• 한국생물공학회:학술대회논문집
• /
• 2003.10a
• /
• pp.690-690
• /
• 2003

• Proceedings of the Korean Vacuum Society Conference
• /
• 1998.06a
• /
• pp.111-111
• /
• 1998

• Proceedings of the Korean Ceranic Society Conference
• /
• 2003.10a
• /
• pp.142.1-142
• /
• 2003

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.08a
• /
• pp.144.3-144
• /
• 1998

• Proceedings of the Korean Magnestics Society Conference
• /
• 2014.11a
• /
• pp.59-60
• /
• 2014

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.5 no.3
• /
• pp.299-305
• /
• 1995

Visible photoluminescing (PL) silicon at room temperature has been prepared by a dry technique, that is, by spark processing, contrary to anodically etched porous silicon. PL peak maximum of photoluminescing spark processed Si was shifted to blue 520 nm. The stability of spark processed Si towards degradation upon UV radiation was found to be extremely high. Results from high resolution TEM, XRD and XPS studies suggest that spark processed silicon involves minute nanocrystalline (polycrystalline) particles which are imbedded in an amorphous matrix, preferably $SiO_2$.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.34D no.7
• /
• pp.30-36
• /
• 1997

Bump bonded piezoesistive silicon accelerometer was fabricated by the porous silicon micromachining and th eprocess technique of integrated circuit. The output voltage of the accelerometer fabricated on (111)-oreiented Si substrates with n/n$^{+}$n triple layers showed good linear characteristic of less than 1%. The measured sensitivity and the resonant frequency was about 743 .mu.V/g and 2.04 kHz, respectively. And the transverse sensitivity of 5.2% was measured from the accelerometer. Also, to investigate an influence on the output characteristics of the sensor due to bump bonding, the values of the piezoresistors were measured through thermal-cycling test in the temperature variation form -50 to 120.deg. C. Then, there was 0.014% resistance changes about 3.61 k.ohm., so sthe output charcteristics of the sensor was less affected by bump bonding.g.

• Journal of Sensor Science and Technology
• /
• v.1 no.2
• /
• pp.183-194
• /
• 1992

Some silicon micromechanical structures useful in sensors and actuators have been fabricated by electropolishing or porous silicon formation technique by anodic reaction in HF solution. The microstructures were lightly doped single crystal silicon and the formation was isotropic independent of crystal directions. Porous silicon layer(PSL) was formed selectively in $n^{+}$ region of $n^{+}/n$ silicon structure by anodic reaction in concentrated HF(20-48%) solution. Characteristics of the formed PSL were investigated along with change of the reaction voltage, HF concentration and the reaction time. PSL was formed only in $n^{+}$ region. The porosity of the PSL was decreased with the increase of HF concentration and independent of reaction voltage. For the case of $n/n^{+}/n$ structures, the etched surface of silicon was fairly smooth and a cusp was not found. The thickness of the microstructures was the same as that of the epitaxial n-Si layer and good uniformity. We have fabricated acceleration sensors by anodic reaction in HF solution(5 wt%) and planar technology. The process was compatible with conventional It fabrication technique. Various micromechanical structures, such as rotors of motor, gears and linear actuator, were also fabricated by the technique and examined by SEM photographs.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.59.1-59.1
• /
• 2015

In the Linford group at Brigham Young University we have recently developed three new sets of materials for three different areas of separations science: thin layer chromatography (TLC), high performance liquid chromatography (HPLC), and solid phase microextraction (SPME). First, via microfabrication we have grown patterned carbon nanotube (CNT) forests on planar substrates that we have infiltrated with inorganic materials such as silicon nitride. The coatings on the CNTs are conformal and typically deposited in a process like low pressure chemical vapor deposition. The resulting materials have high surface areas, are porous, and function as effective separation devices, where separations on our new TLC plates are typically significantly faster than on conventional devices. Second, we used the layer-by-layer (electrostatically driven) deposition of poly (allylamine) and nanodiamond onto carbonized poly (divinylbenzene) microspheres to create superficially porous particles for HPLC. Many interesting classes of molecules have been separated with these particles, including various cannabinoids, pesticides, tricyclic antidepressants, etc. Third, we have developed new materials for SPME by sputtering silicon onto cylindrical fiber substrates in a way that creates shadowing of the incoming flux so that materials with high porosity are obtained. These materials are currently outperforming their commercial counterparts. Throughout this work, the new materials we have made have been characterized by X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectrometry, scanning electron microscopy, transmission electron microscopy, etc.

• Korean Journal of Materials Research
• /
• v.6 no.5
• /
• pp.489-493
• /
• 1996

다공질 실리콘층(Porous Silicon LayerLPSL)을 사용하여 저온 열산화 (50$0^{\circ}C$, 1시간)와 급속 열산화공정(rapid thermal oxidationLRTO)(115$0^{\circ}C$, 1분)을 통하여 저온 산화막을 제조하였다. 제조된 산화막의 특성을 IR흡수 스펙트럼, C-V 곡선, 절연파괴전압, 누설전류, 그리고 굴절률을 조사함으로써 알아보았다. 절연파괴전압은 2.7MV/cm, 누설전류는 0-50V 범위에서 100-500pA의 값을 보였다. 산화막의 굴절률은 1.49의 값으로서 열산화막의 굴절률에 근접한 값을 나타냈다. 이 결과로부터 다공질 실리콘층을 저온산화막으로 제조할 때, RTO공정이 산화막의 치밀화(densification)에 크게 기여함을 알 수 있었다.