• Applied Chemistry for Engineering
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• v.18 no.1
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• pp.64-70
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• 2007

Preparation and characterization of carbon-slurry fuel with high dispersion have been carried out. Carbon-slurry fuel was obtained by mixing Jet A-1 liquid fuel with appropriate carbon powders and additives. Dispersion of carbon in Jet A-1 was affected by various factors such as mixing temperature, characteristics of carbon powders, and type and amount of additives. Among these factors, the stability of the slurry fuel was most dependent on the type of additive. A variety of additives such as anionic, cationic, and nonionic additives was tested for the dispersion of carbon in Jet A-1. It was found that anionic additives based on sodium salts showed the highest dispersion of carbon-slurry fuels. The degree of dispersion could be monitored by measuring the luminosity.

• Geotechnical Engineering
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• v.7 no.3
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• pp.43-50
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• 1991

To analyze the effects of ground water levels and external loads on the stability of a Dia- phragm wall, the three models of Bell, Piaskowski/kowalewski, and Washbourne were modified and extended to develop a new program SL3D. Comparing to the other two models, Washbourne's model shows the stability in on safes at the beginning of the excavation and increase as the excavation continue . Also the effects of various design factors, such as the density of slurry, ground water levels, the friction angle of soil, external loads and the length of trench, have been analyzed and a nomogram was developed.

• Journal of the Korean Society for Railway
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• v.16 no.1
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• pp.47-51
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• 2013

In this study, we carried out an experimental shield TBM excavation model test using a down-scale device in soft clay, to understand tunnel-face stability properties in relation to changes in slurry pressure. We performed five tests according to tunnel depth (0.5D, 0.75D, 1.0D, 1.25D, 1.5D), and compared theoretical tunnel-face pressure with model test results. The range in theoretical tunnel-face slurry pressure ($P_{min}{\leq}P_{slurry\;pressure}{\leq}P_{max}$), which is determined by earth pressure and water level, was very similar to the model test result. This result was due to the more isotropic condition of the soft clay ground, than of rocky ground.

• Journal of IKEEE
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• v.23 no.4
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• pp.1175-1181
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• 2019

In this paper, we have studied the chemical mechanical polishing(CMP) characteristics of mixed abrasive silica slurry(MAS) retreated by adding of manganese oxide(MnO₂) abrasives within 1:10 diluted silica slurry. A slurry designed for optimal performance should produce high removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The polishing performances of MnO₂ abrasive-added MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared to original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, our proposed MnO₂-MAS can be useful to save on the high cost of slurry consumption since we used a 1:10 diluted silica slurry.

• Journal of Applied Reliability
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• v.14 no.1
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• pp.11-19
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• 2014

A colloidal silica slurry has been manufactured by mixing nano silica powders having different grain size to improve the reliability of Sapphire wafer CMP process. The main reliability problem of CMP process such as the breaking of wafer can be prevented by reducing the size of particles in a slurry. While existing commercial colloidal silica slurries are usually made of single grain size silica powder of about 120nm, in the present study 40nm and 100nm silica powders are mixed to achieve a similar removal rate. The new colloidal silica slurry showed wafer removal rate of $3.04{\mu}m/120min$ while that of a commercial colloidal silica slurry was $3.03{\mu}m/120min$. The roughness was less than $4{\AA}$ and scratch was 0. It is also expected that the reduction of the size of nano silica particles can improve the dispersion stability and prolong the useful life of the slurry.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.37.2-37.2
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• 2011

