• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1597-1600
• /
• 2005

Recently, the trends of TFT-LCD are large scale and thin thickness, so, the demands of Light Guide Panel(LGP) which is able to substitute for prism sheets are appeared. Functions of LGP obtaining polarization of light of the prism sheet as well as the incidence and reflection of light are demanded. This prismless type LGP to complete functions of the existing LGP and polarization at once must be supported by micro machining technology of LGP surface. In this research, we have used the STAMPER method for the mass product and In-Line process, and the optimized conditions are established by analyzing the cutting force and conditions according to the material and processing properties when the prismless type LGP mold is fabricated. Parameters of the cutting condition were the workpiece and cutting depth.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.10 no.1
• /
• pp.186-193
• /
• 2009

In this paper, we adopted E-MOLD patent technology in order to fabricate Prismless LGP(Light Guide Panel) fur cellular phone and estimate the transcription of injection-molded parts. Then, we manufactured the Ni stamper fur Prismless LGP using MEMS process. And the stamper was installed in the movable heated core which is the key part of a patented mold. Using this mold, we manufactured injection-molded plastic LGP parts with different mold temperatures so that we investigate effect of the temperature on the transcription of the parts. The CAE analysis was also conducted in order to compare with the experimental results. The transcription of LGP parts with various mold temperature displayed $100^{\circ}C$(25.0nm), $140^{\circ}C$(48.4nm), $180^{\circ}C$(52.1nm) and when compared with stamper(521Inm), transcription was superior at $180^{\circ}C$. According to the CAE results, moldability was improved as mold temperature ($50^{\circ}C{\sim}180^{\circ}C$) increased, but when filling time($1{\sim}2sec$) increases, it decreased at $160^{\circ}C$. And transcription and moldability were improved markedly at glass transition temperature($140^{\circ}C$).

• Proceedings of the KAIS Fall Conference
• /
• 2008.11a
• /
• pp.358-361
• /
• 2008

본 논문에서는 열화상촬영기 및 온도분포 해석 프로그램을 이용하여 금형가열온도와 실제 금형온도의 온도편차를 비교하여 금형가열 시 Stamper 표면의 온도분포를 해석하였다. 또한 전열가열방식(E-MOLD)을 이용하여 복합기능 도광판(Prismless LGP)을 제조하였고, 금형온도에 따른 복합기능 도광판(Prismless LGP)의 광특성 평가를 하였다. 그 결과 금형온도가 증가할수록 패턴 전사성 향상으로 인해 휘도 또한 증가하였고, 특히 유리전이온도($140^{\circ}C$) 이상에서 크게 상승하였다.