• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.9
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• pp.1609-1613
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• 2007

(Ba,Sr,Ca)$TiO_3$ powders, which were prepared by sol-gel method using a solution of Ba-, Sr- and Ca-acetate and Ti iso-propoxide, were mixed with organic vehicle and the BSCT thick films were fabricated by the screen-printing techniques on high purity alumina substrates. The structural and dielectirc properties were investigated for various $Dy_2O_3$ doping contents. As a result of thermal analysis, the exothermic peak was observed at around 670^{\circ}C $ due to the formation of the polycrystalline perovskite phase. All BSCT thick films, sintered at $1420^{\circ}C$ for 2h, showed the typical XRD patterns of perovskite polycrystalline structure and no pyrochlore phase was observed. The average grain size of the specimens decreased with increasing amount of $Dy_2O_3$. The average grain size and thickness of the BSCT specimens doped with 0.1 mol% $Dy_2O_3$ were approximately $1.9{\mu}m$ and $70{\mu}m$, respectively. The relative dielectric constant decreased and dielectric loss increased with increasing amount of $Dy_2O_3$, the values of the BSCT thick films doped with 0.1 mol% $Dy_2O_3$ were 3697 and 0.4% at 1 kHz, respectively. The leakage current densities in all BSCT thick films were less than $10^{-9}A/cm^2$ at the applied electric field range of 0-20 kV/cm.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• Journal of Adhesion and Interface
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• v.7 no.3
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• pp.16-25
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• 2006

Water vapour permeable and water resistant film was laminated to made footwear woven fabric and non-woven fabrics by screen type with thermosetting reactive hot melt adhesive. Optimum conditions of each process were investigated, and the properties of film laminated fabric with optimum conditions are evaluated. The results are as follows. Thermosetting reactive polyurethane hot melt is retain proper heat resistance differently thermoplastic hot melt. Optimum melting adhesive process conditions are as follows ; drum temperature $95^{\circ}C$, hose temperature $97^{\circ}C$, feeding pipe temperature $100^{\circ}C$, screen temperature $105^{\circ}C$, pressure of opposite roller $1kgf/cm^2$, pressure of laminating roller $3kgf/cm^2$, finishing speed 15 m/min, melting temperature $120^{\circ}C$, cooling time 20 s, pressing temperature $130^{\circ}C$, pressing time 30 s. As the thickness of film was increased, the water vapour permeability was decreased but water resistance was increased, and the effect of film is dominant over all the others in the air permeability.

• Journal of radiological science and technology
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• v.10 no.1
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• pp.13-23
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• 1987

Author has studied for finding the method of decreasing the radiation dose and increasing diagnostic range in chest X-ray radiography. The study for the added filter thickness from half value layer to 1/8 value layer by decreasing curve and research for the exposure factors, decreasing ratio of radiation dose, ratio of scatter ray and image quality in chest X-ray radiography. The results were as follows: 1. By using the rare earth intensifying screen system at 120 Kvp, the sensitivity is increased by times and the exposure ratio is decreased 0.22 by comparison with the $CaWO_{4}$ intensifying screen system at 80 Kvp. 2. By using Al added filter of 1/8 value layer, the scatter ray is increased more than no filter, But the scatter ray is decreased more in $G_{4}/RxOG$ intensifying system than in LT-II/Rx intensifying system. 3. At 120 Kvp, the image quality value of $G_{4}/RxOG$ system is increased more than LT-II/Rx system compared with slight decreasing image quality value at 80 Kvp. Concluded that by using the added filter could decrease the radiation dose by 1/3 and obtain effective image quality with the added filter at high voltage hard exposure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1092-1098
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• 2006

The influence of the concentration of precursor solution and the number of solution coatings on the densification of the $Pb(Zr_xTi_{1-x})O_3$ (PZT) thick films was studied. PZT powder and PZT precursor solution were prepared by3 sol-gel method and PZT thick films were fabricated by the screen-printing method on the alumina substrates. The composition of powder and precursor solution were PZT(70/30) and PZT(30/70), respectively. The PZT precursor solution was spin-coated on the PZT thick films. A concentration of a coating solution was 0.5 to 2.0 mol/L[M] and the number of coating was repeated from 0 to 6. The XRD patterns of all PZT thick films shelved typical perovskite polycrystalline structure. The porosity of the thick films was decreased with increasing the number of coatings and 6-time coated films with 1.5 M showed the dense microstructure and thickness of about $60{\mu}m$. The relative dielectric constant of the PZT thick film was increased with increasing the number of solution coatings and the thick films with 1.5 M, 6-time coated showed the 698. The remanent polarization the 1.5 M and 6-time coated PZT thick films was $38.3{\mu}C/cm^2$.

