• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1321-1322
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• 2013

• Transactions of Materials Processing
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• v.13 no.1
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• pp.59-64
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• 2004

Nano-scratch tests were performed on PMMA thin films spin-coated on a Si substrate using an atomic force microscopy (AFM) with loads ranging form 10nN to 100nN. At low loads, a ridge pattern was formed on the PMMA thin film surface. No wear particles were observed during the pattern-forming mild wear. At high loads, severe wear by plowing occurred, accompanied by wear particles. The film with the highest hardness showed the highest wear resistance. Friction force generated during the scratching was measured, which was closely related with surface deformation of the film. A simple empirical equation to deduce scratch hardness of the film from a linear fixed-distance scratch test was proposed, and scratching-speed dependency of the scratch hardness was displayed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.301-302
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• 2010

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.119-120
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• 2008

ILD CMP process has been well accepted for the planarization of the dielectric oxide film and becomes a critical process in ULSI manufacturing due to the rapid shrinkage of the design rule for the device. In total manufacturing process steps for a device, the proportion of ILD CMP process has been gradually increased. Ever since ILD CMP has been introduced, the scratches have been a major defects on polished surfaces which cause the electrical shorts between vias or metal lines [1,2]. It was reported that micro-scratches are caused by large, irregularly shaped particles during CMP process. Therefore, most of the CMP users have used < 5 m POU filter to remove and reduce the scratch source from the slurry. However, the scratch has always been the biggest concern in ILD polishing whatever preventive actions are taken. Silica and ceria slurries are widely used for ILD CMP process. There are not much differences in generated scratches and their formation mechanism. In this study, the scratches were investigated as a function of polishing conditions with possible explanation on formation mechanism in ILD CMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion- usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder type conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usually scraped. Figure 1 shows the typical shape of scratch damaged from diamond. e suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning. so new designed Flat stripper was introduced.

• Biomolecules & Therapeutics
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• v.18 no.3
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• pp.316-320
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• 2010

Pruritus is one of major symptoms in atopic dermatis. The pathophysiological mechanism of pruritus is unclear. The search for pruritogen is important in elucidating the pathophysiological mechanism of pruritus in atopic dermatitis. Glucosylsphingosine (Gsp) is upregulated in the strateum corneum of atopic dermatitis patients. We investigated to determine whether Gsp induces itch-scratch responses (ISRs) in mice. Intradermal administration of Gsp induces ISRs. Gsp dose-dependently induced scratching response at 50-500 nmol/site range. Pretreatment with naltrexone, an opioid $\mu$ receptor antagonist, and capsaicin, a TrpV1 receptor agonist, inhibited Gsp-induced ISRs. Additionally, Gsp-induced ISRs were also suppressed by cyproheptadine, an antagonist of serotonin receptor. These findings suggest that Gsp-induced scratching might be at least partly mediated by capsaicin-sensitive primary afferents, and the opioids receptor systems might be involved in transmission of itch signaling in the central nervous system. Furthermore, our findings suggest that Gsp-induced ISRs may be attributable to the serotonin-mediated pathways and Gsp is not any more one of byproducts of abnormal skin barrier but can lead to induce pruritus, one of typical symptoms of atopic dermatitis.

• Journal of Soil and Groundwater Environment
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• v.6 no.1
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• pp.53-62
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• 2001

Effects of surface defect on thermal stability and stress crack resistance of high density polyethylene geomembranes in environmental conditions were examined by comparing the mechanical properties, chemical resistance and failure times of geomembranes between defective cases under different temperatures. Artificial surface defects were added to the surface of geomembranes by scratch apparatus designed specially. The number of surface defects was increased with the smaller size of scratch induced particles, and the more scratch addition numbers at the shear rate of scratch induced mechanism, 100mm/min. The tensile strength were decreased but the tensile strain was increased with the above conditions. In chemical resistance of defective geomembranes, the tensile strength were decreased but the tensile strain was increased with the longer immersion period and the higher temperature under the same scratch induced conditions. Finally, failure times of defective geomembranes by ESCR test were shifted to the shorter time ranges by increasing temperatures.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.2
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• pp.71-84
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• 2000

A study on adhesion and wear resistance of VC(vanadium carbide) coating on die steels, STD11 and STD61, has been carried out. The VC coating on the die steels was made by immersing them in molten borax bath, a kind of TRD(thermo-reactive deposition and diffusion). Adhesion strength and wear resistance were investigated using scratch test, indentation test and plate-disc test(Ogoshi type) respectively. The influence of sliding distance on the amount of wear has been determined and dominant wear mechanisms has been characterized using optical microscopy, scanning electron microscopy and EDS spectroscopy. The critical adhesion strength($L_c$) between VC coating layer and substrate(STD11) was increased to 60N($L_c$) in the scratch test. In the case of STD61, the strength increased to 24N. The wear resistance of VC coated die steels was excellent because the diffusion layer formed just below the coating layer. The dominant wear mechanism was identified as adhesive wear for VC coating die steels which were worn by combination of cracking and plucking of VC fragments and disc.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1660-1663
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• 2005

Unwanted vibrations are inevitably induced in other directions when pure unidirectional vibration motion is desired for the vertical scratching mechanism. Pure vertical vibration motion of the scratching machine can be obtained by driving identical two motors with symmetrically positioned eccentric unbalance masses. The desired optimal condition for driving pure vertical vibration for the scratching machine is assumed to be the resonance condition in that direction. Imposing the flexibility of the scratching machine in the horizontal direction, we can find out the amount of horizontal vibration component while maintaining the resonance in vertical direction. The desired stiffness in horizontal direction which produces the minimum vibration in horizontal direction are defined which can be used as a guide line to design the supporting structure of the scratching machine.