• 제목/요약/키워드: pumping process

검색결과 203건 처리시간 0.032초

TFT -LCD 구동 IC용 커패시터 내장형 DC-DC 변환기 설계 (A DC-DC Converter Design with Internal Capacitor for TFT-LCD Driver IC)

  • 임규호;강형근;이재형;손기성;조기석;백승면;성관영;이용진;박무훈;하판봉;김영희
    • 한국정보통신학회논문지
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    • 제10권7호
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    • pp.1266-1274
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    • 2006
  • 본 논문에서는 TFT-LCD 구동 IC 모듈의 소형화측면에서 유리한 DC-DC 변환기 회로인 펌핑 커패시터 내장형 비중첩 부스트-클락 전하펌프 (Non-overlap Boosted-Clock Charge Pump: NBCCP) 회로가 제안되었다 .2VDC 전압으로 스윙하는 비중첩 부스트-클럭의 사용으로 기존의 펌핑 커패시터 내장형 크로스-커플드 전하펌프에 비해 펌핑 단의 수를 반으로 줄일 수 있었고, 전하 펌핑 노드의 펌핑된 전하가 입력 단으로 역류되는 현상을 방지하였다 . 그 결과 제안된 펌핑 커패시터 내장형 비중첩 부스트-클럭 전하펌프 회로는 기존의 펌핑 커패시터 내장형 크로스-커플드 전하펌프에 비해 펌핑 전류가 증가하였고, 레이아웃 면적은 감소되었다. 제안된 TFT-LCD 구동 IC용 DC-DC 변환기 회로를 $0.18{\mu}m$ Triple-Well CMOS 공정을 사용하여 설계하고, 테스트 칩을 제작 중에 있다.

내장형 펌핑 커패시터를 사용한 TFT-LCD 구동 IC용 전하펌프 설계 (A Charge Pump Design with Internal Pumping Capacitor for TFT-LCD Driver IC)

  • 임규호;송성영;박정훈;이용진;이천효;이태영;조규삼;박무훈;하판봉;김영희
    • 한국정보통신학회논문지
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    • 제11권10호
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    • pp.1899-1909
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    • 2007
  • 본 논문에서는 TFT-LCD 구동 IC 모듈의 소형화 측면에서 유리한 DC-DC 변환기 회로인 펌핑 커패시터 내장형 크로스-커플드 전하펌프(Cross-Coupled Charge Pump with Internal Pumping Capacitor) 회로가 새롭게 제안되었다. VGH 및 VGL 전하펌프 각각의 입력단과 전하 펌핑 노드를 연결하는 NMOS 및 PMOS 다이오드를 두어, 초기 동작 시 전하 펌핑 노드를 서로 같은 값으로 프리차지하여 대칭 적으로 전하 펌핑을 하도록 하였다. 그리고 첫 번째 전하 펌프의 구조를 다르게 설계하여 펌핑된 전하가 입력단으로 역류되는 현상을 방지하였다. 또한, 펌핑 클럭 구동 드라이버의 위치를 펌핑 커패시터 바로 앞에 두어 기생 저항으로 인한 펌핑 클럭 라인의 전압강하를 방지하여 구동능력을 향상 시켰다. 마지막으로 내장형 펌핑 커패시터를 Stack-MIM 커패시터를 사용하여 기존의 크로스-커플드 전하펌프 보다 레이아웃 면적을 최소화하였다. 제안된 TFT-LCD 구동 IC 용 전하펌프 회로를 $0.13{\mu}m$ Triple-Well DDI 공정을 사용하여 설계하고, 테스트 칩을 제작하여 검증하였다.

LNG 배관 시스템용 1인치 글로브 밸브 개발 및 성능실험 (Development and Performance Test on the 1-Inch Glove Valve for the LNG Piping System)

  • 이중섭;이치우
    • 한국기계가공학회지
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    • 제16권1호
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    • pp.9-16
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    • 2017
  • This study describes the development of a 1-inch cryogenic glove valve for an LNG pumping system and localization development achieved through the performance test. The cryogenic valve used in the LNG pumping system plays an important role in maintaining a flow rate by LNG transportation. This trial manufactured goods, which was achieved through reverse engineering and developing the assembly process. The result of the leak test satisfied the internal pressure condition using the 78-bar normal temperature test and maintained the anti-leakage condition. Also, the result of the cryogenic leak test (BS 6364: low temperature test procedure) maintained anti-leakage at -196 and 52 bar, which satisfied the test standards.

