• 한국응용과학기술학회지
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• 제27권4호
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• pp.531-538
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• 2010

The electrochemistry characterization of metal is important in many industrial applications. In this study, we investigated the C-V diagrams related to the electrochemistry characterization of nickel. We determined electrochemical measurement by using cyclic voltammetry with a three electrode system. A measuring range was reduced from initial potential to -1350mV, continuously oxidized to 1650mV and measured to the initial point. The scan rate were 100, 150, 200 and 200mV/s. As a result, the C-V characterization of nickel using ethanolamine and ethylethanolamine inhibitor appeared irreversible process caused by the oxidation current from the cyclic voltammogram. After adding ethanolamine compound additive, adsorption film constituted, and the passive phenomena happened. According to the results by cyclic voltammetry method, it was revealed that the effect of the electrochemistry characterization of nickel depends on ethanolamine structure interaction to adsorption complex.

• 대한치과보철학회지
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• 제49권1호
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• pp.65-72
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• 2011

연구 목적: 이 연구의 목적은 티타늄 지대주와 비귀금속 보철물이 접촉한 경우를 가정하여 이종 금속간 접촉에 의한 갈바닉 부식으로 인해 발생하는 표면 거칠기 변화를 비교, 평가하고자 하였다. 연구 재료 및 방법: 성분과 조성이 다른 3종의 Ni-Cr합금 (T3, Bella bond plus, Tilite)과 cp 티타늄 Grade 2를 이용하여 $13{\times}13{\times}1.5\;mm$의 크기로 시편을 각 군당 6개씩 제작하였다. 연마과정 후 절연 테이프로 직경 6 mm만을 노출시켜 potentiostat (Parastat 2273A)를 이용하여 동전위 분극 시험과 갈바닉 부식 시험을 시행하였으며, 표면 거칠기 측정기(Surftester SV-3000)를 이용하여 부식 전 후 거칠기를 평가하였다. 측정값을 paired t-test와 One-way ANOVA로 분석하였다. 결과: 티타늄과 접촉한 모든 Ni-Cr 시편의 표면 거칠기는 통계적으로 유의하게 증가하였다. 증가량은 베릴륨을 포함한 T3합금 ($0.016{\pm}.007\;{\mu}m$)이 가장 컸으며, 베릴륨을 포함하지 않은 Bella bond plus ($0.012{\pm}.003\;{\mu}m$), 티타늄을 첨가한 Tilite ($0.012{\pm}.002\;{\mu}m$)는 큰 차이를 보이지 않았다. 금속 종류에 따른 거칠기 증가는 유의한 차이를 보이지 않았다. 결론: 티타늄과 접촉한 비귀금속 합금은 갈바닉 부식에 의해 표면 거칠기가 증가하였다.

• 한국응용과학기술학회지
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• 제28권1호
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• pp.48-56
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• 2011

In this study, we investigated the C-V diagrams and metal surface related to the electrochemistry characterization of metal(nickel, SUS-304). We determined electrochemical measurement by using cyclic voltammetry with a three-electrode system. A measuring range was reduced from initial potential to -1350mV, continuously oxidized to 1650 mV and measured to the initial point. The scan rate were 50, 100, 150, 200 and 250 mV/s. As a result, the C-V characterization of metal using N,N-dimethylacetamide and N,N-dimethylformamide inhibitors appeared irreversible process caused by the oxidation current from the cyclic voltammogram. After adding organic corrosion inhibitors, adsorption film constituted, and the passive phenomena happened. According to the results by cyclic voltammetry method, it was revealed that the addition of inhibitors containing amide functional group enhances the corrosion resistance properties.

• Bulletin of the Korean Chemical Society
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• 제17권7호
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• pp.612-616
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• 1996

The new 1,2-dithiolene, 1,4-butanediyldithioethylene-1,2-dithiolate (BDDT2-), has been isolated. In addition, new monoanionic bis-complexes with nickel and copper have been prepared and characterized. In order to investigate the detailed electronic structure of the metal complexes of the new ligand, BDDT2-, in terms of the oxidation state of the central metal ions, we have carried out molecular orbital (MO) calculations of Ni(BDDT)2-and Cu(BDDT)2- utilizing an Extended Huckel method. Cyclic voltammetry data for both complexes were obtained with a potentiostat. We have also compared these results to the previously synthesized Ni(PDDT)2-, Ni(DDDT)2-,Cu(PDDT)2-, and Cu(DDDT)2-.

• 한국수소및신에너지학회논문집
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• 제6권2호
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• pp.65-73
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• 1995

Negative electrode was prepared by mixing $Ti_{0.7}Zr_{0.3}Cr_{0.3}Mn_{0.3}V_{0.6}Ni_{0.8}$ alloy powder with copper or nickel powder and pressing in the air. The cycled electrodes were analyzed with SEM, potentiostat and electrochemical impedance spectroscopy. It was found that the Cu-compacted electrode showed better low temperature dischargeability and higher rate capability than Ni-compacted electrode. From SEM analysis of the cycled electrode compacted with copper powder, it was observed that the surface of MH particles was covered with copper grains and whisker precipitated from electrolyte after dissolution during cell test. It is found that the improved electrode characteristics are attributed to the copper layer on MH particles deposited by dissolution and precipitation(DP) process.

• 한국응용과학기술학회지
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• 제27권3호
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• pp.361-369
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• 2010

A study on the corrosion inhibition of metals is important in many industrial applications (carbon steel, copper, aluminum, SUS 304, nickel). In this study, we investigated the C-V diagrams related to the surface corrosion of metals. It was observed through the SEM that the surface corrosion state of the various metals had the corrosion potential by the scan rate and the organic inhibitor containing an amine group. We determined to measure cyclic voltammetry using the three-electrode system. The measurement of oxidation and reduction ranged from -1350mV to 1650mV. The scan rate was 50, 100, 150, and 200mV/s. It turned out that the C-V characterization of SUS 304 was irreversible process caused by the oxidation current from the cyclic voltammogram. After adding organic inhibitors, the adsorption film was constituted, and the passive phenomena happened. As a result, it was revealed that the inhibition effect of metal corrosion depends on the molecular interaction, and the interaction has influence on the adsorption complex.