• Title/Summary/Keyword: seed layer

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Lipid and Lipase Distribution on Endosperm Cell of Panax ginseng Seed for the Electron Microscope (전자현미경을 이용한 인삼종자 배유세포내의 지질 및 지질가수분해 효소의 분포)

  • 유성철;노미전
    • Journal of Ginseng Research
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    • v.16 no.2
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    • pp.129-137
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    • 1992
  • This study was carried out to investigate the localization of lipids and lipase activity with lipid staining and cytochemical technique in endosperm cells of Panax ginseng C.A. Meyer seed. In endosperm cells of indehiscent seed, protein bodies facing the umbiliform layer are different in electron density during the various degraded processes. Gradually, protein matrix near the cell wall was lysed and electron lucent inclusions appeared on umbiliform layer. The protein body with high electron density and the spherosome with low electron density were observed in endosperm cells. As a result of lipid staining, electron density of spherosome is more intense than those of the protein matrix within the protein body in endosperm cells of indehiscent seed. Free spherical spherosomes within the umbiliform layer have a high electron density. The spherical spherosomes were more electron densed and were uniform in comparison with the cytoplasmic proteinaceous granules in endosperm cells of seed with red seed coat. The major component of spherosome was determined to be lipid. Lipase activity occurs in the spherosome and near the endosperm cell wall facing the umbiliform layer. Cytochemical reaction products of lipase were observed in the spherosome membrane and in the inner regions of spherosome. After protein bodies were digested, lipase activities were observed in free spherosomes and near the cell wall of endosperm cells. Umbiliform layer composing of fibrillized wall and digested materials of the endosperm cell showed a little lipase reaction products.

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Effect of Seed Coating Layer on the Microstructure of NaA Zeolite Separation Layer Grown on ${\alpha}$-alumina Support (종결정 코팅층이 다공성 ${\alpha}$-알루미나 지지체 표면에 성장되는 NaA 제올라이트 분리층의 미세구조에 미치는 영향)

  • Kim, Min-Ji;Sharma, Pankaj;Han, Moon-Hee;Cho, Churl-Hee
    • Membrane Journal
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    • v.24 no.5
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    • pp.375-385
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    • 2014
  • NaA zeolite/${\alpha}$-alumina composite membranes were hydrothermally synthesized at $100^{\circ}C$ for 24 hr by using nanosize seed of 100 nm in diameter and an ${\alpha}$-alumina support of $0.1{\mu}m$ in pore diameter, and then effect of seed coating layer on the microstructure of NaA zeolite separation layer was systematically investigated. In cases when nanosize seed was coated with a monolayer, increment in seed coverage induced small grained and thick NaA zeolite separation layer. On the other hand, in case when nanosize seed was coated with a multilayer, much small grained and thick separation layer was formed. It was clear that an uniform monolayer seed coating is required to grow hydrothermally a thin and defect-free NaA zeolite separation layer. In the present study, it was clearly announced that seed coating layer is a key factor to determine the microstructure of NaA zeolite layer, secondary grown on a porous support.

ENI 스퍼터를 이용한 Cu Seed Layer 증착

  • Lee, Bong-Ju;Im, Seon-Taek;Park, Yeong-Chun;Yu, Seok-Jae
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2008.11a
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    • pp.3-4
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    • 2008
  • 로직 디바이스에서는 알루미늄을 대신하여 구리로 backend-of-line(BEOL) 금속화공정이 대체되고 있다. 그러나 메모리 디바이스에서 구리 배선으로의 전환이 쉽지 않다. Cu-seed layer는 구리 배선을 메모리 디바이스에 적용하기 위해서 필요한 gap-fill 확장성을 개선하기 위한 중요한 부분을 차지한다. Cu-seed layer 증착을 위한 향상된 PVD 장비인 Eni 스퍼터를 소개한다.

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Formation of a MnSixOy barrier with Cu-Mn alloy film deposited using PEALD

  • Moon, Dae-Yong;Hwang, Chang-Mook;Park, Jong-Wan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.229-229
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    • 2010
  • With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.

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Effects of Pretreatment of Alkali-degreasing Solution for Cu Seed Layer (약알칼리탈지 용액에서의 구리 Seed 층의 전처리 효과)

  • Lee, Youn-Seoung;Kim, Sung-Soo;Rha, Sa-Kyun
    • Journal of the Korean Vacuum Society
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    • v.21 no.1
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    • pp.6-11
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    • 2012
  • In order to understand a process of contaminants removal on surface of Cu seed layer (Cu seed/Ti/Si) by sputter deposition, we investigated the changed morphology and states of Cu seed surface after pretreatment in alkali degreasing Metex TS-40A solution according to dipping time. After TS-40A pretreatment, the surface morphology with clearer grains was observed by Field emission scanning electron microscope and the changed surface chemical states and impurities on surface of samples were checked by X-ray photoelectron spectroscopy. Dipping time in TS-40A solution had very little effect on surface of Cu seed layer. After pretreatment, much carbons and little oxygens on surface of Cu seed were eliminated and the decrease of peaks corresponded to O=C and $Cu(OH)_2$ was estimated. However, Si content (=silicate) was detected on sample surface. We think that the silicate impurity forms on Cu seed by chemical reaction of TS-40A solution included silicate component. By pretreatment of alkali degreasing Metex TS-40A solution, it showed an excellent effect in removal of O=C and $Cu(OH)_2$ on Cu seed layer, but the silicate was formed on surface of Cu seed. Therefore, another cleaning process such as acid cleaning is required for removal of this silicate in use of this alkali degreasing.

