pp.605-610
    • /
    • 2021
  • Wireless charging method using a laser is considered as the most efficient method at a long distance of the wireless charging method. Combining long-range laser wireless charging technology with wireless communication technology will make it possible to use it for a variety of applications. Accordingly, this paper shows the results of research and experiments on wireless charging and wireless communication simultaneously based on a laser. This technique uses a laser as a light source for E/O(: Electric-to-Optical) conversion at the transmitter for optical wireless power transmission. In the experimental results, the optical power transmission using a 100 mW laser transmitter and a solar cells receiver showed a DC-to-DC efficiency of 1.9 %, wireless optical communication showed a transmission speed of up to 90 kbps when the transmission distance is 15 m.

Analysis of Soiling for the Installation Direction of PV Module (태양전지 모듈의 설치방향에 따른 오염특성 분석)

  • Lee, Chung Geun;Shin, Woo Gyun;Lim, Jong Rok;Ju, Young Chul;Hwang, Hye Mi;Ko, Suk Whan;Chang, Hyo Sik;Kang, Gi Hwan
    • New & Renewable Energy
    • /
    • v.16 no.4
    • /
    • pp.76-82
    • /
    • 2020
  • Soiling on the surface of a PV module reduces the amount of light reaching the solar cells, decreasing power performance. The performance of the PV module is generally restored after contaminants on the module surface are washed away by rain, but it accumulates at the bottom of the module owing to the thickness of the module frame, causing an output mismatch on the PV module. Since PV modules are usually installed horizontally or vertically outdoors, soiling can occur at the bottom of the PV module, depending on the installation direction due to external environmental factors. This paper is analyzed the output characteristics of a PV module considering its installation direction and the soiling area. The soiling was simulated to use transparent films with 5% transmittance, and the transmission film was attached to the bottom part of the PV module horizontally and vertically. When the soiling area was 33% of the string at the bottom of the PV module, the power output decreased similarly regardless of installation direction. However, when the soiling area was 66% of the string at the bottom of the PV module, it was confirmed that the output performance decreased sharply when installed vertically rather than horizontally.

Viologen Based All-in-one Flexible Electrochromic Devices (바이올로진 기반의 일체형 유연 전기변색소자)

  • Park, Bo-Seong;Kim, Hyun-Jeong;Shin, Hyeonho;Park, Seongmin;Lee, Jaeun;Jeon, Sunggun;Nah, Yoon-Chae
    • Korean Journal of Materials Research
    • /
    • v.31 no.3
    • /
    • pp.132-138
    • /
    • 2021
  • Electrochromic devices (ECDs) have been drawing great attention due to their high color contrast, low power consumption, and memory effect, and can be used in smart windows, automatic dimming mirrors, and information display devices. As with other electronic devices such as LEDs (light emitting diodes), solar cells, and transistors, the mechanical flexibility of ECDs is one of the most important issue for their potential applications. In this paper, we report on flexible ECDs (f-ECDs) fabricated using an all-in-one EC gel, which is a mixture of electrolyte and EC material. The f-ECDs are compared with rigid ECDs (r-ECDs) on ITO glass substrate in terms of color contrast, coloration efficiency, and switching speed. It is confirmed that the f-ECDs embedding all-in-one gel show strong blue absorption and have competitive EC performance. Repetitive bending tests show a degradation of electrochromic performance, which must be improved using an optimized device fabrication process.

Technology of Minimized Damage during Loading of a Thin Wafer (박판 웨이퍼의 적재 시 손상 최소화 기술)

  • Lee, Jong Hang
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.22 no.1
    • /
    • pp.321-326
    • /
    • 2021
  • This paper presents a technique to minimize damaged wafers during loading. A thin wafer used in solar cells and semiconductors can be damaged easily. This makes it difficult to separate the wafer due to surface tension between the loaded wafers. A technique for minimizing damaged wafers is to supply compressed air to the wafer and simultaneously apply a small horizontal movement mechanism. The main experimental factors used in this study were the supply speed of wafers, the nozzle pressure of the compressed air, and the suction time of a vacuum head. A higher supply speed of the wafer under the same nozzle pressure and lower nozzle pressure under the same supply speed resulted in a higher failure rate. Furthermore, the damage rate, according to the wafer supply speed, was unaffected by the suction time to grip a wafer. The optimal experiment conditions within the experimental range of this study are the wafer supply speed of 600 ea/hr, nozzle air pressure of 0.55 MPa, and suction time of 0.9 sec at the vacuum head. In addition, the technology improved by the repeatability performance tests can minimize the damaged wafer rate.

In-situ Warpage Measurement Technique Using Impedance Variation (임피던스 변화를 이용한 실시간 기판 변형 측정)

  • Kim, Woo Jae;Shin, Gi Won;Kwon, Hee Tae;On, Bum Soo;Park, Yeon Su;Kim, Ji Hwan;Bang, In Young;Kwon, Gi-Chung
    • Journal of the Semiconductor & Display Technology
    • /
    • v.20 no.1
    • /
    • pp.32-36
    • /
    • 2021
  • The number of processes in the manufacture of semiconductors, displays and solar cells is increasing. And as the processes is performed, multiple layers of films and various patterns are formed on the wafer. At this time, substrate warpage occurs due to the difference in stress between each film and pattern formed on the wafer. the substrate warping phenomenon occurs due to the difference in stress between each film and pattern formed on the wafer. We developed a new warpage measurement method to measure wafer warpage during real-time processing. We performed an experiment to measure the presence and degree of warpage of the substrate in real time during the process by adding only measurement equipment for applying additional electrical signals to the existing ESC and detecting the change of the additional electric signal. The additional electrical measurement signal applied at this time is very small compared to the direct current (DC) power applied to the electrostatic chuck whit a frequency that is not generally used in the process can be selectively used. It was confirmed that the measurement of substrate warpage can be easily separated from other power sources without affecting.

A Study on the Output Power of Shingled Mini Module Depending on Reflectance of Backsheets (Backsheet 반사율에 따른 Shingled Mini Module 출력변화에 대한 연구)

  • Cho, Seong Hyeon;Moon, Ji Yeon;Son, Hyoung Jin;Jun, Da Yeong;Kim, Sung Hyun
    • Current Photovoltaic Research
    • /
    • v.8 no.4
    • /
    • pp.129-133
    • /
    • 2020
  • It is very important to optimize the reflectance of incident light in solar modules for improving output power and reducing loss of cell-to-module (CTM). It is assumed that a higher reflectance backsheet may improve optical efficiency. However how much output power is related to optical properties by reflectance property of backsheets have not been revealed clearly yet. A total of 3 types of industrial backsheets with 3 type of industrial encapsulants (EVA or POE) were analyzed as fabricated mini modules used shingled cells. According to the type of backsheets, the difference between the highest and lowest average reflectance in the range of 400 nm to 1200 nm was found to be 13.08% by UV-visible spectroscopy. Also, when using the same encapsulant, the maximum gap value of the output power increase was measured by about 3.755 mW% (166.02 mW). The correlation between reflectance and output power was experimentally found by measuring the output property of the fabricated shingled mini modules.

A Study on Rinsing Effects of Sn Sensitization and Pd Activation Processes for Uniform Electroless Plating (무전해 도금에서 Sn 민감화와 Pd 활성화 공정의 세척 효과에 대한 연구)

  • Seong-Jae, Jeong;Mi-Se, Chang;Jae-Won, Jeong;Sang-Sun, Yang;Young-Tae, Kwon
    • Journal of Powder Materials
    • /
    • v.29 no.6
    • /
    • pp.511-516
    • /
    • 2022
  • Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn-Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.