• Journal of Powder Materials
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• v.24 no.3
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• pp.223-228
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• 2017

Nanopowders provide better details for micro features and surface finish in powder injection molding processes. However, the small size of such powders induces processing challenges, such as low solid loading, high feedstock viscosity, difficulty in debinding, and distinctive sintering behavior. Therefore, the optimization of process conditions for nanopowder injection molding is essential, and it should be carefully performed. In this study, the powder injection molding process for Fe nanopowder has been optimized. The feedstock has been formulated using commercially available Fe nanopowder and a wax-based binder system. The optimal solid loading has been determined from the critical solid loading, measured by a torque rheometer. The homogeneously mixed feedstock is injected as a cylindrical green body, and solvent and thermal debinding conditions are determined by observing the weight change of the sample. The influence of the sintering temperature and holding time on the density has also been investigated. Thereafter, the Vickers hardness and grain size of the sintered samples have been measured to optimize the sintering conditions.

• Korean Journal of Materials Research
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• v.17 no.6
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• pp.331-336
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• 2007

The pure Mg powder compacts were successfully fabricated using SPS process. The machined chip powder showed flake shaped morphology with coarse surfaces, while gas atomized powders were spherical in morphology with smooth surfaces. In this study, SPS process was used to consolidate the pure Mg powder because this process allows high density consolidation in a short time. The results showed that increased sintering temperature from $350^{\circ}C$ to $500^{\circ}C$ with pressure of 30MPa, the maximum values of the density was increased from 98.1% to 99.8% of theoretical density, respectively. However, density of the sintered chip powders was higher than that of gas-atomized powder due to larger contact areas between particles.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.8
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• pp.87-93
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• 2000

Powder Forging technology is being developed rapidly because of its economic merits and the possibility of lightening parts by replacing steel parts with aluminum ones especially in automotive parts manufacturing. Recently Powder Forging process is widely used for manufacturing primary mechanical parts as a combined technology of P/M and precision hot forging. This paper describes the process conditions for the powder forging of Aluminium alloy piston. For example powder alloy design preform design by FEM simulation cold of compaction of specimens and preform sintering of preform powder forging process. The characteristics of sintered compaction of specimens and preform sintering of preform powder forging process. The characteristics of sintered products and final forged piston ones are investigated with tensile strength hardness ductility and so on. Eventually its results prove the improve mechanical properties of the piston produced by powder forging.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Korean Journal of Materials Research
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• v.31 no.7
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• pp.397-402
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• 2021

In this study, binderless-WC, WC-6 wt%Co, WC-6wt% 1 and 2.5 B₄C materials are fabricated by spark plasma sintering process (SPS process). Each fabricated WC material is almost completely dense, with a relative density up to 99.5 % after the simultaneous application of pressure of 60 MPa. The WC added Co and Co-B₄C materials resulted in crystalline growth. The WC with HCP crystal structure has respective interfacial energy (basal facet direction: 1.07 ~ 1.34 J·m^-2, prismatic direction: 1.43 ~ 3.02 J·m^-2) that depends on the grain growth direction. It is confirmed that the continuous grain growth, biased by the basal facet, which has relatively low energy, is promoted at the WC/Co interface. As abnormal grain growth takes place, the grain size increases more than twice from 0.37 to 0.8 um. It is found through analysis that the hardness property also greatly decreases from about 2661.4 to 1721.4 kg/mm², along with the grain growth.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.09a
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• pp.87-96
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• 2000

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.543-544
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• 2007

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.211.2-211.2
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• 2005

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.95-96
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• 2012

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.97.1-97
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• 2003