• 제목/요약/키워드: silicon sensor

검색결과 532건 처리시간 0.027초

상대압 용량성 압력센서의 제작 (Fabrication of Relative-type Capacitive Pressure Sensor)

  • 서희돈;임근배;최세곤
    • 전자공학회논문지A
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    • 제30A권7호
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    • pp.82-88
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    • 1993
  • This paper describes fabrication of relative type capacitive pressure sensor to be in great demand for many fields. The fabricated sensor consists of two parts` a sensing diaphragm and a pyrox glass cover. The sensor size is 4.5${\times}3.4mm$^{2})$ and 400$\mu$m thick. To improve the nonlinearity, this sensor is designed a rectangular silicon diaphragm with a center boss structure, and in order to improve the temperature characteristics of the sensor in a packaging process, the sensing element is mounted on the pyrex glass support. Some suggestions toward the design and fabrication of improved sensors have been presented. The zero pressure capacitance, Co of sensor is 26.57pF, and the change of capacitance, ${\Delta}$C is 1.55pF from 0Kgf/Cm$^{2}$ to 1Kgf/Cm$^{2}$ at room temperature. The nonlinearity of the sensor output with center boss diaphragm is 1.29%F.S., and thermal zero shift and thermal sensitivity shift is less than 1.43%F.S./$^{\circ}C$and 0.14% F.S./$^{\circ}C$, respectively.

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표면 가공형 캐비티 압력센서를 이용하여 비전도성 물질용 패키지 기술에 전기적 제어방식 연구 (The Electric Control Method on the Packaging Technology for Non-Conductive Materials Using the Surface Processing Cavity Pressure Sensor)

  • 이선종;우종창
    • 한국전기전자재료학회논문지
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    • 제33권5호
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    • pp.350-354
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    • 2020
  • In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

비침습적 맥파 측정을 위한 압력센서 패키징에 관한 연구 (Pressure Sensor Packaging for Non-invasive Pulse Wave Measurement)

  • 김은근;남기창;허현;허영
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 제40회 하계학술대회
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    • pp.1978.1_1979.1
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    • 2009
  • In this paper, we have proposed and demonstrated a tonometry sensor array for measuring arterial pulse pressure. A sensor module consists of 7 piezoresistive pressure sensor array. Wire-bonded connection was provided between silicon chip and lead frame. PDMS(poly-dimethylsiloxane) was coated on the sensor array to protect fragile sensor while faithfully transmitting the pressure of radial artery to the sensor. Tonometric pulse pressure can be measured by this packaged sensor array that provides the pressure value versus the output voltage.

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Potential Dependence of Electrochemical Etching Reaction of Si(111) Surface in a Fluoride Solution Studied by Electrochemical and Scanning Tunneling Microscopic Techniques

  • Bae, Sang-Eun;Youn, Young-Sang;Lee, Chi-Woo
    • Journal of Electrochemical Science and Technology
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    • 제11권4호
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    • pp.330-335
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    • 2020
  • Silicon surface nanostructures, which can be easily prepared by electrochemical etching, have attracted considerable attention because of its useful physical properties that facilitate application in diverse fields. In this work, electrochemical and electrochemical-scanning tunneling microscopic (EC-STM) techniques were employed to study the evolution of surface morphology during the electrochemical etching of Si(111)-H in a fluoride solution. The results exhibited that silicon oxide of the Si(111) surface was entirely stripped and then the surface became hydrogen terminated, atomically flat, and anisotropic in the fluoride solution during chemical etching. At the potential more negative than the flat band one, the surface had a tendency to be eroded very slowly, whereas the steps of the terrace were not only etched quickly but the triangular pits also deepened on anodic potentials. These results provided information on the conditions required for the preparation of porous nanostructures on the Si(111) surface, which may be applicable for sensor (or device) preparation (Nanotechnology and Functional Materials for Engineers, Elsevier 2017, pp. 67-91).

SDB 웨이퍼를 이용한 절대압 실리콘 압력센서의 제조 (Fabrication of absolute silicon pressure sensor using SDB wafer)

  • 이창준;강신원;최시영
    • 센서학회지
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    • 제4권1호
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    • pp.29-34
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    • 1995
  • SDB웨이퍼를 이용하여 절대압을 감지할 수 있는 압저항형 실리콘 다이아프램 압력센서를 제조하였다. 제조된 센서는 브릿지 형태로 연결된 4개의 압저항과 인가되는 압력에 대한 기계적인 증폭기 역할을 할 수 있는 다이아프램으로 구성되어 있다. 다이아프램 공극(cavity)을 낮은 진공상태로 만들기 위해 실리콘 다이아프램과 Pyrex 7740유리를 0.02mmHg, $400^{\circ}C$에서 정전 접합하였다. 제조된 센서의 감도와 오프셋 전압은 각각 $30.4{\mu}V/VmmHg$, 30.6mV였다.

