• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.221-222
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• 2009

SiN 박막을 Pulsed-PECVD를 이용하여 증착하였다. 박막특성으로는 굴절률, 플라즈마의 특성으로는 이온 에너지 분포를 duty ratio의 함수로 분석하였다. 50-100%의 범위에서 duty ratio의 감소에 따라 고 이온 에너지는 크게 증가하였으며, 반대로 저 이온 에너지는 감소되었다. 굴절률은 duty ratio의 감소에 따라 증가되었으며, 모든 duty ratio의 변화에서 1.75-1.81 사이에서 변화하였다. 40-90%의 duty ratio에서 저 이온 에너지 플럭스보다 고 이온 에너지 플럭스가 높았다. 한편, 굴절률의 변화는 $N_h$의 변화에 가장 밀접하게 연관되어 있음을 확인할 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.309-309
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• 2010

Silicon Nitride(SiN) 박막을 펄스드 플라즈마 응용화학기상법을 이용하여 저 소스전력의 $SiH_4-N_2$ 플라즈마에서 증착하였다. Duty ratio의 변화에 따른 이온에너지와 굴절률의 변화를 고찰하였다. 저이온에너지는 증착률과 강한 상관성을 보였다. 이온에너지 변수의 증착률에의 영향은 신경망 모델을 이용하여 고찰하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.204-205
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• 2011

In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is a most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. For best performance of thin film silicon solar cell, the dopant profiles at p/i and i/n interfaces need to be as sharp as possible. The sharpness of dopant profiles can easily achieved when using multi-chamber PECVD equipment, in which each layer is deposited in separate chamber. However, in a single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of a single-chamber PECVD system in spite of the advantage of lower initial investment cost for the equipment. In order to resolve the cross-contamination problem in single-chamber PECVD systems, flushing method of the chamber with NH3 gas or water vapor after doped layer deposition process has been used. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. A single-chamber VHF-PECVD system was used for superstrate type p-i-n a-Si:H solar cell manufacturing on Asahi-type U FTO glass. A 80 MHz and 20 watts of pulsed RF power was applied to the parallel plate RF cathode at the frequency of 10 kHz and 80% duty ratio. A mixture gas of Ar, H2 and SiH4 was used for i-layer deposition and the deposition pressure was 0.4 Torr. For p and n layer deposition, B2H6 and PH3 was used as doping gas, respectively. The deposition temperature was $250^{\circ}C$ and the total p-i-n layer thickness was about $3500{\AA}$. In order to remove the deposited B inside of the vacuum chamber during p-layer deposition, a high pulsed RF power of about 80 W was applied right after p-layer deposition without SiH4 gas, which is followed by i-layer and n-layer deposition. Finally, Ag was deposited as top electrode. The best initial solar cell efficiency of 9.5 % for test cell area of 0.2 $cm^2$ could be achieved by applying the in-situ plasma cleaning method. The dependence on RF power and treatment time was investigated along with the SIMS analysis of the p-i interface for boron profiles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.206-207
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• 2009

PECVD를 이용하여 상온에서 Silicon nitride 박막을 제조하였다. 그리고 증착 중에 non-invasive ion energy analyzer를 이용하여 이온에너지와 이온에너지 flux룰 측정하였다. PECVD의 소스 파워는 500W, 바이어스 파워 100W으로 고정하고 주파수 250Hz으로 고정된 상태에서 펄스를 인가하여 duty ratio를 30-100%까지 변화시켰다. 작은 duty ratio 범위 (30-70%)에서 duty ratio가 감소할 때, 이온에너지와 이온에너지의 비가 감소하였다. 이 때 감소되는 굴절률은 저이온에너지 변수와 강한 연관성을 지니고 있었다. 굴절률은 1.65-2.46 사이에서 변화하였다.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.249-252
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• 1999

Boriding is one of the chemical method to increase surface hardness as well as carburizing, and nitriding. Gas boriding and boron paste boriding methods were investigated to replace salt bath boriding. Boron paste boriding method is selected due to safety, small waste and low cost. And then boriding is also carried out micro-pulsed PECVD in order to increase efficiency of boriding. Mechanical properties, microstructure, surface concentration, and depth profile of borided layer is investigated by micro-vickers hardness tester, SEM, XRD, and AES.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.25-26
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• 2009

