Development of Ultrasonic Welding Condition for Improvement of Release Film Adhesive Strength in Hot Press Process (열압착 공정에서 이형필름 접착력 향상을 위한 초음파 융착조건 개발)
-
- Proceedings of the Korean Society of Precision Engineering Conference
- /
- 2013.05a
- /
- pp.525-526
- /
- 2013