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Electrical Properties of Alcohol Vapor Sensors Based on Porous Silicon

  • Park, Kwang-Youl;Kang, Kyung-Suk;Kim, Seong-Jeen;Lee, Sang-Hoon;Park, Bok-Gil;Sung, Man-Young
    • 한국전기전자재료학회논문지
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    • 제16권12S호
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    • pp.1232-1236
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    • 2003
  • In this work, we fabricated a gas-sensing device based on porous silicon(PS), and its C-V properties were investigated for sensing alcohol vapor. The structure of the sensor consists of thin Au/oxidized PS/PS/P-Si/Al, where the p-Si is etched anisotropically to be prepared into a membrane-shape. We used alcohol gases vaporized from different alcohol (or ethanol) solutions mixed with pure water at 36$^{\circ}C$, similarly with an alcohol breath measurement to check drunk driving. As the result, I-V curves showed typical tunneling property, and C-V curves were shaped like those of a MIS (metal-insulator-semiconductor) capacitor, where the capacitance in accumulation was increased with alcohol vapor concentration.

Thermo-Piezoelectric Read/Write Mechanisms for Probe-Based Data Storage

  • Nam, Hyo-Jin;Kim, Young-Sik;Lee, Sun-Yong;Jin, Won-Hyeog;Jang, Seong-Soo;Cho, Il-Joo;Bu, Jong-Uk
    • 정보저장시스템학회논문집
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    • 제3권1호
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    • pp.47-53
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    • 2007
  • In this paper, a thermo-piezoelectric mechanism with integrated heaters and piezoelectric sensors has been studied for low power probe-based data storage. Silicon nitride cantilever integrated with silicon heater and piezoelectric sensor has been developed to improve the uniformity of cantilevers. Data bits of 40 nm in diameter were recorded on PMMA film. The sensitivity of the piezoelectric sensor was 0.615 fC/nm after poling the PZT layer. And, the $34\times34$ probe array integrated with CMOS circuits has been successfully developed by simple one-step bonding process. The process can simplify the process step and reduce tip wear using silicon nitride tip.

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Top-down 방식으로 제작한 실리콘 나노와이어 ISFET 의 전기적 특성 (A Study on the Electrical Characterization of Top-down Fabricated Si Nanowire ISFET)

  • 김성만;조영학;이준형;노지형;이대성
    • 한국정밀공학회지
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    • 제30권1호
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    • pp.128-133
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    • 2013
  • Si Nanowire (Si-NW) arrays were fabricated by top-down method. A relatively simple method is suggested to fabricate suspended silicon nanowire arrays. This method allows for the production of suspended silicon nanowire arrays using anisotropic wet etching and conventional MEMS method of SOI (Silicon-On-Insulator) wafer. The dimensions of the fabricated nanowire arrays with the proposed method were evaluated and their effects on the Field Effect Transistor (FET) characteristics were discussed. Current-voltage (I-V) characteristics of the device with nanowire arrays were measured using a probe station and a semiconductor analyzer. The electrical properties of the device were characterized through leakage current, dielectric property, and threshold voltage. The results implied that the electrical characteristics of the fabricated device show the potential of being ion-selective field effect transistors (ISFETs) sensors.

실리콘 선택적 기상 성장을 이용한 마이크로 센서에 응용되는 구조물 제조법 (Application of selective Epitaxial Growth of Silicon on MEMS Structure)

  • 박정호;김종관;김상영;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1025-1027
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    • 1995
  • SEG(Selective Epitaxial Growth) and ELO(Epitaxial Lateral Growth) of Silicon offer new opportunities in the fabrication of MEMS(Micro Electro-Mechanical Systems) structures. SEG of silicon enables the stacking of junctions in addition to those resulting from the standard bipolar process and this properly was utilized for the fabrication of an improved-performance color sensor. When the crystalline growth takes place through the seed windows and proceeds over the dielectric, after reaching the surface, it form an ELO silicon layer and this ELO-Si can be modified into various structures for MEMS application such as cantilevers, beams, diaphragms.

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고온에서 제작된 n채널 다결정 실리콘 박막 트랜지스터의 단채널 효과 연구 (A Study on Short Channel Effects of n Channel Polycrystalline Silicon Thin Film Transistor Fabricated at High Temperature)

  • 이진민
    • 한국전기전자재료학회논문지
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    • 제24권5호
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    • pp.359-363
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    • 2011
  • To integrate the sensor driver and logic circuits, fabricating down scaled transistors has been main issue. At this research, short channel effects were analyzed after n channel polycrystalline silicon thin film transistor was fabricated at high temperature. As a result, on current, on/off current ratio and transconductance were increased but threshold voltage, electron mobility and s-slope were reduced with a decrease of channel length. When carriers that develop at grain boundary in activated polycrystalline silicon have no gate biased, on current was increased with punch through by drain current. Also, due to BJT effect (parallel bipolar effect) that developed under region of channel by increase of gate voltage on current was rapidly increased.