• Title/Summary/Keyword: semi-solid packages

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A Study on Development of Program for an Automated Thixoforming Process Design (Thixoforming 공정설계 자동화를 위한 프로그램 개발에 관한 연구)

  • Kim, Nam-Seok;Jeong, Hong-Gyu;Gang, Chung-Gil
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.1
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    • pp.44-55
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    • 2001
  • The flow behavior of semi-solid materials (SSM) is required to assist the industrial application of thixoforming technology. Particularly, to reduce many lead times, many numerical analysis packages have been developed to simulate required metal forming processes. The objectives of the development of SEMI-FORM for thixoforming process design are to predict the effect of various process variables such as pressing force, die temperature, and die velocity. However, there have not been any reports which adapt these packages to the specific characteristics of SSM. SO, this paper presents an overview of the development of thixoforming simulator of SEMI-FORM. The solver and post-processor of SEMI-FORM S/W for an automated thixoforming process design with arbitrarily shaped die are composed of FORTRAN Power Station 4.0 and Visual Basic 5.0, respectively. This developing SEMI-FORM S/W would be very useful for thixoforming practitioners and engineers to select the optimal process conditions to produce automotive parts with high quality.

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Three Dimensional Mathematical Simulation for Predicting the Shelf Life of Tofu Packaged in a Semi-rigid Plastic Container (플라스틱 용기 포장 두부의 유통기간 예측을 위한 3차원 수치모사)

  • Kim, Jai-Neung;Lee, Youn-Suk
    • Korean Journal of Food Science and Technology
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    • v.41 no.3
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    • pp.272-277
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    • 2009
  • In this research, three dimensional mathematical models were developed to predict the shelf life of tofu packaged in a semi-rigid plastic container. A model combining oxygen transfer through the package and oxygen consumption within the package was considered. According to the results, the model simulations estimated that the number of microorganisms in the filled water was higher than that in the tofu, suggesting the shelf life of packaged tofu was not affected by the number of microorganisms in the tofu product, but rather by the number of organisms in the filled water. Additionally, the effects of the physical properties of the packaging material, such as oxygen permeability through the package, oxygen diffusion coefficient, the initial oxygen concentration in the filled water, and the depth of the filled water in the packaged tofu, were also observed.