심실의 부하감소 측면에서 좌심실 보조장치의 최적 치료시기 예측을 위한 시뮬레이션 연구 (Prediction of Pumping Efficacy of Left Ventricular Assist Device according to the Severity of Heart Failure: Simulation Study)

  • 김은혜;임기무
    • 한국기계가공학회지
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    • 제12권4호
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    • pp.22-28
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    • 2013
  • It is important to begin left ventricular assist device (LVAD) treatment at appropriate time for heart failure patients who expect cardiac recovery after the therapy. In order to predict the optimal timing of LVAD implantation, we predicted pumping efficacy of LVAD according to the severity of heart failure theoretically. We used LVAD-implanted cardiovascular system model which consist of 8 Windkessel compartments for the simulation study. The time-varying compliance theory was used to simulate ventricular pumping function in the model. The ventricular systolic dysfunction was implemented by increasing the end-systolic ventricular compliance. Using the mathematical model, we predicted cardiac responses such as left ventricular peak pressure, cardiac output, ejection fraction, and stroke work according to the severity of ventricular systolic dysfunction under the treatments of continuous and pulsatile LVAD. Left ventricular peak pressure, which indicates the ventricular loading condition, decreased maximally at the 1st level heart-failure under pulsatile LVAD therapy and 2nd level heart-failure under continuous LVAD therapy. We conclude that optimal timing for pulsatile LVAD treatment is 1st level heart-failure and for continuous LVAD treatment is 2nd level heart-failure when considering LVAD treatment as "bridge to recovery".

Technology Trends in Vacuum Pumping

  • Ormrod, Stephen
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.59-59
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    • 2012
  • Vacuum pumping remains central to the performance and economy of many manufacturing processes, scientific instruments and scientific research. More vacuum is being used in many of the latest or leading edge manufacturing processes: Current examples include 3D semiconductor devices, EUV lithography, 450 mm silicon wafers, AMOLED displays, LEDs, Lithium-ion batteries and steel degassing. In other applications, vacuum pumping technology developments have led to much lower product costs which for example have enabled mass spectrometers to become a ubiquitous tool is life science research. Vacuum pumps have continuously evolved during the past 100 years of vacuum-based industrial processing but remain a key component which is often on the critical path of process and product improvements. This is especially so in the growing number of applications where the pumps are highly stressed. This presentation outlines significant developments in vacuum that have brought about this progress. The likely course of continued improvements is discussed in terms of increased performance and reliability, robust by-product handling, better cost efficiency and reduced environmental impact especially power consumption.

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진공펌프 조합에 의한 반도체공정 진공시스템 진공특성 전산모사 (Simulation of Vacuum Characteristics in Semiconductor Processing Vacuum System by the Combination of Vacuum Pumps)

  • 김형택;김대연
    • 한국전기전자재료학회논문지
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    • 제24권6호
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    • pp.449-457
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    • 2011
  • Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.

Development of a Peristaltic Micropump with Lightweight Piezo-Composite Actuator Membrane Valves

  • Pham, My;Goo, Nam-Seo
    • International Journal of Aeronautical and Space Sciences
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    • 제12권1호
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    • pp.69-77
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    • 2011
  • A peristaltic micropump with lightweight piezo-composite actuator (LIPCA) membrane valves is presented. The micropump contained three cylinder chambers that were connected by microchannels and two active membrane valves. A circular miniature LIPCA was developed and manufactured to be used as actuating diaphragms. The LIPCA diaphragm acted as an active membrane valve that alternate between open and closed positions at the inlet and outlet in order to produce high pumping pressure. In this LIPCA, a lead zirconium titanate ceramic with a thickness of 0.1 mm was used as an active layer. The results confirmed that the actuator produced a large out-of-plane deflection. During the design process, a coupled field analysis was conducted in order to predict the actuating behavior of the LIPCA diaphragm; the behavior of the actuator was investigated from both a theoretical and experimental perspective. The active membrane valve concept was introduced as a means for increasing pumping pressure, and microelectromechanical system techniques were used to fabricate the peristaltic micropump. The pumping performance was analyzed experimentally in terms of the flow rate, pumping pressure and power consumption.