Pulsed-PECVD를 이용하여 상온에서 실리콘 나이트라이드(SiN) 박막을 증착하였다. 본 연구에서는, 60-100%의 duty ratio 변화에 따른 굴절률을 살펴보고, 굴절률에 대한 이온에너지의 영향을 분석했다. RF 소스파워는 900W로 고정하였고 $SiH_4-N_2$를 이용하였다. 이온에너지에 대한 정보는 non-invasive 이온 분석기를 이용하여 수집하였다. 측정된 이온에너지 변수는 high ion energy, low ion energy, high ion energy flux, low ion energy flux이며, 이를 이용해 또 다른 변수인 ion energy flux ratio를 계산하였다. Duty ratio의 감소에 따라 굴절률은 일반적으로 감소하였다. 또한 duty ratio의 감소에 따라 high ion energy는 증가하였다. 한편, 60-80%에서 굴절률은 이온에너지 flux의 비에 강한 의존성을 보였으며, 60%를 제외한 모든 duty ratio 구간에서 굴절률은 Nl에 강하게 영향을 알고 있는 것으로 유추되었다. 굴절률은 1.508와 1.714 사이에서 변화하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.241-242
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• 2009

펄스-플라즈마를 이용하여 상온에서 실리콘나이트라이드 박막을 제조하였다. 증착 중에 이온에너지 분석기를 이용하여 이온에너지와 이온에너지, flux를 측정하였다. Duty ratio는 30~90%까지 변화시키면서, 이온에너지와 굴절률의 관계를 연구하였다. Duty ratio의 감소에 따라 이온에너지는 증가하였다. 낮은 Duty ratio의 범위에서 이온에너지 flux의 변화가 현저하였다. 굴절율은 Duty ratio의 변화에 따라 복잡하게 변화하였지만 $N_h$과의 강한 상관성을 보였다. 전체 Duty ratio의 변화에 대해 굴절률은 1.819에서 1.846으로 미미하게 변화하였다.

• Korean Journal of Metals and Materials
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• v.46 no.1
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• pp.39-43
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• 2008

PSII (Plasma Source Ion Implantation) using high density pulsed ICP source was employed to implant oxygen ions in Si wafer. The PSII technique can achieve a nominal oxygen dose of $3 {\times}10^{17}atoms/cm^2$ in implantation time of about 20min. In order to prevent oxidation of SOI layer during high temperature annealing, the wafer was capped with $2,000{\AA}$ $Si_3N_4 $ by PECVD. Cross-sectional TEM showed that continuous $500{\AA}$ thick buried oxide layer was formed with $300{\AA}$ thick top silicon layer in the sample. This study showed the possibility of SOI fabrication using the plasma source ion implantation with pulsed ICP source.

• Journal of Surface Science and Engineering
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• v.53 no.6
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• pp.306-311
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• 2020

In this work, diamond-like carbon (DLC) films are coated onto plasma nitrided AISI 4140 steel by DC-pulsed PECVD. One problem of DLC films is their very poor adhesion on steel substrates. The purpose of the nitriding was to enhance adhesion between the substrate and the DLC films. The white layer formation is avoided. Plasma nitriding increased adhesion from 8 N for DLC coating to 25 N for duplex coating. Duplex plasma nitriding/DLC coating was proven to be more effective in improving the adhesion. The purpose of the bond layer was to enhance adhesion between the substrate and the DLC films.

• Korean Journal of Materials Research
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• v.10 no.3
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• pp.212-217
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• 2000

Dielectric thin films for TFT(thin film transistor)s, such as silicon nitride$(Si_3N_4)$ and silicon oxide$(SiO_2)$, are usually deposited at $200~300^{\circ}C$. In this study, authors have tried to form dielectric films not by deposition but by oxidation with ECR(Electron Cyclotron Resonance) oxygen plasma, to improve the interface properties was not intensionally heated during oxidation. THe oxidation was performed consecutively without breaking vacuum after the deposition of a-Si: H films on the substrate to prevent the introduction of impurities. In this study, especially pulse mode of microwave power has been firstly tried during FCR oxygen plasma formation. Compared with the case of the continuous wave mode, the oxidation with the pulsed ECR results in higher quality silicon oxide$SiO_X$ films in terms of stoichiometry of bonding, dielectric constants and surface roughness. Especially the surface roughness of the pulsed ECR oxide films dramatically decreased to one-third of that of the continuous wave mode cases.