• Title/Summary/Keyword: size metrics

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BRAIN: A bivariate data-driven approach to damage detection in multi-scale wireless sensor networks

  • Kijewski-Correa, T.;Su, S.
    • Smart Structures and Systems
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    • v.5 no.4
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    • pp.415-426
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    • 2009
  • This study focuses on the concept of multi-scale wireless sensor networks for damage detection in civil infrastructure systems by first over viewing the general network philosophy and attributes in the areas of data acquisition, data reduction, assessment and decision making. The data acquisition aspect includes a scalable wireless sensor network acquiring acceleration and strain data, triggered using a Restricted Input Network Activation scheme (RINAS) that extends network lifetime and reduces the size of the requisite undamaged reference pool. Major emphasis is given in this study to data reduction and assessment aspects that enable a decentralized approach operating within the hardware and power constraints of wireless sensor networks to avoid issues associated with packet loss, synchronization and latency. After over viewing various models for data reduction, the concept of a data-driven Bivariate Regressive Adaptive INdex (BRAIN) for damage detection is presented. Subsequent examples using experimental and simulated data verify two major hypotheses related to the BRAIN concept: (i) data-driven damage metrics are more robust and reliable than their counterparts and (ii) the use of heterogeneous sensing enhances overall detection capability of such data-driven damage metrics.

Software Quality Prediction based on Defect Severity (결함 심각도에 기반한 소프트웨어 품질 예측)

  • Hong, Euy-Seok
    • Journal of the Korea Society of Computer and Information
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    • v.20 no.5
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    • pp.73-81
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    • 2015
  • Most of the software fault prediction studies focused on the binary classification model that predicts whether an input entity has faults or not. However the ability to predict entity fault-proneness in various severity categories is more useful because not all faults have the same severity. In this paper, we propose fault prediction models at different severity levels of faults using traditional size and complexity metrics. They are ternary classification models and use four machine learning algorithms for their training. Empirical analysis is performed using two NASA public data sets and a performance measure, accuracy. The evaluation results show that backpropagation neural network model outperforms other models on both data sets, with about 81% and 88% in terms of accuracy score respectively.

Development and Implementation of Measures for Structural and Reliability Importance by Using Minimal Cut Sets and Minimal Path Sets (최소절단집합과 최소경로집합을 이용한 구조 및 신뢰성 중요도 척도의 개발 및 적용)

  • Choi, Sung-Woon
    • Journal of the Korea Safety Management & Science
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    • v.14 no.1
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    • pp.225-233
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    • 2012
  • The research discusses interrelationship of structural and reliability importance measures which used in the probabilistic safety assessment. The most frequently used component importance measures, such as Birnbaum's Importance (BI), Risk Reduction (RR), Risk Reduction Worth (RRW), RA (Risk Achievement), Risk Achievement Worth (RAW), Fussel Vesely (FV) and Critically Importance (CI) can be derived from two structure importance measures that are developed based on the size and the number of Minimal Path Set (MPS) and Minimal Cut Set (MCS). In order to show an effectiveness of importance measures which is developed in this paper, the three representative functional structures, such as series-parallel, k out of n and bridge are used to compare with Birnbaum's Importance measure. In addition, the study presents the implementation examples of Total Productive Maintenance (TPM) metrics and alternating renewal process models with exponential distribution to calculate the availability and unavailability of component facility for improving system performances. System state structure functions in terms of component states can be converted into the system availability (unavailability) functions by substituting the component reliabilities (unavailabilities) for the component states. The applicable examples are presented in order to help the understanding of practitioners.

Analysis of MANET's Routing Protocols, Security Attacks and Detection Techniques- A Review

  • Amina Yaqoob;Alma Shamas;Jawwad Ibrahim
    • International Journal of Computer Science & Network Security
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    • v.24 no.6
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    • pp.23-32
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    • 2024
  • Mobile Ad hoc Network is a network of multiple wireless nodes which communicate and exchange information together without any fixed and centralized infrastructure. The core objective for the development of MANET is to provide movability, portability and extensibility. Due to infrastructure less network topology of the network changes frequently this causes many challenges for designing routing algorithms. Many routing protocols for MANET have been suggested for last few years and research is still going on. In this paper we review three main routing protocols namely Proactive, Reactive and Hybrid, performance comparison of Proactive such as DSDV, Reactive as AODV, DSR, TORA and Hybrid as ZRP in different network scenarios including dynamic network size, changing number of nodes, changing movability of nodes, in high movability and denser network and low movability and low traffic. This paper analyzes these scenarios on the performance evaluation metrics e.g. Throughput, Packet Delivery Ratio (PDR), Normalized Routing Load(NRL) and End To-End delay(ETE).This paper also reviews various network layer security attacks challenge by routing protocols, detection mechanism proposes to detect these attacks and compare performance of these attacks on evaluation metrics such as Routing Overhead, Transmission Delay and packet drop rates.