반도체공정에서 Photo-lithography는 특정 광원을 사용하여 구현하고자 하는 패턴을 기판상에 형성하는 기술이다. 이러한 Photo-lithography 공정에서는 패턴이 형성되어 있는 마스크가 핵심적인 역할을 하며 반도체소자의 전체적인 성능을 결정한다. 이에 따라 Photo-lithography용 마스크에 사용되는 Blank 마스크는 Defect의 최소화 및 우수한 평탄도 등의 조건들이 요구되고 있다. 이러한 Blank 마스크 재료로 광원을 효율적으로 투과시키는 성질이 우수하고 다른 재료에 비해 열팽창계수가 작은 석영기판이 사용되고 있다. 석영 기반의 마스크는 UV Lithography에서 주로 사용되고 있으며 그 밖에 UV-NIL (Nano Imrpint Lithography), EUVL (Extreme Ultra Violet Lithography) 등에도 이용되고 있다. 석영기판을 가공하여 Blank 마스크로 제작하기 위해 석영기판의 Lapping/Polishing 등이 핵심기술이며 현재 일본에서 전량 수입에 의존하고 있어, 이에 대한 연구의 필요성이 절실한 상황이다. 본 연구에서는 Blank 마스크제작을 위한 석영기판의 Polishing 공정에 사용되는 Ceria Slurry의 특성 연구 및 이에 따른 연마평가를 실시하였으며 첨가제의 조건에 따른 pH/Viscosity/Stability 등의 물리적인 특성을 관찰하여 석영기판 Polishing에 효율적인 Ceria slurry의 최적조건을 도출했다. 또한, 조건에 따른 Slurry의 정확한 분석을 위해 Zeta Potential Analyzer를 이용하여 연마입자의 크기 및 Zeta Potential에 대한 평가를 실시한 후 연마제와 석영기판의 Interaction force를 측정하였다. 상기 실험에 의해 얻어진 최적화된 연마 공정 조건하에서 Ceria slurry를 사용하여 연마평가를 실시함으로써 Removal Rate/Roughness 등의 결과를 관찰하였다. 본 연구를 통해 반도체 photo mask 제작을 위한 Ceria slurry의 주요특성을 파악하고 석영기판의 Polishing에 효율적인 조건을 도출함으로써 Lithography 마스크를 효율적으로 제작할 수 있을 것으로 예상된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.158-161
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• 2003

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5% acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Geomechanics and Engineering
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• v.34 no.2
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• pp.125-138
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• 2023

To improve the understanding of infiltration characteristic of modified slurry and the support efficiency of filter cake in silty sand strata, the slurry infiltration (SI) and filter cake formation (FCF) were investigated in a laboratory apparatus. The water discharge and the excess pore pressure at different depths of silty sand strata were measured during SI. The relationship between permeability coefficient/thickness ratio of filter cake (k_c/ΔL) and effective slurry pressure conversion rate of filter cake (η) were analyzed. Moreover, the SI and FCF process as well as the modification mechanism of CMC (carboxymethyl cellulose) were clarified. The experimental results indicate the formation of only external filter cake in the silty sand strata. The slurry particles obtain thicker water membrane after being modified by CMC, which blocks partial water path in filter cake and decreases the water discharge significantly. The silty sand excavated from tunnel face also contributes to the water discharge reduction. The k_c of the external filter cake ranges from 3.83×10^-8 cm/s to 7.44×10^-8 cm/s. The η of the external filter cake is over 96%, which decreases with increasing k_c/ΔL. A silty sand content within 10% is suggested during construction to ensure the uniformity of the filter cake.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.487-487
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• 2009

One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.

• Journal of Electrochemical Science and Technology
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• v.14 no.3
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• pp.262-271
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• 2023

For electrode stability and the electrochemical performance of the Li-ion cell, it is essential that the active ingredients and unique additives in the polymer binder be well dispersed with the solvent-based slurry. The efficient procedure used to create the slurry affects the rheological characteristics of the electrode slurry. When successively adding different steps of Nmethyl-2-pyrrolidone (NMP) solvent to the cathode composition, it is evenly disseminated. The electrochemical performance of the Li-ion cells and the electrodes made with slurry formed by single step and multiple steps of addition of NMP solvent are examined. To preform rheological properties of cathode electrode slurry on Ni-rich Lithium Nickel-Cobalt-Aluminum Oxide (LiNi_0.80Co_0.15Al_0.05) (NCA). Also, we investigate different step addition of electrode formation and mechanical strength characterization like peel strength. According to the EIS study, a multi-step electrode slurry has lower internal resistance than a single-step electrode slurry, which results in better electrical characteristics and efficiency. Further, microstructure of electrodes is obtained electrochemical performance in the 18650 cylindrical cells with targeted capacity of 1.5 Ah. The slurry of electrodes prepared by single step and multiple steps of addition of NMP solvent and its effect on the fabrication of 1.5 Ah cells. A three-step solvent addition on slurry has been found to be a lower internal resistance than a single-step electrode slurry as confirmed by the EIS analysis, yielding improved electrical properties and efficiency.