• 펄프종이기술
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• 제38권5호
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• pp.24-30
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• 2006

This study was performed to characterize inverse emulsion type cationic polyacrylamide (PAM) and to compare with powder and salt dispersion type PAMs as a retention and drainage aid. Salt dispersion type PAM has defects of high amount of salt which increases conductivity of white water, low active polymer contents and relatively worse retention and drainage properties than others because of its low molecular weight. Powder type PAM has benefit of high active polymer contents and good retention and drainage properties, but defects of low dissolution speed and insoluble particle generation were observed. However, inverse emulsion type showed the best retention and drainage aids among them by controlling molecular weight and morphology easily and it had relatively higher active polymer contents and better solubility.

• 펄프종이기술
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• 제46권1호
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• pp.39-45
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• 2014

Various approaches have been tried to reduce the emission of carbon dioxide in paper industry. One of important approaches is to use PCC manufactured from emission gas as a filler. However, it was recognized that PCC is inferior to other fillers in the paper strength properties of view. Therefore, pretreatment of PCC with pulp powder was tried to mitigate the strength reduction of paper. Pretreatment of PCC with pulp powder improved the bulk(7.4~12.9%) and air permeability(24.8~42.98%), but there is no significant change in opacity. Tensile index, burst index and stiffness were decreased by the use of pretreated PCC with pulp powder. Anionic and cationic PAM were used as a additive for PCC pretreatment in order to improve strength properties. There was no significant change in bulk in all kinds of PAM used in this study. Most strength properties were improved by the pretreatment of PCC with the anionic and cationic PAM and pulp powder, although the opacity and stiffness were more or less decreased.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 추계학술대회 논문집
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• pp.55-58
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• 2003

We fabricated the textured Ni substrate and evaluated the effects of processing variables on microstructural evolution and texture transformation. Ni-rods as an initial specimen were prepared by two different methods, i.e., powder metallurgy(P/M) and plasma arc melting(PAM) The texture of the substrate was characterized by pole-figure and surface condition was evaluated by atomic force microscopy. It was observed that the texture of substrate made by P/M did not significantly varied with annealing temperature of 800~120$0^{\circ}C$ and the full-width at half-maximums (FWHM) of both in-plane and out-of-plane were 9$^{\circ}$~10$^{\circ}$. On the other hand, the texture of substrate made by PAM was more dependent on the annealing temperature and the FWHMs of in-plane texture was 9$^{\circ}$~13$^{\circ}$ at the temperature range. In addition, twin texture, (221)＜221＞, was formed as the temperature increased further. The grain size of substrate made by P/M was smaller than that made by PAM and this difference was correlated to the microstructure of initial specimens.

• Progress in Superconductivity
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• 제5권1호
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• pp.70-74
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• 2003

We fabricated cube textured Ni substrate for YBCO coated conductor and evaluated the effects of processing parameters on microstructural evolution and texture formation. Ni-rods as an initial specimen were prepared by two different methods, i.e., powder metallurgy(PM) and plasma arc melting(PAM). Subsequently, the rods were cold rolled to 100 $\mu\textrm{m}$ thick substrate and annealed at temperatures of $700∼1200^{\circ}C$. The texture of the substrate was characterized by pole-figure. It was observed that the texture of substrate made by P/M did not significantly varied with annealing temperature of 600∼$l100^{\circ}C$ and the full-width at half-maximums (FWHM) of both in-plane and out-of-plane were 9$^{\circ}$∼$10^{\circ}$. On the other hand, the texture of substrate made by PAM was more dependent on the annealing temperature and the corresponding values were $9^{\circ}$ ∼$13^{\circ}$ at the temperature range. In addition, recrystallization twin texture, (221)＜221＞, was formed as the temperature increased further. OM profiles showed that the grain size of substrate made by P/M was smaller than that made by PAM and this difference was correlated to the microstructure of initial specimens.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2003년도 High Temperature Superconductivity Vol.XIII
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• pp.64-64
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• 2003

• 한국식품영양과학회지
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• 제34권2호
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• pp.298-305
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• 2005

과채류 포장용 기능성 항균포장지는 항균력이 우수한 식물성 항균소재(botanical antimicrobial agent-grapefruit seed extract mixture: BAAG)의 CaCO$_3$분말제재와 가스흡착제 기능을 소유한 제올라이트를 일정배합비율로 펄프지료에 첨가하여 TAPPI Standard Method T200 sp-96에 의거하여 제조하였다. 아울러, 보류향상제인 cationlc polyacrylamide (Ca-PAM)와 발수처리제 alkyl ketone dimer(AKD)도 같이 첨가하였다. 이때, 사용된 BAAG분말의 평균입자크기는 12.45였으며, Scanning Electron Microscope 촬영사진에서 CaCO$_3$에 침착되어 있는 BAAG 및 제올라이트가 육면체 형태의 미세한 분말로 지료상에 구성되어 있음을 알 수 있었으며, 포장원지내에 보류된 항균제의 보유량을 회분함량으로 측정한 결과, 항균제의 첨가량을 증가시킬수록 회분함량이 증가하는 것으로 미루어 Ca-PAM이 지료 섬유 네트워크내에 항균제를 정착시키는데 매우 효과적인 보류향상제로 작용함을 알 수 있었다. 한편, 분말형 항균제와 제올라이트를 지료에 첨가하여 포장원지를 제조하였을 때, 포장원지의 인장강도(tensile strength)와 파열강도(burst strength)는 항균제와 제올라이트를 첨가하지 않았을 때보다 다소 감소하는 경향을 나타내었고, 반면에 강성(stiffness)과 인열강도(tear strength)는 증가하는 경향을 나타내었다. 그러나, 기능성 첨가제 분말의 첨가로 인하여 발생할 수 있는 골판지 상자의 라이너나 단위 포장용(itempackaging)포장지의 강도적 성질의 감소현상이 미미할 것으로 판단되어 항균포장지 제조에 사용되는 항균제와 제올라이트분말은 종이의 물성 열화에 미치는 영향이 크지 않는 것으로 나타났다.