• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.291-296
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• 2010

Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: $10{\mu}m$ sized $Al_2O_3$ powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/$HNO_3$/$CH_3COOH$) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.217-224
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• 2011

of materials and simplification of process. Micro-blasting is one of the promising method for recycling of waste wafer due to their simple and low cost process. Therefore, in this paper, we make recycling wafer through the micro-blaster. A surface etched by micro-blaster forms particles, cracks and pyramid structure. A pyramid structure formed by micro-blaster has a advantage of reflectivity decrease. However, lifetime of minority carrier is decreased by particles and cracks. In order to solve this problems, we carried out the DRE(Damage Romove Etching). There are two ways to DRE process ; wet etching, dry etching. After the DRE process, we measured reflectivity and lifetime of minority carrier. Through these results, we confirmed that a wafer recycled can be used in solar cell.

• Journal of Advanced Navigation Technology
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• v.14 no.3
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• pp.426-431
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• 2010

68% of the manufacturing costs of solar cell wafer can be attributed to the slurry. The recycling of slurries is mandatory for reducing the costs of manufacturing wafering production, and the disposal of industrial waste, as well as for cutting down pollution levels. Slurries are currently being recycled using the centrifuge(decanter) method. However, this method is less than optimal as it does not completely remove the fine particles, leading to low quality. Also, be cause of the incomplete separation from the oil, it causes the impurities in the dried slurries. This study aims to develope a new recycling technology that overcomes the flaws of the centrifuge by utilizing chemicals. It will provide a total solution to the crucial process of recycling slurries in the making of solar cell wafer, by increasing the efficiency and renewable rate.

• Clean Technology
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• v.22 no.4
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• pp.274-280
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• 2016

In this study, it was to develop a chemical method that can recycle the cutting oil which accounts for about 25% of the cost of the process among containing materials of silicon waste sludge generated in the process for producing a solar cell wafer. The 7 types of reagents have been used, including acetone, HCl, NaOH, KOH, $Na_2CO_3$, HF, $CH_2Cl_2$, etc. for this experiment. And It was carried out at a speed of 3000 rpm for 60 minutes centrifugation after performing a reaction with a waste sludge at various concentrations. As a result, the best reagents and conditions for separating the solid such as a silicon powder and a metal powder and liquid cutting oil were identified as 0.3 N NaOH. It is found to be pH 6.05 in a post-processing recycled cutting oil with 0.3 N NaOH after reaction of waste sludge and 0.1 N HCl which is effective to remove metal powder in order to adjust the pH to suit the properties of the weak acid is a commercially available cutting oil and it showed excellent turbidity than when applied to sludge with 0.3 N NaOH alone. The results of FT-IR analysis which can compare the properties of the commercially available cutting oil shows it has a possibility of recycling oil. The cutting oil recovery rate obtained through the experiment was found to be 86.9%.

• Journal of Sensor Science and Technology
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• v.9 no.1
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• pp.70-75
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• 2000

The recycled single crystal silicon wafers have been fabricated into solar cells. It can be a solution for the high cost in materials for solar cells and recycling of materials. So, p-type (100) single crystal silicon wafers with high resistivity of $10-14\;{\Omega}cm$ and the thickness of $650\;{\mu}m$ were used for the fabrication of solar cells. Optimistic conditions of formation of back surface field, surface texturing and anti-reflection coating were studied for getting high efficiency. In addition, thickness variation of solar cell was also studied for increase of efficiency. As a result, the solar cell with efficiency of 10% with a curve fill factor of 0.53 was fabricated with the wafers which have the area of $4\;cm^2$ and thickness of $300\;{\mu}m$. According to above results, recycling possibility of wasted wafers to single crystal silicon solar cells was confirmed.