Structures and properties of vacuum-evaporated Zn thin films with various seed layers (진공증착된 Zn박막의 seed layer에 따른 구조와 특성)

  • 민복기;김인성;송재성;이병윤;박경엽;위상봉
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.328-331
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    • 2000
  • The effect of the constituent elements and their composition of the seed layer on the properties of the evaporated Zn thin films was investigated. It was carried out by the analysis of the preferred orientation and the grain size, and the corrosion characteristics. Seed layers were prepared by evaporation of Al and AlCu respectively, and here the Cu content as additives of the source materials of seed layers were designed 5 a/o to 20 a/o. The values of full width at half maximum (FWHM) of the (002) x-ray diffraction peaks of Zn decreased by increasing the amount of the additives on Al seed layer, as a results, the grain sizes also decreased. In order to characteristics of Zn thin films evaporated on the various seed layers, electrical resistivity changes with a function of time at the temperature of 40$^{\circ}C$ and the relative humidity of 80%, as a result, the relative resistivity changes were increased by decreasing the grain size and the FWHM values of (002) peaks of Zn.

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Development of Ice Cream Prepared Lotus(Nelumbo nucifera Gaertner) Leaf and Seeds (연잎과 연자육 아이스크림 개발)

  • Hwang, Eun-Hee;Jung, Su-Young;Jung, Dong-Myuong
    • Korean Journal of Human Ecology
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    • v.21 no.2
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    • pp.377-388
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    • 2012
  • The purpose of this study was to determine the content attributes and sensory characteristics of ice cream flavored with lotus leaf and seeds (Nelumbo nucifera Gaertner). Analysis of freeze dried lotus leaf powder produced the following technical results: Freeze dried lotus leaf powder contained moisture 12.2, crude protein 5.9, crude fat 1.2, crude ash 7.0, crude fiber 13.4g/100mg; raw lotus seed powder contained moisture 65.0, crude protein 8.2, crude fat 0.3, crude ash 1.0, crude fiber 10.8g/100mg; freeze dried lotus seed powder contained moisture 14.0, crude protein 17.1, crude fat 1.9, crude ash 4.0, crude fiber 2.8g/100mg. Lotus seed was processed by 4 methods: freeze dried, roasted, freeze dried peeled inner layer, cooked cut peeled inner layer. Analysis of the color value produced the following technical results: freeze dried lotus leaf powder were L(lightness) 14.5, a(redness) 4.4, b(yellowness) 24.0; freeze dried lotus seed powder L 57.3, a 14.4, b 12.0; roasted lotus seed powder L 52.7, a 22.5, b 11.9; freeze dried lotus seed peeled inner layer L 60.0, a 1.4, b 12.3. Proportional lotus ingredients used for ice cream were 1%, 3%, 5%, 7%, 10% for lotus leaves and 1%, 3%, 5% for lotus seeds. The maximum over run ratio for lotus leaf ice cream was 45.3~56.9% at 20~25 minutes operating time. Over run was significantly decreased by increasing the contents of lotus leaf powder. A maximum over run ratio for lotus seed ice cream was 46.1~54.3% at 20~25 operating time. Over run was not significantly different based on content of lotus leaf versus lotus seed. Sensory evaluation of lotus leaf ice cream produced the following results: the highest score was for color of 4.42 and the lowest score was for sweetness of 3.30. The total mean score significantly decreased by increasing the content of lotus leaf powder. Sensory evaluation of lotus seed ice cream produced the following results: the highest score was for cooked cut peeled inner layer type and the lowest was for freeze dried type 3.86. The sensory scores were not significantly different based on the content of lotus seed. Texture was evaluated highest with a rating of 4.21 and the taste was evaluated lowest with a rating of 3.68 For whole evaluation. This study concluded that lotus leaf ice cream demonstrates relative strength in terms of color and taste, and a relative weakness in terms of over run and sweetness. Suitable content of lotus leaf ranged from 1~5%. The lotus seed processed by the cooked cut peeled inner layer method received a higher rating than dried powder for lotus seed ice cream.

Pd Seed Layer for Electroless Cu Deposition on TaN Diffusion Barrier by Self-Assembled-Monolayer Method(SAM) (Self assembled-monolayer(SAM)법을 이용한 TaN 확산방지막의 무전해 Cu 도금용 Pd seed layer 제조 및 특성)

  • Han, Won-Kyu;Cho, Jin-Ki;Choi, Jae-Woong;Kim, Jeong-Tae;Yeom, Seung-Jin;Kwak, Noh-Jung;Kim, Jin-Woong;Kang, Sung-Goon
    • Korean Journal of Materials Research
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    • v.17 no.9
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    • pp.469-474
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    • 2007
  • Electroless deposition(ELD) was applied to fabricate Cu interconnections on a TaN diffusion barrier with Pd seed layer. The Pd seed layer was obtained by self-assembled monolayer method(SAM) with PDDA and PSS as surfactants. We were able to obtain about 10nm Pd nano particles as seeds for electroless Cu deposition and the density of Pd seeds was much higher than that of Pd seeds fabricated by conventional Pd sensitization-activation method. Also we were able to obtain finer Cu interconnections by ELD. Therefore we concluded that the Pd seed layer by SAM was able to be applied to form Cu interconnection by ELD for under 30nm feature.