동력경사 상용관의 양해법 설계 (Explicit Design of Commercial Pipe on a Slope with Pumping Power)

  • 유동훈;강찬수
    • 한국수자원학회논문집
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    • 제30권5호
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    • pp.495-501
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    • 1997
  • 펌프동력이 기지 값으로 주어져 있을 때, 유량이나 관경을 산정하는 경우 기존의 방법으로는 상당한 반복과정을 거쳐야 된다. 이에 유동훈과 강찬수(1996)는 균일조도 동력경사관인 경우 유량인 관경을 양해법으로 산정하는 식을 개발한 바 있다. 마찰계수 산정을 위한 지수함수식의 이용은 본 양해법 산정식의 개발을 가능하게 하였다. 유동훈(1995a)은 상용관이나 복합면을 가진 관의 마찰계수 산정을 위한 마찰계수 평균법을 제시한 바 있다. 그와 같은 접근방법으로 본고는 마찰계수 평균법을 상용관 마찰계수 산정식에 적용하여 동력경사 상용관의 유량이나 관경을 양해법으로 구할 수 있는 산정식을 개발하였다.

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단기통 4사이클 스파아크 점화기관 흡.배기 과정의 시뮬레이션 (Simulation of the gas exchange process for single-cylinder 4-stroke cycle spark ignition engine)

  • 윤건식;유병철
    • 오토저널
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    • 제7권1호
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    • pp.24-34
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    • 1985
  • The study of unsteady gas exchange processes in the inlet and exhaust systems of the single-cylinder 4-stroke cycle spark ignition engine is presented in this paper. The generalized method of characteristics including friction, heat transfer, change of flow area and entropy gradients was used for solving the equations defining the gas exchange process. The path line calculation was also conducted to allow for calculation of the gas composition and entropy change along the path lines, and of the variable specific heat due to the change of temperature and composition. As the result of the simulation, the properties at each point in the inlet and exhaust pipe, pressure and temperature in the cylinder, and charging efficiency were obtained. Pumping loss and residual gas fraction were also computed. The effect of engine speed, exhaust and inlet pipe length on the pumping loss and charging efficiency were studied showing that the results were in agreement with what has been known from experiments.

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저전압 DRAM용 VPP Generator 설계 (A VPP Generator Design for a Low Voltage DRAM)

  • 김태훈;이재형;하판봉;김영희
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2007년도 추계종합학술대회
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    • pp.776-780
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    • 2007
  • 본 논문에서는 저전압 DRAM용 VPP Generator의 전하펌프회로(Charge Pump Circuit)를 새롭게 제안하였다. 제안된 전하펌프회로는 2-Stage 크로스 커플 전하펌프회로(Cross-Coupled Charge Pump Circuit)이다. 4개의 비중첩 클럭신호들을 이용하여 전하전달 효율을 향상시켰고, 각 전하펌프단 마다 Oscillation 주기를 줄일 목적으로 Distributed Clock Driver인 Inverter 4개를 추가하여 펌핑전류(Pumping Current)를 증가시켰다. 그리고 전하전달 트랜지스터의 게이트단에 프리차지회로 (Precharge Circuit)를 두어 대기모드진입 시 펌핑된 전하를 방전하지 못하고 고전압을 유지하여 소자의 신뢰성을 떨어트리는 문제를 해결하였다. 모의실험결과 펌핑전류, 펌핑효율(Pumping Efficiency), 파워효율(Power Efficiency) 모두 향상된 것을 확인하였고, $0.18{\mu}m$ Triple-Well 공정을 이용하여 Layout 하였다.

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