• Title/Summary/Keyword: semiconductor device

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Optimization of InAlAs/InGaAs HEMT Performance for Microwave Frequency Applications and Reliability

  • Gupta, Ritesh;Aggarwal, Sandeep Kumar;Gupta, Mridula;Gupta, R.S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.3
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    • pp.240-249
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    • 2004
  • In the present paper efforts have been made to optimize InAlAs/InGaAs HEMT by enhancing the effective gate voltage ($(V_c-V_off)$) using pulsed doped structure from uniformly doped to delta doped for microwave frequency applications and reliability. The detailed design criteria to select the proper design parameters have also been discussed in detail to exclude parallel conduction without affecting the del ice performance. Then the optimized value of $V_c-V_off$and breakdown voltages corresponding to maximum value of transconductance has been obtained. These values are then used to predict the transconductance and cut-off frequency of the del ice for different channel depths and gate lengths.

Integrate-and-Fire Neuron Circuit and Synaptic Device using Floating Body MOSFET with Spike Timing-Dependent Plasticity

  • Kwon, Min-Woo;Kim, Hyungjin;Park, Jungjin;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.6
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    • pp.658-663
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    • 2015
  • In the previous work, we have proposed an integrate-and-fire neuron circuit and synaptic device based on the floating body MOSFET [1-3]. Integrate-and-Fire(I&F) neuron circuit emulates the biological neuron characteristics such as integration, threshold triggering, output generation, refractory period using floating body MOSFET. The synaptic device has short-term and long-term memory in a single silicon device. In this paper, we connect the neuron circuit and the synaptic device using current mirror circuit for summation of post synaptic pulses. We emulate spike-timing-dependent-plasticity (STDP) characteristics of the synapse using feedback voltage without controller or clock. Using memory device in the logic circuit, we can emulate biological synapse and neuron with a small number of devices.

Analytical Model for Metal Insulator Semiconductor High Electron Mobility Transistor (MISHEMT) for its High Frequency and High Power Applications

  • Gupta, Ritesh;Aggarwal, Sandeep Kr;Gupta, Mridula;Gupta, R.S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.6 no.3
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    • pp.189-198
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    • 2006
  • A new analytical model has been proposed for predicting the sheet carrier density of Metal insulator Semiconductor High Electron Mobility Transistor (MISHEMT). The model takes into account the non-linear relationship between sheet carrier density and quasi Fermi energy level to consider the quantum effects and to validate it from subthreshold region to high conduction region. Then model has been formulated in such a way that it is applicable to MESFET/HEMT/MISFET with few adjustable parameters. The model can also be used to evaluate the characteristics for different gate insulator geometries like T-gate etc. The model has been extended to forecast the drain current, conductance and high frequency performance. The results so obtained from the analysis show excellent agreement with previous models and simulated results that proves the validity of our model.

An Analysis of Damage Mechanism of Semiconductor Devices by ESD Using Field-induced Charged Device Model (유도대전소자모델(FCDM)을 이용한 ESD에 의한 반도체소자의 손상 메커니즘 해석)

  • 김두현;김상렬
    • Journal of the Korean Society of Safety
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    • v.16 no.2
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    • pp.57-62
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    • 2001
  • In order to analyze the mechanism of semiconductor device damages by ESD, this paper adopts a new charged-device model(CDM), field-induced charged nudel(FCDM), simulator that is suitable for rapid routine testing of semiconductor devices and provides a fast and inexpensive test that faithfully represents ESD hazards in plants. The high voltage applied to the device under test is raised by the fie]d of non-contacting electrodes in the FCDM simulator. which avoids premature device stressing and permits a faster test cycle. Discharge current md time are measured and calculated The FCDM simulator places the device at a huh voltage without transferring charge to it, by using a non-contacting electrode. The only charge transfer in the FCMD simulator happens during the discharge. This paper examine the field charging mechanism, measure device thresholds, and analyze failure modes. The FCDM simulator provides a Int and inexpensive test that faithfully represents factory ESD hazards. The damaged devices obtained in the simulator are analyzed and evaluated by SEM Also the results in this paper can be used for to prevent semiconductor devices from ESD hazards.

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Analytic Threshold Voltage Model of Recessed Channel MOSFETs

  • Kwon, Yong-Min;Kang, Yeon-Sung;Lee, Sang-Hoon;Park, Byung-Gook;Shin, Hyung-Cheol
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.10 no.1
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    • pp.61-65
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    • 2010
  • Threshold voltage is one of the most important factors in a device modeling. In this paper, analytical method to calculate threshold voltage for recessed channel (RC) MOSFETs is studied. If we know the fundamental parameter of device, such as radius, oxide thickness and doping concentration, threshold voltage can be obtained easily by using this model. The model predicts the threshold voltage which is the result of 2D numerical device simulation.