• Journal of Mechanical Science and Technology
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• v.19 no.4
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• pp.1044-1051
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• 2005

The isothermal characteristics of a rectangular parallelepiped sodium heat pipe were inves­tigated for high-temperature applications. The heat pipes was made of stainless steel of which the dimension was $140\;m\;(L)\;{\times}\;95m\;(W)\;{\times}\;46 m\;(H)$ and the thickness of the container was 5 mm. Both inner surfaces of evaporator and condenser were covered with screen meshes to help spread the liquid state working fluid. To provide additional path for the working fluid, a lattice structure covered with screen mesh wick was inserted in the heat pipe. The bottom surface of the heat pipe was heated by an electric heater and the top surface was cooled by circulating coolant. The concern in this study was to enhance the temperature uniformity at the bottom surface of the heat pipe while an uneven heat source up to 900 W was in contact. The temperature distribution over the bottom surface was monitored at more than twenty six locations. It was found that the operating performance of the sodium heat pipe was critically affected by the inner wall temperature of the condenser region where the working fluid may be changed to a solid phase unless the temperature was higher than its melting point. The maximum temperature difference across the bottom surface was observed to be $114^{\circ}C$ for 850 W thermal load and $100^{\circ}C$ coolant inlet temperature. The effects of fill charge ratio, coolant inlet temperature and operating temperature on thermal performance of heat pipe were analyzed and discussed.

• Journal of radiological science and technology
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• v.14 no.2
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• pp.15-21
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• 1991

Experiment was conducted on the image quality and exposure dose following replacement of $CaWO_4$ system screen BH-III and BX-III which have so far been used for high-voltage hard-radiation quality radiography, with rare earth system screen KO750, combined with high contrast film SRH, while additional filter was altered, Cu 0.8 mm+Al 1.4 mm(HVL : Al 8.8 mm), Cu 1.3 mm+Al 1.0 mm(HVL : Al 10.6 mm) and Cu 1.8 mm+Al 1.5 mm(HVL : Al 11.4 mm). AS a result, visual evaluation did not detect extreme changes in image quality under the respective condition(HVL : $Al\;8.8\;mm{\sim}Al\;11.4\;mm$). It was noted, however, that surface exposure dose declined with an increase in the thickness of the additional filter, as it was $18.9\;{\mu}Gy$ at HVL Al 8.8 mm, $17.5\;{\mu}Gy$ at Al 10.6 mm and $15.7\;{\mu}Gy$ at Al 11.4 mm. Considering the limited rating of X-ray equipment and wear of machinery, however, the range of $Cu\;1.3\;mm{\sim}1.8\;mm+Al\;1.0\;mm{\sim}1.5\;mm(1/16\;VL{\sim}1/32\;VL)$ seemed to be a limit.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.4
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• pp.349-358
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• 2000

Fabrication and Characterization of Bi$_{2}$/Sr$_{2}$/CaCu$_{2}$/O$_{8}$(Bi2212) superconductor thick films were fabricated successfully on C tapes by liquid reaction between Cu-free precursors of Bi$_{x}$/SrCaO/$_{y}$(x=1.2-2) and Cu tapes. Cu-free Bi-Sr-Ca-O powder mixtures were screen-printed on Cu tapes and heat-treated at 850-87$0^{\circ}C$ for several minutes in air oxygen nitrogen and low oxygen pressure. In order to obtain the optimum heat-treatment condition we studied the effect of the precursor composition the printing thickness and the heat-treatment atmosphere on the superconducting properties of Bi2212 films and the reaction mechanism. Microstructures and phases of thick films were analyzed by films and the reaction mechanism. Microstructures and phases of thick films were analyzed by optical microscope and XRD. The electric properties of superonducting films were examined by the four probe method. At heat-treatment temperature the thick films were in a partially molten state by liquid reaction between CuO of the oxidized copper tape and the precursors which were printed on Cu tapes. During the heat-treatment procedure Bi2212 superconducting particle nucleate and grow in preferred orientations.ons.s.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.8
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• pp.680-684
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• 2007

In this study, we investigated the effects of structural and electrical properties of $(Ba_{0.6},\;Sr_{0.3},\;Ca_{0.1})TiO_3$ thick films with variation $Dy_2O_3$ contents. $(Ba_{0.6},\;Sr_{0.3},\;Ca_{0.1})TiO_3$ powders, prepared by the sol-gel method, were mixed organic vehicle. The BSCT thick films doped with 0.1, 0.3, 0.5, 0.7 mol% $Dy_2O_3$ were fabricated by the screen-printing techniques on the alumina substrates and the structural and dielectric properties were investigated with variation of $Dy_2O_3$ doping contents. All BSCT thick films were sintered at $1420^{\circ}C$, for 2hr. In the TG-DTA analysis, the formation of the polycrystalline perovskite phase was observed at around $670 ^{\circ}C$. In the XRD analysis, all BSCT thick films showed the cubic perovskite structure. The average thickness of BSCT thick films was approximately $65{\mu}m$. The Curie temperature decreased with increasing $Dy_2O_3$ amount. The relative dielectric constant and dielectric loss of BSCT thick films doped with $Dy_2O_3$ 0.1 mol% were 6267 and 2.6 %, respectively.