• Title/Summary/Keyword: silicon-nitride

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Effects of the Addition of $La_2O_3$ on Mechanical Properties and Machinability of $Si_3N_4$ Ball

  • Sang Yang Lee;Sung Ho Kim;Soo Wohn Lee
    • The Korean Journal of Ceramics
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    • v.6 no.4
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    • pp.364-369
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    • 2000
  • Silicon nitride with adding La$_2$O$_3$ was sintered by gas pressure sintering (GPS) technique at $1950^{\circ}C$, in $N_2$ gas at 3 MPa, for 2h. Mechanical properties such as hardness, flexural strength, and fracture toughness were determined as a function of the GPS holding time and the contents of La$_2$O$_3$ in silicon nitride. Also machinability of silicon nitride ball with various GPS holding time and amount of La$_2$O$_3$ was evaluated by magnetic fluid grinding (MFG) method. In this study it was found that machinability was influenced significantly with La$_2$O$_3$ contents. However, the different GPS holding time did not affect the machinability very much.

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Bottom Gate Microcrystalline Silicon TFT Fabricated on Plasma Treated Silicon Nitride

  • Huang, Jung-Jie;Chen, Yung-Pei;Lin, Hung-Chien;Yao, Hsiao-Chiang;Lee, Cheng-Chung
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.218-221
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    • 2008
  • Bottom-gate microcrystalline silicon thin film transistors (${\mu}c$-Si:H TFTs) were fabricated on glass and transparent polyimide substrates by conventional 13.56 MHz RF plasma enhanced chemical vapor deposition at $200^{\circ}C$. The deposition rate of the ${\mu}c$-Si:H film is 24 nm/min and the amorphous incubation layer near the ${\mu}c$-Si:H/silicon nitride interface is unobvious. The threshold voltage of ${\mu}c$-Si:H TFTs can be improved by $H_2$ or $NH_3$ plasma pretreatment silicon nitride film.

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Damage Tolerance in Hardly Coated Layer Structure with Modest Elastic Modulus Mismatch

  • Lee, Kee-Sung
    • Journal of Mechanical Science and Technology
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    • v.17 no.11
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    • pp.1638-1649
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    • 2003
  • A study is made on the characterization of damage tolerance by spherical indentation in hardly coated layer structure with modest elastic modulus mismatch. A hard silicon nitride is prepared for the coating material and silicon nitride with 5wt% of boron nitride composites for underlayer. Hot pressing to eliminate the effect of interface delamination during the fracture makes strong interfacial bonding. The elastic modulus mismatch between the layers is not only large enough to suppress the surface crack initiation from the coating layer but sufficiently small to prevent the initiation of radial crack from the interface. The strength degradation of the layer structure after sphere contact indentation does not significantly occur, while the degradation of silicon nitride-boron nitride composite is critical at a high load and high number of contacts.

Investigation of the surface oxide/nitride passivation formation screen printed crystalline silicon solar cells (표면 oxide/nitride passivation 적용된 Screen printed 결정질 태양전지 특성 평가)

  • Lee, Ji-Hun;Cho, Kyeng-Yeon;Lee, Soo-Hong;Lee, Kyu-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.223-224
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    • 2008
  • Important element are low cost, high-efficiency crystalline silicon solar cells. in this paper, Will be able to contribute in low cost, high-efficiency silicon solar cells, Applies oxide/nitride passivation, produced screen-printed solar cells. and the Measures efficiency, and evaluated a justice quality oxide/nitride passivation screen-printed solar cells.

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Effect of Si/Si3N4 Ratio on the Microstructure and Properties of Porous Silicon Nitrilde Prepared by SHS Methode (규소/질화규소 비가 자전연소합성공정을 이용한 다공질 질화규소 세라믹스의 미세구조와 특성에 미치는 영향)

  • Kim, Dong-Baek;Park, Dong-Soo;Hahn, Byung-Dong;Jung, Yeon-Gil
    • Journal of the Korean Ceramic Society
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    • v.44 no.6 s.301
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    • pp.338-342
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    • 2007
  • Porous silicon nitride ceramics were prepared by SHS (Self-Propagating High Temperature Synthesis) from silicon powder, silicon nitride powder and pore-forming precursor. The microstructure, porosity and the flexural strength of the porous silicon nitride ceramics were varied according to the Si/Si3N4 ratio, size and amount of the pore-forming precursors. Some sample exhibited as high flexural strength as $162{\pm}24\;MPa$. The high strength is considered to result from the fine pore size and the strong bonding amoung the silicon nitride particles.