• The Korean Journal of Food And Nutrition
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• v.15 no.2
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• pp.173-177
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• 2002

The purpose of this study is to investigate the effect of dietary fiber content of rice on the postprandial serum glucose and insulin responses in normal subject. Two rice varieties, Ilpum and Suwon 464 which are different in dietary fiber content, were cooked in pressure cooker and used for the test. The rice with a higher dietary fiber content gave a significantly lower glucose level (p<0.01) and insulin level (p<0.05) than did the normal rice variety. After a meal, the 60-min glucose levels of Suwon 464 and Ilpum were 90.3${\pm}$4.8mg/dl and 111.6${\pm}$2.7mg/dl, respectively. The glycemic index (GI) of Suwon 464 shows 64.5%, which was apparently lower than that of Ilpum. These results indicate that Suwon 464 high in dietary fiber can be useful in low-GI diets.

• Korean Journal of Food Science and Technology
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• v.18 no.4
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• pp.264-269
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• 1986

This study was undertaken to investigate the removal efficiency of heavy metals (Cd, Pb) in rice and wheat flour by cooking and processing. After four times washing of rice grains with water, the removal ratios of cadmium and lead from artificially-contaminated samples were 39.271 and 34.9%, respectively. In cookingof rice grains washed three-times with water, the residue levels of cadmium and lead decreased to 85.7%, 83.0% in electric rice cooker and 74.51%, 72.6% in pressure rice cooker, respectively. No significant difference was observed in the removal of the metals between naturally-contaminated and artificially contaminated rice samples, and between the electric and pressure rice cookers. In baking of artificially-contaminated wheat flour into cookie and loaf bread, the removal ratios of cadmium and lead were negligible as expected. When knife-cut noodle was made from artificially-contaminated wheat flour and boiled in water, 75% of the metals were found in the noodle solids and only 25% of them were removed into the broth.

• Journal of the Korean Burn Society
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• v.22 no.2
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• pp.49-52
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• 2019

Purpose: Little information has been published regarding minor burn injuries in infants, most of which are preventable. To fill this research gap, this study explored the patterns and mechanisms of burn injuries in infants to ascertain whether such incidents can be prevented. Methods: This was a retrospective study, based on data collected prospectively from all infants (<12 months old) admitted to our hospital with burns in the four-year period between January 1, 2015 and December 31, 2018. A medical record review provided basic demographic information, such as age at the time of injury, sex, cause of injury, duration of treatment, operative treatment, and the extent and type of burn, as well as the anatomical region involved. Results: Fifty-seven infants were diagnosed with burn injuries, with scalding being the most common type (47%), followed by contact (32%) and steam (14%). Seven infants of eight steam burn patients injured by pressure cooker. Superficial second degree was the most common depth of injury (72%) followed by first degree (17%) and deep second degree (8%). Average age per injury type was calculated by independent T-test. Average ages of patients with contact and steam burns were significantly lower (7.06 months; P=0.19) and higher (9.25 months; P=0.005), respectively, than for other burn types. Conclusion: Given that infants cannot control their body movements, talk, or manage by themselves, they are entirely dependent on the proper care of adults. Consequently, in addition to the prevention of burns, special care should be taken for the pressure cooker.

• Food Science and Preservation
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• v.30 no.3
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• pp.472-482
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• 2023

This study used gas chromatography combined with the microelectron capture detection method to determine the most effective washing and cooking methods for removing isoprothiolane from rice. The initial isoprothiolane concentrations in brown and polished rice, before washing, were 17.03 mg/kg and 1.67 mg/kg, respectively. Residual concentrations declined with more washing cycles (19.3-59.3% for brown rice; 43.1-66.5% for polished rice); and by increasing the temperature of the washing water from 5℃ to 40℃ (56.6-63.1% for brown rice; 67.1-74.9% for polished rice). Hand-washing samples using gentle stirring or harsh rubbing reduced pesticide concentrations by 63.1-71.6% for brown rice, versus 75.4-87.4% for polished rice. Reduction in isoprothiolane concentrations varied based on the rice cooker type and whether the rice was pre-soaked. Immediate cooking using an electric- or pressure-cooker showed 78.5% and 78.4% reduction in brown rice, compared with 94.0% and 94.0% for polished rice, respectively. Pre-cooking immersion for 30 min showed similar reductions of 83.4% and 83.4% in brown rice, versus 95.8% and 95.8% in polished rice. The results of this study suggest that the most effective method for removing residual isoprothiolane from both brown rice and polished rice was to wash six times (with vigorous rubbing during the 2nd and 3rd washing) in 7-fold water at 40℃, followed by immersion for 30 min before cooking. Regardless of the type of rice cooker, heating is sufficient to remove an average of 83.4% and 95.8% of isoprothiolane from brown rice and polished rice, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.57-62
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• 2008

From the progressing results, it was found that thin film using 52 wt% Ni - 38 wt% Cr - 3 wt% Al - 4 wt% Mn - 3 wt% Si target has good characteristics for low TCR (temperature coefficients of resistance) and high resistivity. The optimum sputtering condition was DC 250 W, 5 mtorr, and 50 sccm and the proper annealing condition was $350^{\circ}C$/3.5 hr in air atmosphere. At these fabricated conditions, thin film resistors with TCR values of less than ${\pm}10ppm/^{\circ}C$ were obtained. The TCR of the packaged-samples made at proper fabrication conditions was $-3{\sim}15ppm/^{\circ}C$ after the thermal cycling and $-20{\sim}180ppm/^{\circ}C$ after PCT (pressure cooker test), we could confirm reliability for the thin film resistor and find the need for enduring research about packaging method.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1450-1451
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• 2008

To investigate the reliability of the conductive lines patterned by ink-jet printing, we evaluated the reliability of the ink-jet printed silver (Ag) patterns according to the guide lines built up as assessments methods in the production of conventional rigid printed circuit boards. The assessment methods include the uniformity of line width and space, adhesive strength, dielectric withstand, solder float, thermal shock test and pressure cooker test (PCT). To prepare assesment vehicles, different regular test patterns were created by Ag ink-jet printing on the same polyimide substrate for each of assessment methods.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.352-356
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• 2007

The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.4
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• pp.853-858
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• 2008

The structures of induction heating type pressure rice cooker are consisted of oven. top heater plate and locking ring. Because the pressure is applied to their structures, those should be necessary to do the safety evaluation. In this paper, structure analysis is performed for oven structures by using finite element method and as a results, optimal thickness is achieved. Especially, analysis fur anisotropic layered material is performed because oven is made of both stainless steel and aluminum. And both von Mises and Tsai-Wu failure criterion are applied for safety factor. Parametric method is used in order to get the optimal thickness for oven and top heater plate.