• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.251-254
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• 1999

A new multi-seeding process for the growth of YBa$_2$Cu$_3$Oxx single crystals was developed. This process introduces an additional heating step to peritectic temperature and a subsequent slow cooling step to the growth temperature following the point when the crystals contacted. The crystal growth was resumed thereafter. The results obtained with this new process were compared with those of the conventional growth process, in which materials were only kept at the growth temperature. It was observed that the liquid phase between crystals were almost completely eliminated, but that Y2ll grains were grown during this new process. There was no significant improvement in trapped magnetic field over the conventional process, which is believed to be due to the cracks generated during the oxygen heat treatment or to the growth of YBa$_2$Cu$_3$Ox grains.

• Transactions of Materials Processing
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• v.12 no.5
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• pp.449-456
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• 2003

Multi-step induction heating process was applied to the powder compact melting technique as a new heating process to achieve pinpoint accuracy, faster cycle time, repeatability, non-contact and energy-efficient heat in a minimal amount of time. The objective of this study is the establishment of the input data diagram of multi step induction heating process for automation of the fabrication process of 6061 Al foams with desired density. At first, proper induction coil was designed to obtain a uniform temperature distribution over the entire cross sectional area of specimen. By using this coil, foaming experiments were performed to investigate the multi-step induction heating conditions such as capacity, temperature and time conditions of each heating and holding step. On the basis of the obtained multi-step induction heating conditions, relationship between final heating temperature and fraction of porosity was investigated.

• Journal of Nutrition and Health
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• v.36 no.10
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• pp.1071-1082
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• 2003

The objective of this study was to evaluate and improve the microbiological quality of HACCP application in school foodservice operations. The microbiological quality of foods and utensils were evaluated two times at each critical control point (CCP) with 3M petrifilm in five Daegu elementary schools. Two processes were evaluated: Heating process and after-heating process. The CCPs of the heating process were receiving, cooking and serving temperatures. The CCPs of the after-heating process were personal hygiene, cross contamination avoidance and serving temperature. After the first experiment, 31 employees of five schools were classroom educated, trained on-site, and pre- and post-tested on HACCP-based sanitation with the goal of improving the microbiological quality of the foodservice. Scores representing knowledge of holding, thawing, washing, food temperature, sanitizing and food-borne illness increased after education. In the heating process, internal food temperatures in the first and second experiments were higher than 74$^{\circ}C$, the holding temperature in the first experiment was less than 6$0^{\circ}C$. In the second experiment, the serving temperature improved to a satisfactory level. The microbiological quality in the second experiment improved by decreasing the time from cooking to serving. In the after-heating process, the ingredients were boiled before being cut in the first experiment. In the second experiment, ingredients were cut before being boiled, improving microbiological quality. Also in the second experiment, cooking just before serving food improved its microbiological quality through time-temperature control. These results strongly suggest it is essential to measure microbiological quality regularly and to educate employees on HACCP continuously, especially time-temperature control and cross contamination avoidance in order to improve foodservice quality.

• Korean Chemical Engineering Research
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• v.53 no.2
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• pp.181-192
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• 2015

The aim of this study is to obtain optimum process condition for using two tower distribution to recycle the waste Propylene Glycol Monomethyl Ether Acetate (PGMEA) that is formed after washing LCD. The optimum process condition for the content of PGMEA, which is dependent variable, at 1st distillation was calculated according to Bottom temperature (BTM temperature), Reflux amount, Feed amount, Feed temperatures, and the optimum process conditions and optimum factors for the content of PGMEA at 2nd distillation according to Bottom temperature (BTM temperature), Reflux amount, Feed amount, Feed temperatures. At 1st distillation, Reflux amount, Feed amount, and Feed temperature are significant variables. However, it is found that the BTM temperature range is not significant in the range of process condition used in this study. The optimum process conditions are based on $5700{\ell}$ of Feed amount, $2500{\ell}$ of Reflux amount, $165^{\circ}C$ of BTM temperature, and $130^{\circ}C$ of Feed temperature. For the this condition, the predicted content of PGMEA was calculated as 92.12~94.62%. Significant factors at 2nd distillation are Reflux amount, Feed amount, and BTM temperature. Multicollinearity is between Reflux amount and BTM temperature. BTM was omitted in the multiple regression equation because there is a strong positive correlation between Reflux amount and BTM temperature. Base on $199^{\circ}C$ of BTM temperature, The optimum process conditions are based on $4275{\ell}$ of Feed amount, $6200{\ell}$ of Reflux amount and $130^{\circ}C$ of Feed temperature. In this condition, the predicted content of PGMEA was calculated as 99.0~99.5%.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.394-397
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• 2004

This paper presents a simple analytic method using 2D simulation program for predications of cutting force and machining temperature in dry type milling process. And also, comparison of cutting force and machining temperature obtained from experiment and simulation work is accomplished to distinguish of suitability.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.46-49
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• 2008

Drawing process of the high carbon steel wire with high speed is usually performed at room temperature using multi pass. Tn the multi pass drawing, temperature rise affects the mechanical properties of the final product. The excessive temperature rise during the deformation promotes the occurrence of delamination, and deteriorates the torsion property and durability of wire. This paper investigates the occurrence of delamination in the wire through the torsion test and the evaluation of wire temperature. The excessive wire temperature ieads to the occurrence of delamination. Based on the calculation of the wire temperature, a new pass schedule, that can prevent the delamination due to the excessive wire temperature rise, is designed through the isothermal pass schedule.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.332-336
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• 2007

Temperature is an essential process variable in nanoimprint lithography(NIL) where the temperature varies between room temperature and above the glass transition temperature. To simulate NIL process, we employ both the Nose-Poincare method for temperature controlled molecular dynamics(MD) and force field for polymer material i.e. polymethyl methacrylate(PMMA), which is most widely selected as NIL resist. Nose-Poincare method, which convinces the conservation of Hamiltonian structure and time-reversal symmetry, overcomes the drawbacks inherent in the conventional methods such as Nose thermostat and Nose-Hoover thermostat. Thus, this method exhibits enhanced numerical stability even when the temperature fluctuation is large. To describe PMMA, we adopt the force field which account for bond stretch, bending, torsion, inversion, partial charge, and van der Waals energy.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.1408-1411
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• 1996

In arc welding processes, because of the complexity and nonlinearity of heat transfer phenomena, it is often difficult to design an effective control system based upon an exact mathematic model. In this paper, we simulated the welding process for various welding conditions and positions to investigate the variations of temperature distribution for those cases. Those will be used as a preinformation for developing quality control system for arc welding process.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.9 s.174
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• pp.41-48
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• 2005

In this study, to improve the formability of the rear floor in series stamping process, the method for predicting the temperature of tools and steel sheet is proposed using FE analysis. To do this, tensile tests and straight pulling friction tests of three steel sheets are carried out at temperatures up to $300^{\circ}C$, and the effect of temperature on the tensile properties and the characteristics of friction are examined. The steel sheets have a higher n-value in the temperature range of about $50^{\circ}C$, and it is related to the maximum uniform elongation. Also, the blue shortness occurs in the temperature range of about $150^{\circ}C$. When the temperature is higher than $200^{\circ}C$, the friction coefficient increase with increasing temperature. From the FE-simulation, the effects of the punch temperature considering heat expansion in the number of stamping are examined and discussed. The technique developed in this study fur estimating tool temperature can be used to develop more feasible ways to improve continuous productivity in series stamping process.