• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.77-77
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• 2000

Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

• 한국결정성장학회지
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• 제13권3호
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• pp.122-126
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• 2003

본 연구에서는 두께가 0.7 $\mu \textrm{m}$인 $Zn_{0.86}Mn_{0.14}$Te 에피막을 GaAs(100) 기판 위에 열벽 적층 성장하였다. 선택에칭용액에 의하여 GaAs 기판이 제거된 X-선 회절 패턴으로부터 $Zn_{0.86}Mn_{0.14}$Te에피막의 결정구조는 zincblende 이었으며 격자상수는 6.140 $\AA$으로 계산되었다. 이러한 격자상수 값과 Vegard 법칙으로부터 Mn의 조성비 x=0.14임을 알았다. 성장된 에피막의 결정성은 이중결정요동 곡선의 반폭치 값이 256 arcsec인 것으로부터 양호하다는 것이 확인되었다 상온에서 10K 까지 $Zn_{0.86}Mn_{0.14}$Te에피막의 온도에 따른 띠 간격 에너지를 측정하기 위하여 투과 스펙트럼으로부터 흡수 스펙트럼이 얻어졌다 온도가 감소할수록 흡수 스펙트럼에서 강하게 흡수가 일어나는 영역은 에너지가 큰 쪽을 향하여 이동하였고 흡쑤단 근처에서 자유 엑시톤 형성을 의미하는 흡수 피크가 생겨났다. $Zn_{0.86}Mn_{0.14}$Te에피막의 온도에 따른 자유 엑시톤 피크 에너지로부터 OK와 300 K일 때 띠 간격 에너지는 각각 2.4947 eV와 2.330 eV로 구하여졌다. 10 K에서 기판이 제거된 $Zn_{0.86}Mn_{0.14}$Te 에피막의 흡수 스펙트럼의 자유 엑시톤 피크 에너지는 광발광 피크 에너지보다 15.4 meV 정도 크다. 이 에너지 차이는 흡수 스펙트럼과 발광 피크 사이의 에너지 차이를 의미하는 Stokes shift를 나타낸다.