• Transactions of the Korean hydrogen and new energy society
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• v.29 no.1
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• pp.64-70
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• 2018

In this study, the kg-class Ni-Al alloy fabrication process at low temperature was developed from the physical mixture of Ni and Al powders. The AlCl3 as an activator was used to reduce the temperature of alloy synthesis below the melting temperature of Ni and Al elements (<$500^{\circ}C$). Mixed phase of Ni3Al intermetallic and Ni-Al solid-solution were identified in the XRD pattern analysis. Furthermore, from the analysis of SEM and particle size analyzer, we found that the particle size of synthesized alloy powders was not changed compared to the initial size of Ni particle after the formation of alloy powder at $500^{\circ}C$. In the creep test, the anode (which was fabricated by the prepared Ni-Al alloy powders in this study) displayed the enhanced creep resistance compared to the conventional anode.

• Journal of the Korean Ceramic Society
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• v.47 no.6
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• pp.560-565
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• 2010

Nano laminated bulk $Ti_3SiC_2$ was synthesized by hot press process using TiCx/Si powder mixture at the temperature range of $1300^{\circ}C\sim1500^{\circ}C$. pure $Ti_3SiC_2$ was synthesized by a hot pressing above $1400^{\circ}C$, while unreacted TiCx were remained in bulk $Ti_3SiC_2$ which synthesized below $1400^{\circ}C$. The sintering density of bulk $Ti_3SiC_2$ were varied with the amount of TiCx. It was found that the mechanical properties and micro structures of bulk $Ti_3SiC_2$ were closely related to the amounts of TiCx which was controlled by the hot pressing temperature. The TiCx increase the flexural strength of bulk $Ti_3SiC_2$, while the fracture toughness and thermal shock resistance of bulk $Ti_3SiC_2$ were decreased with the content of TiCx. The plastic deformations of bulk $Ti_3SiC_2$ were appeared above $1000^{\circ}C$.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of Korea Foresty Energy
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• v.24 no.2
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• pp.16-23
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• 2005

The air dried of Epimedium koreanum Nakai was extracted with MeOH and its extractives were concentrated with a vacuum evaporator. The extractives were fractionated with a series of n-hexane, chloroform (${CHCl}_3$), butanol (BuOH), ethyl acetate (EtOAc) and water on a separately funnel. Each fraction was freeze dried to give some dark brown powder. The EtOAc and BuOH soluble fractions were chromatographed on a Sephadex LH-20 column using a series of aqueous methanol and ethanol-n-hexane mixture as eluents. The isolated compounds were tested with a cellulose TLC developed with TBA and 6% acetic acid and then visualized on UV lamp or sprayed with vanillin-HCl-EtOH. The purified compounds were flavonoids and their glycosides, and organic acid as follows : (+)-catechin, icariin, hyperoside, Ikarisoside A and caffeic acid. The structures of each compounds were confirmed by $^1H-NMR,\;^{13}C-NMR$ and Mass spectra. Also, executed qualitative analysis as use GC/MS(Libraries search) about ${CHCl}_3$ soluble compounds of each part.

• Clinical and Experimental Pediatrics
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• v.46 no.11
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• pp.1143-1146
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• 2003

Rickets is a nutritional disorder which is caused either by deficiency of vitamin D or by a defective activation of vitamin D. In these days, even though the incidence of rickets has decreased through adequate nutritional support, we sometimes experience rickets in babies receiving a prolonged special diet as therapy for chronic diarrhea, or those subject to a in receiving the prolonged elimination of milk because of allergy. But there are no reports about rickets caused by absolute elimination of milk because of allergies in Korea. We report here a case of rickets developed after feeding on Sunsik( a mixture of several grain and fruits powder) during a seven months period in an 8-month-old male patient. This male infant manifested vomiting, poor feeding, decreased serum calcium and 25-hydroxycholecalciferol levels, and markedly increased serum alkaline phosphatase and parathyroid hormone levels. Skeletal X-rays showed cupping and fraying in distal metaphyses of radius and ulna, and generalized osteopenia. The patient improved with vitamin D and calcium therapy.

• Journal of the Korean Chemical Society
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• v.21 no.5
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• pp.379-383
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• 1977

Since the organophilic bentonite disperses well in polymer matrix, a composite material of polymer and bentonite was studied for its mechanical properties. To increase the degree of dispersion and the bond in forces to the polymer matrix, bentonite, encapsulated by imidazoline, was used as a filler. Polyethylene powder of particle size of 100 mesh was used, and organophilic bentonite, so-called bentone, whose particle size was 250 mesh was also used in this experiment. V-type mixer was used for mixing and Banbury mixer was used for melt-blending. The sample specimen were made by heating the mixture in the plate press, and the specimen were formed as a sheet, exactly the same as the mold on the plate. Tensile strength, bending strength and compressive strength were studied specially. Tensile strength, elongation rate, bending strength and bending rate at constant pressure were decreased as the filler content increased. Compressive strength was increased as the filler content increased.

