• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• Journal of Biomedical Engineering Research
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• v.41 no.5
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• pp.210-218
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• 2020

Vessel sealing is a medical device that converts electrical or ultrasonic energy into thermal energy and leads to seal, coagulate, and cut the vessel by protein modification within the walls or surrounding connective tissues. As most of surgeries have recently been conducted with minimally invasive surgery, the demand and market for vessel sealing are expected to get bigger. However, there is a problem that electrosurgical or ultrasonic surgical is applied and we have a high risk to evaluate the strength of seal, because the collateral and particular standards currently in force follows have not been establish. Therefore, in this study, we investigated some papers studied on the efficacy and safety of the device, the guidance of FDA and test papers previously conducted from 3 individual subject device made in Korea. We found there is a relationship between burst pressure and the performance of the device, therefore, we propose the vascular bursting pressure test for evaluating the safety and performance of the vessel sealing.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.335-341
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• 2011

In this paper, we proposed an automatic packing mechanism of one station concept for fastener objects where the continuous work is performed in a finite space. The proposed packing mechanism is composed of supporting frame, feeding supply, air shower device, clamping/opening device, batch charging device, sealing/cutting device and supply adjusting device. And, these mechanisms have been modularized through mechanical, dynamical, structural and fluid optimized design using the SMO(SimDesigner Motion) analysis module. Also, the virtual prototype was carried out using the 3-D CAD program. The packing process is consisted performed in the order of feeding, clamping, bottom sealing, cutting, opening, object charging, closing and the upper sealing. And the time of these cycles were designed to be completed in 15-20 seconds. This packing mechanism will be created as a prototype in the near future. In addition, it will be applied to the production scenes after going through a field test for the validation of performance.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.11-15
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• 2001

In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.7 no.1
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• pp.1-8
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• 2011

Advanced SITs of the evolutionary PWRs have the advantage that they can passively control the ECC water discharge flow rate. Thus, the LPSI pumps can be eliminated from the safety injection system owing to the benefit of the advanced SITs. In the present study, a passive sealing plate was designed in order to overcome the shortcoming of the advanced SITs, i.e., the early nitrogen discharge through the stand pipe. The operating principle of the sealing plate depends only on the natural phenomena of buoyancy and gravity. The performance of the sealing plate was evaluated using the VAPER test facility, equipped with a full-scale SIT. It was verified that the passive sealing plate effectively prevented the air discharge during the entire duration of the ECC water discharge. Also, the major performance parameters of the advanced SIT were not changed with the installation of the sealing plate.

• International Journal of Naval Architecture and Ocean Engineering
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• v.6 no.3
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• pp.749-761
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• 2014

Tubing adapter is a key connection device in Gas-Tight Deep-Sea Water Sampler (GTWS). The sealing performance of the tubing adapter directly affects the GTWS's overall gas tightness. Tubing adapters with good sealing performance can ensure the transmission of seawater samples without gas leakage and can be repeatedly used. However, the sealing performance of tubing adapters made of different materials was not studied sufficiently. With the research discussed in this paper, the materials match schemes of the tubing adapters were proposed. With non-linear finite element contact analysis and sea trials in the South China Sea, it is expected that the recommended materials match schemes not only meet the requirements of tubing adapters' sealing performance but also provide the feasible options for the following research on tubing adapters in GTWS.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.2
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• pp.57-63
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• 2010

Air curtains are widely used for gates of shopping mall, warehouse, cold stores and refrigerated display cabinets. The purpose of the air curtain is to reduce the infiltration of outdoor air and heat loss from the air conditioning space to ambient air. The discharge angle of air curtain is very important as the sealing efficiency is affected by it. This paper presents a performance of single jet air curtain in heating space when the discharge angle of nozzle changes. A numerical simulation is used to study the influence of various parameters on the efficiency of the downward-blowing air curtain device which is installed inside of the wall above the door. The performance of the air curtain is evaluated by sealing efficiency which provides the assessment of the energy savings. A condition of discharge angle that has the highest sealing efficiency is proposed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.1
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• pp.21-28
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• 2015

A Tsunami damper, which is installed on the outer wall of a nuclear power plant, is usually used as a ventilation window of the machine room, but can serve as a device for preventing flooding of the machine room when large waves flow over the outer wall. The sealing strip, which is inserted between the casing and the blades, plays an important role in maintaining a watertight environment. In this study, in order to ensure an effective watertight performance of the tsunami damper, FE analysis is conducted to compare the contact characteristics of sealing strips with three different section shapes. In the analysis, the casing and the blade of Tsunami damper are assumed to be rigid bodies; the sealing strip is assumed to be a flexible body. The stress, the strain, and the contact pressure are investigated to examine the sealing performance of each model.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.817-820
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• 2001

This machine is a high-vacuum exhaust sealing device which makes the inside of PDP element in high vacuum state, blows inactive gases into it and finally seals it. This machine consists of vacuuming parts, heating parts and exhausting parts. Applying the energy saving technology, this machine improves the temperature uniformity of vacuuming and heating parts.