Transparent-Oxide-Semiconductor Based Staggered Self-Alignment Thin-Film Transistors

  • Yamagishi, Akira;Naka, Shigeki;Okada, Hiroyuki
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1105-1106
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    • 2008
  • Staggered type self-aligned transparent-oxide-semiconductor transistors with indium-zinc-oxide as a semiconductor have studied. In this device fabrication, successive sputtering of oxide semiconductor and insulator without breaking of vacuum and without exposing in air, humidity and oxygen can be realized because oxide semiconductor is transparent. As a result of fabrication, transistor characteristics with mobility of $30cm^2/Vs$ and on-off ratio of $10^5$ could be obtained for the newly developed self-alignment device structure.

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Optimization of Gate Stack MOSFETs with Quantization Effects

  • Mangla, Tina;Sehgal, Amit;Saxena, Manoj;Haldar, Subhasis;Gupta, Mridula;Gupta, R.S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.3
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    • pp.228-239
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    • 2004
  • In this paper, an analytical model accounting for the quantum effects in MOSFETs has been developed to study the behaviour of $high-{\kappa}$ dielectrics and to calculate the threshold voltage of the device considering two dielectrics gate stack. The effect of variation in gate stack thickness and permittivity on surface potential, inversion layer charge density, threshold voltage, and $I_D-V_D$ characteristics have also been studied. This work aims at presenting a relation between the physical gate dielectric thickness, dielectric constant and substrate doping concentration to achieve targeted threshold voltage, together with minimizing the effect of gate tunneling current. The results so obtained are compared with the available simulated data and the other models available in the literature and show good agreement.

Influence of Oxide Fabricated by Local Anodic Oxidation in Silicon (실리콘에 Local Anodic Oxidation으로 만든 산화물의 영향)

  • Jung, Seung-Woo;Byun, Dong-Wook;Shin, Myeong-Cheol;Schweitz, Michael A.;Koo, Sang-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.4
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    • pp.242-245
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    • 2021
  • In this work, we fabricated oxide on an n-type silicon substrate through local anodic oxidation (LAO) using atomic force microscopy (AFM). The resulting oxide thickness was measured and its correlation with load force, scan speed and applied voltage was analyzed. The surface oxide layer was stripped using a buffered oxide etch. Ohmic contacts were created by applying silver paste on the silicon substrate back face. LAO was performed at approximately 70% humidity. The oxide thickness increased with increasing the load force, the voltage, and reducing the scan speed. We confirmed that LAO/AFM can be used to create both lateral and, to some extent, vertical shapes and patterns, as previously shown in the literature.

Behavior of Oxygen Precipitates during SIMOX SOI Fabrication and Their Influences to the Electrical Property (SIMOX SOI 제조시 산소석출물의 거동과 전지적 특성에 미치는 영향)

  • Bae, Young-Ho;Chung, Woo-Jin;Kim, Kwang-Il;Kwon, Young-Kyu;Kim, Bum-Man;Cho, Chan-Sub;Lee, Jong-Hyun
    • Journal of the Korean Vacuum Society
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    • v.1 no.1
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    • pp.206-211
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    • 1992
  • SIMOX SOI structures were formed by oxygen ion implantation with a dose of 2 1018 ions/cm2 at 180kev and post-implantation annealing at $1250^{\circ}C$ for 6 hours in nitrogen ambient. The oxygen redistribution process during post-implantation annealing was examined by AES and TEM. The electrical property of the structure was investigated by SRP method. We could find oxygen precipitates in SOI layer was discussed. And the limiting factor to the decrease of the precipitates during post-implantation annealing was discussed also.

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TCAD Based Power Semiconductor Device e-Learning Tool

  • Landowski, Matthew M.;Shen, Z. John
    • Journal of Power Electronics
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    • v.10 no.6
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    • pp.643-646
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    • 2010
  • An interactive web-based teaching tool for a power semiconductor course at the University of Central Florida is presented in this paper. A novel approach is introduced using Technology Aided Design Tools (TCAD) to generate time-lapsed 2D semiconductor device cross-section embedded in a webpage using $Adobe^{(R)}$ Flash (web design tool) platform to create interactive movies that demonstrate complex device physical phenomenon. Students can step through the interactive movies forward, backward, pausing, or looping. Each step represents a giving bias condition. Current-voltage plots are represented along with the semiconductor device and a visual point is placed on the IV curve to indicate the current bias conditions. The changes are then reflected in the 2D cross-section movie area and the IV plot. This tool was implemented in a classroom setting to augment the lectures or for discovery learning.