• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
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• pp.49-54
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• 2005

In the case of a sensitive equipment, it require a vibration free environment to provide its proper function. Especially, lithography and inspection device, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved Giga Class semi conductor wafers. The aim of this study is to evaluate the allowable vibration response of a precision inspect ion equipment, which has some trouble in field, by using experimental measurement data and to proposal a proper ant i-vibration method.

• 한국산학기술학회논문지
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• 제22권1호
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• pp.327-332
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• 2021

패키지레벨에서 반도체의 신뢰성 검사는 테스트 소켓에 반도체 칩 패키지를 탑재시킨 상태에서 테스트가 진행되며, 테스트 소켓은 기본적으로 반도체 칩 패키지의 형태에 따라서 그 모양이 결정되는 것이 일반적이다. 또한, 반도체 칩 패키지의 리드와 소켓 리드의 기계적인 접촉에 의해 테스트 장비와 연결하는 매개체의 역할을 하며, 신호전달 과정에서 신호의 손실을 최소화하여 반도체에 검사신호를 잘 전달할 수 있도록 하는 기능이 핵심이다. 본 연구에서는 이웃하고 있는 전기 전달 경로의 상호 영향성을 검사 할 수 있는 기술을 적용함으로써 수명 검사와 정밀 측정뿐만 아니라 이웃하고 있는 전기 전달 경로의 구조를 포함하여 단 한 번의 접촉을 통해 100개미만의 실리콘 테스트 소켓의 합선 테스트가 가능하도록 개발하였다. 개발된 장치의 테스트 결과 99%이상의 테스트 정밀도와 0.66이하의 동시 검사속도 특성을 나타내었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권4호
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• pp.410-414
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• 2013

We report the wet etching of titanium nickel (TiNi) films for the production of nano-electro-mechanical (NEM) device. $SiO_2$ and $Si_3N_4$ have been selected as sacrificial layers of TiNi metal and etched with polyethylene glycol and hydrofluoric acid (HF) mixed solution. Volume percentage of HF are varied from 10% to 35% and the etch rate of the $SiO_2$, $Si_3N_4$ and TiNi are reported here. Within the various experiment results, 15% HF mixed polyethylene glycol solution show highest etch ratio between sacrificial layer and TiNi metal. Especially $Si_3N_4$ films shows high etch ratio with TiNi films. Wet etching results are measured with SEM inspection. Therefore, this experiment provides a novel method for TiNi in the nano-electro-mechanical device.

• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.

• 한국산업융합학회 논문집
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• 제25권3호
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• pp.333-340
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• 2022

Recently, the use of large-capacity secondary batteries for electric vehicles is rapidly increasing, and accordingly, the demand for technologies and equipment for battery reliability evaluation is increasing significantly. The existing short circuit test equipment for evaluating the stability of the existing secondary battery consists of relays, MCs, and switches, so when a large current is energized during a short circuit, contact fusion failures occur frequently, resulting in high equipment maintenance and repair costs. There was a disadvantage that repeated testing was impossible. In this paper, we developed an electronic short circuit test device that realizes stable switching operation when a large-capacity power semiconductor switch is energized with a large current, and applied smart ICT technology to this electronic short circuit stability test system to achieve high speed and high precision through communication with the master. It is expected that the inspection history management system based on data measurement, database format and user interface will be utilized as essential inspection process equipment.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.139-144
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• 2020

Recently, the electronic equipment industry has become active due to the continuous increase in portable storage media with high-speed information communication, and in particular, the production of SSD(Solid State Drives) for miniaturization of mobile devices and high-speed information communication has increased rapidly. When the SSD is ejecting in the SSD test gender, the necessary ejecting force must be kept constant to have a lifespan applicable to the test device. When the ejecting force increased, it leads to wear of the link for ejecting, which causes a problem in that repeated durability decreases and the ejecting of the SSD becomes impossible. In this paper, the repeated durability test analysis according to the material and the reducing ejecting force design were performed to increase the life of the test gender for SSD inspection. The wear level of the pusher head and ejector was analyzed through repeated durability tests according to the material of the pusher head. The validity of the design was verified through the ejecting force test and repeated durability test of the Test gender, which was designed by carrying out the design to reduce the size and ejecting force of the test gender.

