• Korean Journal of Materials Research
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• v.5 no.8
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• pp.929-935
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• 1995

In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

• Journal of Adhesion and Interface
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• v.3 no.4
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• pp.10-18
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• 2002

Modern plastics are of great importance in many practical applications and their performance can be enhanced by surface modification to improve their hardness, wear and chemical resistance. The object of this study is invention of functional hardening coating materials which are applied to plastic, such as polycarbonate, polymethylmethacylate and acrylonitrilebutadienestyrene. In order to invention of hardening coating materials, we synthesized new silicone acrylate oligomer and prepared coating films containing silicone acrylate oligomer (SAOE) on PC substrate. The curing of coatings is performed by UV-radiation. As results of experiments, The properties of coating films which are contained SAOE is greatly improved in comparison with coating films non-contained SAOE. Especially, when 1 wt% SAOE was introduced into the coating formulation, the UV hardening coatings obtained showed the best surface hardness and gloss.