• Title/Summary/Keyword: reliability growth analysis

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Development of Web-based Quality & Reliability System for Bootstrap on the Internet Environment (인터넷 환경에서 붓스트랩 품질 및 신뢰성 시스템의 개발)

  • Choi Sung woon;Lim In sup
    • Journal of the Korea Safety Management & Science
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    • v.7 no.1
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    • pp.147-157
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    • 2005
  • Recently, growth of internet causes rapid changes in many areas of statistics such as statistical computation and analysis. Especially, bootstrap is the most interesting statistical methods applying computer resampling simulation. In this paper, we try to present how to use a method of bootstrap on the internet. We also develop to user a statistical system which is programed with ASP for user to handle easily in manufacturing system.

The Correlation Study of Factors which effect on Insulation Reliability of Inverter Motor Using Statistical Analysis (통계 분석을 이용한 인버터용 전동기의 절연신뢰성에 영향을 주는 주요 변수의 상관관계 분석)

  • Han, Sang-Seok
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.4
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    • pp.1216-1221
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    • 2010
  • An industrial growth needs high quality of productivity and accuracy. So, the needs of power electronics became pressing. Recently both interest and demand about the technique of power electronics systems has been increased. Though power electronics has a lot of strong point, there are several problems which are harmonic effect, EMI(Electromagnetic Interference), malfunction of electric machinery, harmful effect on human, audible noise and so on. Because these problem are a potent influence on motor, so there needs the manufacture and redesign of motor. The real motors of industrial application have designed and manufactured on the basis of confidence. The study on motor using utility power source was verified sufficient to identify confidence of electric machinery on utility power source. However, a study on confidence is in progress about pulse source by switching device. An advanced company are studying to solve this problem. In this research, it is studied that each variables effecting motor reliability have correlation through experiment and more over forecasting the reliability of motor under inverter operation.

The Study for NHPP Software Reliability Growth Model based on Exponentiated Exponential Distribution (지수화 지수 분포에 의존한 NHPP 소프트웨어 신뢰성장 모형에 관한 연구)

  • Kim, Hee-Cheul
    • Journal of the Korea Society of Computer and Information
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    • v.11 no.5 s.43
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    • pp.9-18
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    • 2006
  • Finite failure NHPP models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, Goel-Okumoto and Yamada-Ohba-Osaki model was reviewed, proposes the exponentiated exponential distribution reliability model, which maked out efficiency substituted for gamma and Weibull model(2 parameter shape illustrated by Gupta and Kundu(2001) Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on SSE, AIC statistics and Kolmogorov distance, for the sake of efficient model, was employed. Analysis of failure using NTDS data set for the sake of proposing shape parameter of the exponentiated exponential distribution was employed. This analysis of failure data compared with the exponentiated exponential distribution model and the existing model (using arithmetic and Laplace trend tests, bias tests) is presented.

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The Study for NHPP Software Reliability Growth Model based on Burr Distribution (Burr 분포를 이용한 NHPP소프트웨어 신뢰성장모형에 관한 연구)

  • Kim, Hee-Cheul;Park, Jong-Goo
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.3
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    • pp.514-522
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    • 2007
  • Finite failure NHPP models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this parer, Goel-Okumoto and Yamada-Ohba-Osaki model was reviewed, proposes the Burr distribution reliability model, which making out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on SSE, AIC statistics and Kolmogorov distance, for the sake of efficient model, was employed. Analysis of failure using real data set for the sake of proposing shape parameter of the Burr distribution was employed. This analysis of failure data compared with the Burr distribution model and the existing model(using arithmetic and Laplace trend tests, bias tests) is presented.

A Study on Factors Influencing the Usage Level and Performance of EDI (EDI 활용수준 및 성과에 영향을 미치는 요인에 관한 연구)

  • Noh, Young;Chung, Yoon
    • Asia pacific journal of information systems
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    • v.11 no.3
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    • pp.105-126
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    • 2001
  • The objective of research is to find out exogenous variables that influence the usage and performance EDI in the Korea firms. Specifically the goals of this research are; (1) to examine relationships between exogenous variables, such as management, technology, inter-firm relationship characteristics, and EDI performance, and (2) to measure EDI volume, EDI diversity, EDI depth among Korea firms. The questionnaire consists of two versions; One for the EDI system managers and the other for the EDI users. The analysis of this study is designed as cross level to examine the causal relationship among variables in different analysis level. The reliability and validity of data was tested by explanatory factor analysis, Cronbach's alpha coefficient, confirmatory factor analysis, and correlation analysis. Also, the structural equation model(SEM) analysis was performed to test the usefulness of the model. The analysis results revealed that education level, IS growth, trust, support, power are major influential variables on the usage level and performance of EDI. Especially, persuasive power turned out to be more important than coercive power, and technical financial support from organizations was also found to be a significant variables.