• 전자공학회논문지SC
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• 제49권4호
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• pp.10-16
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• 2012

영상 기반 반도체 검사 장비의 검사 고속화와 검사 정확도를 위해, 넓은 FOV와 고해상도를 동시에 가지는 2차원 영상을 획득하는 것은 검사 장비에 필수적이다. 본 논문에서는 정밀도와 FOV 측면에서 양질의 영상 획득을 위한 새로운 영상획득 시스템을 제안하였다. 제안시스템은 하나의 렌즈와 광분할기, 두 개의 카메라 센서, 스테레오 영상획득 보드로 구성되며, 하나의 렌즈를 통해 입력되는 영상을 두 개의 카메라 센서를 통해 동시에 영상 획득한다. 획득된 영상의 정합을 위해, 첫 번째로 Zhang의 카메라 교정 방법을 적용시켜 각각의 카메라를 교정한다. 두 번째로 다른 카메라에서 획득한 두 영상들 사이의 수학적인 정합 함수를 찾기 위해 각 영상의 호모그래피(homography)를 이용하여, 양측 카메라간의 정합 행렬을 계산한다. 영상 호모그래피를 통해서, 획득된 두 영상은 하나의 최종 검사 영상으로의 통합을 위해 최종적으로 정합될 수 있다. 다중 카메라로부터 입력되는 다중 영상들을 활용하는 제안 검사 시스템은 실시간 영상 정합을 위해 매우 빠른 프로세스 유닛의 도움이 필요하다. 이를 위해 CUDA (Compute Unified Device Architecture)기반 병렬 프로세싱 하드웨어 및 소프트웨어를 활용한다. 두 개의 분할된 영상으로부터 실시간으로 정합된 영상을 얻을 수 있었으며, 마지막으로 연속된 실험을 통해 획득한 호모그래피의 정확도를 확인할 수 있다. 실험으로 얻은 결과들은 제안된 시스템과 방법이 대영역 고해상도 검사영상 획득을 위해 효과적임을 보인다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1730-1733
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• 2007

As semiconductor and MEMS devices become smaller, testing process during their production should follow such a high density trend. A circuit inspection tool "probe card" makes contact with electrode pads of the device under test (DUT). Nowadays, electrode pads are irregularly arranged and have height difference. In order to absorb variations in the heights of electrode pads and to generate contact loads, contact probes must have some levels of mechanical spring properties. Contact probes must also yield a force to break the surface native oxide layer or contamination layer on the electrodes to make electric contact. In this research, new vertical micro contact probe with bellows shape is developed to overcome shortage of prior work. Especially, novel bellows shape is used to reduce stress concentration in this design and stopper is used to change the stiffness of micro contact probe. Variable stiffness can be one solution to overcome the height difference of electrode pads.

• Applied Microscopy
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• 제52권
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• pp.1.1-1.8
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• 2022

As semiconductor device architecture develops, from planar field-effect transistors (FET) to FinFET and gate-all-around (GAA), there is an increased need to measure 3D structure sidewalls precisely. Here, we present a 3-Dimensional Atomic Force Microscope (3D-AFM), a powerful 3D metrology tool to measure the sidewall roughness (SWR) of vertical and undercut structures. First, we measured three different dies repeatedly to calculate reproducibility in die level. Reproducible results were derived with a relative standard deviation under 2%. Second, we measured 13 different dies, including the center and edge of the wafer, to analyze SWR distribution in wafer level and reliable results were measured. All analysis was performed using a novel algorithm, including auto fattening, sidewall detection, and SWR calculation. In addition, SWR automatic analysis software was implemented to reduce analysis time and to provide standard analysis. The results suggest that our 3D-AFM, based on the tilted Z scanner, will enable an advanced methodology for automated 3D measurement and analysis.

• 전자공학회논문지SC
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• 제49권1호
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• pp.80-87
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• 2012

본 논문에서는 열상장비의 광 검출기에서 검출된 미약한 전기적 신호를 영상신호처리를 하기 위한 신호로 증폭을 해 주는 전단 증폭부의 성능 검사용 ATE(Automatic Test Equipment)를 개발하였다. 기존 ATE 장비는 주로 반도체 소자 양품검사 분야에서 활발히 개발되고 있었으나 최근에는 장비의 성능검사 분야에서도 연구되고 있다. 그러나 열상장비 성능검사 분야의 ATE 에 대한 연구는 다른 분야에 비해 미진하여 우리군의 핵심적인 감시 장비인 열상장비는 정비가 제한되었다. 이에 따라 본 논문에서는 새로운 열상장비 분야의 ATE 연구가 필요하여 전단증폭부 및 열상장비의 다른 회로카드의 범용적인 개발이 가능하도록 Matrix Relay를 개발하였다. 개발된 ATE로 전단증폭부의 증폭도를 측정한 결과 증폭 전압은 평균 2.71 Vpp로써 이론적인 분석 범위 내에 있음이 확인되어 개발된 ATE가 우수한 성능임이 검증되었다.