• Journal of the Society of Disaster Information
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• v.10 no.4
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• pp.566-571
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• 2014

Recently, with concentrated social and engineering interests on durability, diversified subsequent researches have been progressed. The Chloride-induced corrosion, carbonation, freeze-thaw etc, deterioration factors of concrete act to concrete not privately but complexly, Fly ash is most frequently used admixture which is using a reduction method of deterioration. And the fly ash effects on improvement of durability with enhancement of fluidity, decrease of crack with reduction of hydration heat, promotion of long-age strength and have a economic advantage which replaces cement as a binding material. But, fly ash have different qualities and occasionally reduce the durability and strength by adhesion of AE admixture with unburned carbon powder etc. In this study, the experiments will take about various replacement ratio of fly ash concrete, and will analyze, consider the results, after these will verify applicability and validity as admixture and binding material.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.2
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• pp.121-129
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• 1996

The solubility of Ti in Al matrix was determined by X-ray diffraction method on two different mechanical alloying systems, i.e Al+$Al_3Ti$ and Al+Ti alloys. Starting powder compositions of two systems were chosen for final volume fraction of $Al_3Ti$ phase being 25%. The solubility of Ti in ${\alpha}$-Al was estimated by the lattice parameter measurement of Al. For Al+$Al_3Ti$ mixture, it appeared that some of $Al_3Ti$ particles decomposed during milling and maximum solubility of Ti in Al was about 0.99%. The majority of $Al_3Ti$ particles were dispersed uniformly in Al matrix, having approximate size of 100~200 nm. On the other hand, higher Ti solubility of 1.24 wt.% was found in Al+Ti system, with starting composition of Al+10 wt.%Ti. After 15 hours of milling, Ti phase was identified as 20 nm sized particles embedded in Al matrix. The annealing of mechanically alloyed powders from Al+$Al_3Ti$ and Al+10 wt.%Ti systems was followed in the temperature range of 200 to $600^{\circ}C$ to study thermal stability of supersaturated solution of Al(Ti). After annealing, the lattice parameter of Al reverted back to that of pure Al, and the peak intensity ratio of $Al_3Ti$/Al was increased more than the original value before annealing. These results suggest that Ti dissolve into alpha-Al solutions during milling, and by annealing, $Do_{22}-Al_3Ti$ phase forms from Al(Ti) solution.

• Journal of the Korean Society for Nondestructive Testing
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• v.23 no.1
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• pp.14-20
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• 2003

Piezoelectric ultrasonic transducers for high temperature contact measurement were developed. These high temperature ultrasonic transducers (HTUT) consisted of bismuth titanate piezoceramic element whose Curie temperature is higher than $600^{\circ}C$, a backing material of the mixture of tungsten powder and inorganic binder, an inner alumina tube, a wear Plate and a housing. The operational frequencies or the HTUT were 1.04 and 2.08 MHz, respectively. Various commercially available couplants for high temperature were evaluated and compared. As a couplant for high temperature ultrasonic testing between HTUT and test specimen, gold epoxy was selected. The peak amplitude of pulse-echo signals from steel test specimen decreased with increasing temperature. The operational temperature of the HTUT reached up to $500^{\circ}C$ at which the continuous contact measurement was possible.

• Korean journal of food and cookery science
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• v.25 no.3
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• pp.317-329
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• 2009

In the study, we determined the optimal ingredient mixing ratio for the preparation of sponge cake containing bamboo (Pseudosasa japonica Makino) leaves. This experiment was designed in according with the D-optimal design of mixture design, which involved 14 experimental points including 4 replicates for three independent variables (sugar 110${\sim}$129%, bamboo leaves 3${\sim}$8%, oil 10${\sim}$25%). The results the F-test, specific gravity, volume and color values (L, a, b) decided a linear model, while the viscosity, hardness and sensory characteristics (color, smell, taste, texture and overall acceptance) decided a quadratic model. The results of our fitness analysis demonstrated that in all characteristic, the probabilities were significant within 0.05%; thus, the models were accepted as appropriate. The response surface and trace plot results demonstrated that increasing amounts of added bamboo leaves induced a reduction in brightness, and increasing redness and yellowness. In addition, increasing amounts of bamboo leaves caused increases in hardness, and thus the softness of the cake decreased. And as the level of added oil increased, softness increased. Cake samples received low sensory evaluation scores when sugar, bamboo leaves, and oil were added above their optimal levels. In the numeric optimization, the optimal ingredient amounts were 121.36% sugar, 4.96% bamboo leaves, and 15.69% oil. The above results demonstrate the feasibility of adding bamboo leaves to sponge cake, and therefore, a bamboo leaves as a functional food.