• KSTLE International Journal
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• v.4 no.2
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• pp.43-46
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• 2003

Water-lubricated frictional characteristics of a stainless steel ball bearings are not well known compared to the oil-lubricated frictional characteristics. Furthermore a study on friction at a high temperature is rare because the bearing maintenance strategy for water-lubricated or chemicals-lubricated bearings of equipment is generally based on the replacement of the failed bearings-and parts. Ball bearings and ball screw are installed in the power transmission for the newly developing integral reactor and these are lubricated with chemically-controlled pure water at a high temperature and a high pressure. Bearings and power transmitting mechanical elements for an atomic reactor requires high reliability and high performance during the estimated lifetime, and it should be verified. In this paper, experimental research results of the frictional characteristics for water-lubricated ball bearings are presented as a preliminary investigation.

• Journal of Information Display
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• v.11 no.2
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• pp.39-44
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• 2010

The time dependences of the luminance properties of 55-inch CCFL and LED backlights and 32-inch FFL backlights with LCD panels were investigated during the warm-up time from the cold start. The long-term luminance maintenance curve of a standard CCFL was examined in a time window up to 5000 hours. These two time dependences are important characteristics from the viewpoint of initial picture quality and lifetime reliability, respectively. Empirical equations were suggested for the analysis of the time dependence of these luminance data. These approaches are expected to be helpful in predicting the luminance properties of backlights based on the luminance data obtained in a limited time window.

• Tribology and Lubricants
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• v.20 no.3
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• pp.140-144
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• 2004

Water-lubrication ball bearings are required to install in aqueous medium where water is used as coolant or working fluid. However water-lubricated frictional characteristics of stainless steel ball bearing is not will known compared to oil-lubricated frictional characteristics. Furthermore study on friction at high temperature is rare because bearing maintenance strategy for water-lubricated or chemicals-lubricated bearings of equipment is mostly based on change of failed bearings and parts. Ball bearings and ball screws are used to transmit power in the control rod drive mechanism for an integral reactor and are lubricated with high temperature and high pressure chemically-controlled water. Bearings and power transmitting mechanical elements for a nuclear reactor require high reliability and high performance during estimated lifetime, and their performance should be verified. In this paper, experimental research results of frictional characteristics of water-lubricated ball bearing are reported.

• Computational Structural Engineering
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• v.8 no.3
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• pp.113-122
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• 1995

The purpose of this study is to evaluate performance and safety of structures designed according to current seismic code or provisions (e.g., Uniform Building Code(UBC), NEHRP provisions, etc.) during lifetime of structures. The performance is represented in terns of reliability in this paper. To perform reliability analyses, a large number of time history response analyses for a given structure are usually required. In this study, to perform reliability analyses ground motions are generated based on nonstationary random process and structures are designed based on UBC. In this paper, responses of structures under a given earthquake is evaluated using dynamic nonlinear time history analyses and also an equivalent nonlinear system (ENS) with response scaling factors. The ENS system is described in the companion paper. Therefore, this paper evaluates the seismic performance of structures and also verify the accuracy of ENS.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.22 no.3
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• pp.193-200
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• 2022

In this study, the finite-failure NHPP software reliability model was applied to the software development model based on the Weibull lifetime distribution (Goel-Okumoto, Rayleigh, Type-2 Gumbe), which is widely used in the software reliability field, and then the cost attributes were compared and evaluated. For this study, failure time data detected during normal operation of the software system were collected and used, the most-likelihood estimation (MLE) method was applied to the parameter estimation of the proposed model, and the calculation of the nonlinear equation was solved using the binary method. As a result, first, in the software development model, when the cost of testing per unit time and the cost of removing a single defect increased, the cost increased but the release time did not change, and when the cost of repairing failures detected during normal system operation increased, the cost increased and the release time was also delayed. Second, as a result of comprehensive comparative analysis of the proposed models, it was found that the Type-2 Gumble model was the most efficient model because the development cost was lower and the release time point was relatively faster than the Rayleigh model and the Goel-Okumoto basic model. Third, through this study, the development cost properties of the Weibull distribution model were newly evaluated, and the analyzed data is expected to be utilized as design data that enables software developers to explore the attributes of development cost and release time.

• Journal of Sensor Science and Technology
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• v.33 no.1
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• pp.56-61
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• 2024

The quality of the display can be managed by effectively managing the temperature generated by the panel during use. Conventional display panels rely on an external reference resistor for temperature monitoring. However, this approach is easily affected by external factors such as temperature variations from the driving circuit and chips. These variations reduce reliability, causing complicated mounting owing to the external chip, and cannot monitor the individual pixel temperatures. However, this issue can be simply and efficiently addressed by integrating temperature sensors during the display panel manufacturing process. In this study, we fabricated and analyzed a temperature sensor integrated into an a-IGZO (amorphous indium-gallium-zinc-oxide) TFT array that was to precisely monitor temperature and prevent the deterioration of OLED display pixels. The temperature sensor was positioned on top of the oxide TFT. Simultaneously, it worked as a light shield layer, contributing to the reliability of the oxide. The characteristics of the array with integrated temperature sensors were measured and analyzed while adjusting the temperature in real-time. By integrating a temperature sensor into the TFT array, monitoring the temperature of the display became easier and more accurate. This study could contribute to managing the lifetime of the display.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.25-31
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• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• Journal of the Korea institute for structural maintenance and inspection
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• v.23 no.4
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• pp.37-44
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• 2019

The purpose of this study is to rationally determine the priority of seismic reinforcement of main(key) members of bridges. Cable Supported bridge was selected as the evaluation target and the reliability based on the probability distribution was used to evaluate the seismic fragility of the key members as a quantitative indicator. The safety factor, which is a random variable, is considered an artificial (fixed load and live load) load and a natural (earthquake, wind, temperature, etc.) load. The seismic load is applied as a possible earthquake during the lifetime of the bridge. From analyzing the fragility of each key member based on the seismic reliability, it can be concluded that the shoe (23.8%) was the most fragile, where the other members are ranked as place concrete (20.5%), pier (18.9%), foundation (17.3%) and cable (5.0%) respectively.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.5
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• pp.372-379
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• 2017

Software reliability factor during the software development process is elementary. Case of the infinite failure NHPP for identifying software failure, the occurrence rates per fault (hazard function) have the characteristic point that is constant, increases and decreases. In this paper, we propose a reliability model using the chi - square distribution which depends on the degree of freedom that represents the application efficiency of software reliability. Algorithm to estimate the parameters used to the maximum likelihood estimator and bisection method, a model selection based on the mean square error (MSE) and coefficient of determination($R^2$), for the sake of the efficient model, were employed. For the reliability model using the proposed degree of freedom of the chi - square distribution, the failure analysis using the actual failure interval data was applied. Fault data analysis is compared with the intensity function using the degree of freedom of the chi - square distribution. For the insurance about the reliability of a data, the Laplace trend test was employed. In this study, the chi-square distribution model depends on the degree of freedom, is also efficient about reliability because have the coefficient of determination is 90% or more, in the ground of the basic model, can used as a applied model. From this paper, the software development designer must be applied life distribution by the applied basic knowledge of the software to confirm failure modes which may be applied.