• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.112-115
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• 2002

The effects of processing aids(P.A.) in semicoductive compounds(S.C.) with highly loaded carbon black for extra high voltage cables were investigated. The processability of S.C. is improved as the contents of P.A. increased, however, the electrical, mechanical properties and smoothness of S.C. grew worse, especially for the S.C. which contains 5wt% of P.A., the volume resistivity after heat cycle which shows long term reliability increased about three times after 15cycles compared to the S.C. which contains no P.A. We inferred that it is caused by the action of P.A. as the insulating sites, thermal expansion of polymer matrix which leads the length between carbon blacks to shorten, and the decrease of degree of crosslinking. The change of ion contents which means cleanliness of S.C. is not occured regardless of the addition of P.A.