The Effect of Process Maturity on the Performance of Industrial R&D Projects (프로세스 성숙도가 기업 R&D 프로젝트의 성과에 미치는 영향에 관한 연구)

  • Hong, Soon-Wook
    • IE interfaces
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    • v.16 no.3
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    • pp.362-374
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    • 2003
  • The major objective of this paper is to empirically examine the effect of process maturity on the performance of industrial R&D projects. Process maturity, a fundamental concept of the Capability Maturity Model developed by Software Engineering Institute, represents the essential of Total Quality Management (TQM). Based on literature, our research model constructs process maturity in terms of structured process, goal setting and controlling, metrics, and process learning; and links it to the R&D performance that consists of technical, commercial and managerial successes. The model also includes firm size as a moderator of different effects that process maturity may have across firms. Measures for process maturity are based on the best practices identified in literature. Data are obtained from 77 successful R&D projects carried out by Korean manufacturing firms. Multiple regression and t-test are used to test proposed hypotheses. Findings are as follows. (1) In the R&D process, process maturity partially contributes to the performance of R&D projects. More specifically, goal setting and controlling-related practices drive both technical and commercial successes, while process learning-related practices drive commercial success. In contrast, traditionally emphasized elements such as structured process or metrics are found not to be significant. (2) The degree of process maturity is significantly higher in large firms. (3) Process maturity impacts on commercial success in the case of large firms, whereas it does on technical success in the case of small firms. The results imply that the TQM principles are partially associated with R&D performance, and the nature of benefit from high maturity could vary according to firm size.

CMP properties of $SnO_2$ thin film (가스센서 $SnO_2$ 박막의 광역평탄화 특성)

  • Choi, Gwon-Woo;Lee, Woo-Sun;Park, Jeng-Min;Choi, Seok-Jo;Park, Do-Sung;Kim, Nam-Oh
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.1600-1604
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    • 2004
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

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CMP properties of $SnO_2$ thin film ($SnO_2$ 박막의 CMP 특성)

  • Choi, Gwon-Woo;Lee, Woo-Sun;Ko, Pil-Ju;Kim, Tae-Wan;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.04b
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    • pp.93-96
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    • 2004
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

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Image and Display Quality Evaluation

  • Ha, Yeong-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1224-1227
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    • 2009
  • When evaluating the quality of images and displays, it is important to combine the characteristics as perceived by the human visual system and measured by equipment using subjective and objective methods, respectively. In the case of objective methods, the quality of a display is measured using colorimetric or radiometric devices according to existing standards covering the color temperature, gamut size, gamma characteristic, and device characterization. Meanwhile, subjective methods assess the quality of an image using the human visual system based on a comparison with a reference or counterpart using such metrics as the sharpness, noise, contrast, saturation, and color accuracy. Objective and subjective methods are usually used together in comparison, as ultimately it is observers watching images on a display. In addition to existing objective methods, a new image quality metric is also introduced as regards the JPEG compression ratio that is reflected in the relationship between the gamut size and the color fidelity in CIELAB color space.

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CMP properties of $SnO_2$ thin film by different slurry (슬러리 종류에 따른 $SnO_2$ 박막의 광역평탄화 특성)

  • Lee, Woo-Sun;Choi, Gwon-Woo;Ko, Pil-Ju;Kim, Wan-Tae;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07a
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    • pp.389-392
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    • 2004
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

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CMP properties of $SnO_2$ thin film ($SnO_2$ 박막의 CMP 특성)

  • Lee, Woo-Sun;Choi, Gwon-Woo;Ko, Pil-Ju;Hong, Kwang-Jun;Seo, Young-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.184-187
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    • 2003
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) lyaer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2-CMP$ process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis or used slurry.

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