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Analysis of Void Effects on Mechanical Property of BGA Solder Joint (솔더 접합부에 생성된 Void의 JEDEC 규격과 기계적 특성에 미치는 영향)

  • Lee, Jong-Gun;Kim, Kwang-Seok;Yoon, Jeong-Won;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.1-9
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    • 2011
  • Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

A Study of Infinite Failure NHPP Software Reliability Growth Model base on Record Value Statistics with Gamma Family of Lifetime Distribution (수명분포가 감마족인 기록값 통계량에 기초한 무한고장 NHPP 소프트웨어 신뢰성장 모형에 관한 비교 연구)

  • Kim, Hee-Cheul;Sin, Hyun-Cheul
    • Convergence Security Journal
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    • v.6 no.3
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    • pp.145-153
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    • 2006
  • Infinite failure NHPP models for a record value satisfies mode proposed in the literature exhibit either monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, propose comparative study of software reliability model using Erlang distribution, Rayleigh and Gumbel distribution. Equations to estimate the parameters using maximum likelihood estimation of infinite failure NHPP model based on failure data collected in the form of interfailure times are developed. For the sake of proposing distribution, we used to the special pattern. Analysis of failure data set using arithmetic and Laplace trend tests, goodness-of-fit test, bias tests is presented.

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Study on The Optimal Software Release Time Methodology (소프트웨어 치적 배포시기 결정 방법에 대한 고찰)

  • 이재기;박종대;남상식;김창봉
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.40 no.2
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    • pp.26-37
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    • 2003
  • An optimal software release, which is related to the development cost, error detection and correction under the various operation systems, is a critical factor for managing project. This paper described optimal software release issues to predict the release time of large switching system with the system stability point of view and evaluated a timely supply of target system, proper utilization of resources under the software reliability valuation basis. Finally, Using initial failure data, based on the exponential reliability growth model methodology, optimal release time, and analysis of failure data during the system testing and managing methodologies were presented.

A Comparison Study on Software Testing Efforts (소프트웨어 테스트 노력의 비교 연구)

  • Choe, Gyu-Sik
    • Proceedings of the KIEE Conference
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    • 2003.11c
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    • pp.818-822
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    • 2003
  • We propose a software-reliability growth model incoporating the amount of uniform and Weibull testing efforts during the software testing phase in this paper. The time-dependent behavior of testing effort is described by uniform and Weibull curves. Assuming that the error detection rate to the amount of testing effort spent during the testing phase is proportional to the current error content, the model is formulated by a nonhomogeneous Poisson process. Using this model the method of data analysis for software reliability measurement is developed. The optimum release time is determined by considering how the initial reliability R(x|0) would be. The conditions are $R(x|0)>R_o$, $R_o>R(x|0)>R_o^d$ and $R(x|0)<R_o^d$ for uniform testing efforts. Ideal case is $R_o>R(x|0)>R_o^d$. Likewise, it is $R(x|0){\geq}R_o$, $R_o>R(x|0)>R_o^{\frac{1}{g}$ and $R(x\mid0)<R_o^{\frac{1}{g}}$ for Weibull testing efforts. Ideal case is $R_o>R(x|0)>R_o^{\frac{1}{g}}$.

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The Comparative Study of NHPP Software Reliability Model Based on Log and Exponential Power Intensity Function (로그 및 지수파우어 강도함수를 이용한 NHPP 소프트웨어 무한고장 신뢰도 모형에 관한 비교연구)

  • Yang, Tae-Jin
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.8 no.6
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    • pp.445-452
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    • 2015
  • Software reliability in the software development process is an important issue. Software process improvement helps in finishing with reliable software product. Infinite failure NHPP software reliability models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, proposes the reliability model with log and power intensity function (log linear, log power and exponential power), which made out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on mean square error (MSE) and coefficient of determination($R^2$), for the sake of efficient model, was employed. Analysis of failure, using real data set for the sake of proposing log and power intensity function, was employed. This analysis of failure data compared with log and power intensity function. In order to insurance for the reliability of data, Laplace trend test was employed. In this study, the log type model is also efficient in terms of reliability because it (the coefficient of determination is 70% or more) in the field of the conventional model can be used as an alternative could be confirmed. From this paper, software developers have to consider the growth model by prior knowledge of the software to identify failure modes which can be able to help.